EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32, LCC-32
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Atmel (Microchip) |
| package instruction | QCCN, LCC32,.45X.55 |
| Reach Compliance Code | compliant |
| Maximum access time | 250 ns |
| command user interface | NO |
| Data polling | YES |
| JESD-30 code | R-CQCC-N32 |
| JESD-609 code | e0 |
| memory density | 65536 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 8192 words |
| character code | 8000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 8KX8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC32,.45X.55 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Programming voltage | 5 V |
| Certification status | Not Qualified |
| ready/busy | YES |
| Maximum standby current | 0.003 A |
| Maximum slew rate | 0.045 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| switch bit | NO |
| Maximum write cycle time (tWC) | 0.2 ms |
| AT28C64F-25LI | AT28C64-25FI | AT28C64-25LI | AT28C64X-25LI | AT28C64E-25FI | AT28C64E-25LI | AT28C64F-25FI | |
|---|---|---|---|---|---|---|---|
| Description | EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32, LCC-32 | EEPROM, 8KX8, 250ns, Parallel, CMOS, CDFP28, FP-28 | EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32, LCC-32 | EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32 | EEPROM, 8KX8, 250ns, Parallel, CMOS, CDFP28, FP-28 | EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32, LCC-32 | EEPROM, 8KX8, 250ns, Parallel, CMOS, CDFP28, FP-28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | QCCN, LCC32,.45X.55 | DFP, FL28,.4 | QCCN, LCC32,.45X.55 | QCCN, LCC32,.45X.55 | DFP, FL28,.4 | QCCN, LCC32,.45X.55 | DFP, FL28,.4 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| Maximum access time | 250 ns | 250 ns | 250 ns | 250 ns | 250 ns | 250 ns | 250 ns |
| command user interface | NO | NO | NO | NO | NO | NO | NO |
| Data polling | YES | YES | YES | YES | YES | YES | YES |
| JESD-30 code | R-CQCC-N32 | R-CDFP-F28 | R-CQCC-N32 | R-XQCC-N32 | R-CDFP-F28 | R-CQCC-N32 | R-CDFP-F28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 32 | 28 | 32 | 32 | 28 | 32 | 28 |
| word count | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| character code | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN | DFP | QCCN | QCCN | DFP | QCCN | DFP |
| Encapsulate equivalent code | LCC32,.45X.55 | FL28,.4 | LCC32,.45X.55 | LCC32,.45X.55 | FL28,.4 | LCC32,.45X.55 | FL28,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | FLATPACK | CHIP CARRIER | CHIP CARRIER | FLATPACK | CHIP CARRIER | FLATPACK |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.003 A | 0.003 A | 0.003 A | 0.003 A | 0.003 A | 0.003 A | 0.003 A |
| Maximum slew rate | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | FLAT | NO LEAD | NO LEAD | FLAT | NO LEAD | FLAT |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | DUAL | QUAD | QUAD | DUAL | QUAD | DUAL |
| switch bit | NO | NO | NO | NO | NO | NO | NO |
| Maker | Atmel (Microchip) | - | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| Number of functions | 1 | 1 | 1 | - | 1 | 1 | 1 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Programming voltage | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| ready/busy | YES | YES | YES | - | YES | YES | YES |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
| Maximum write cycle time (tWC) | 0.2 ms | 1 ms | 1 ms | - | 0.2 ms | 0.2 ms | 0.2 ms |
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