IDT7006L45FB datasheet, PDF - EEWORLD Datasheet

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IDT7006L45FB: DescriptionMulti-Port SRAM, 16KX8, 45ns, CMOS, CQFP68, QFP-68; Categorystorage storage; File Size179KB，20 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT7006L45FB Overview

Multi-Port SRAM, 16KX8, 45ns, CMOS, CQFP68, QFP-68

IDT7006L45FB Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	QFP
package instruction	QFF, QFL68,.95SQ
Contacts	68
Reach Compliance Code	not_compliant
ECCN code	3A001.A.2.C
Maximum access time	45 ns
Other features	INTERRUPT FLAG; ARBITER; SEMAPHORE
I/O type	COMMON
JESD-30 code	S-CQFP-F68
JESD-609 code	e0
length	24.0792 mm
memory density	131072 bit
Memory IC Type	MULTI-PORT SRAM
memory width	8
Number of functions	1
Number of ports	2
Number of terminals	68
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFF
Encapsulate equivalent code	QFL68,.95SQ
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	3.683 mm
Maximum standby current	0.004 A
Minimum standby current	2 V
Maximum slew rate	0.34 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	24.0792 mm

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HIGH-SPEED

16K x 8 DUAL-PORT

STATIC RAM

Features

◆

IDT7006S/L

◆

Functional Block Diagram

R/W

True Dual-Ported memory cells which allow simultaneous

reads of the same memory location

High-speed access

– Military: 20/25/35/55/70ns (max.)

– Industrial: 55ns (max.)

– Commercial: 15/17/20/25/35/55ns (max.)

Low-power operation

– IDT7006S

Active: 750mW (typ.)

Standby: 5mW (typ.)

– IDT7006L

Active: 700mW (typ.)

Standby: 1mW (typ.)

IDT7006 easily expands data bus width to 16 bits or more

using the Master/Slave select when cascading more than

one device

◆

M/S = H for

BUSY

output flag on Master,

M/S = L for

BUSY

input on Slave

Busy and Interrupt Flags

On-chip port arbitration logic

Full on-chip hardware support of semaphore signaling

between ports

Fully asynchronous operation from either port

Devices are capable of withstanding greater than 2001V

electrostatic discharge

Battery backup operation—2V data retention

TTL-compatible, single 5V (±10%) power supply

Available in 68-pin PGA, quad flatpack, PLCC, and a 64-pin

TQFP

Industrial temperature range (–40°C to +85°C) is available

for selected speeds

Green parts available, see ordering information

R/W

I/O

- I/O

I/O

Control

BUSY

13L

(1,2)

I/O

-I/O

I/O

Control

BUSY

(1,2)

Address

Decoder

MEMORY

ARRAY

Address

Decoder

13R

R/W

ARBITRATION

INTERRUPT

SEMAPHORE

LOGIC

R/W

SEM

(2)

INT

NOTES:

1. (MASTER):

BUSY

is output; (SLAVE):

BUSY

is input.

BUSY

outputs and

INT

outputs are non-tri-stated push-pull.

M/S

SEM

(2)

INT

2739 drw 01

OCTOBER 2008

DSC- 2739/16

IDT7006L45FB Related Products

	IDT7006L45FB	IDT7007L20JGI	IDT7007L20JGI8	IDT7006L25PFG	IDT7007L15JG8
Description	Multi-Port SRAM, 16KX8, 45ns, CMOS, CQFP68, QFP-68	Dual-Port SRAM, 32KX8, 20ns, CMOS, PQCC68, 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, LCC-68	Multi-Port SRAM, 32KX8, 20ns, CMOS, PPGA68	Dual-Port SRAM, 16KX8, 25ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-64	Multi-Port SRAM, 32KX8, 15ns, CMOS, PPGA68
Is it lead-free?	Contains lead	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	incompatible	conform to	conform to	conform to	conform to
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
package instruction	QFF, QFL68,.95SQ	QCCJ, PGA68,11X11	PGA, PGA68,11X11	LQFP, QFP64,.6SQ,32	PGA, PGA68,11X11
Reach Compliance Code	not_compliant	compliant	compliant	compliant	compliant
ECCN code	3A001.A.2.C	EAR99	EAR99	EAR99	EAR99
Maximum access time	45 ns	20 ns	20 ns	25 ns	15 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-CQFP-F68	S-PQCC-J68	S-PPGA-P68	S-PQFP-G64	S-PPGA-P68
JESD-609 code	e0	e3	e3	e3	e3
memory density	131072 bit	262144 bit	262144 bit	131072 bit	262144 bit
Memory IC Type	MULTI-PORT SRAM	DUAL-PORT SRAM	MULTI-PORT SRAM	DUAL-PORT SRAM	MULTI-PORT SRAM
memory width	8	8	8	8	8
Number of ports	2	2	2	2	2
Number of terminals	68	68	68	64	68
word count	16384 words	32768 words	32768 words	16384 words	32768 words
character code	16000	32000	32000	16000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	85 °C	85 °C	70 °C	70 °C
Minimum operating temperature	-55 °C	-40 °C	-40 °C	-	-
organize	16KX8	32KX8	32KX8	16KX8	32KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFF	QCCJ	PGA	LQFP	PGA
Encapsulate equivalent code	QFL68,.95SQ	PGA68,11X11	PGA68,11X11	QFP64,.6SQ,32	PGA68,11X11
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	CHIP CARRIER	GRID ARRAY	FLATPACK, LOW PROFILE	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	260	260	260	260
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.004 A	0.01 A	0.01 A	0.0015 A	0.005 A
Minimum standby current	2 V	4.5 V	4.5 V	2 V	4.5 V
Maximum slew rate	0.34 mA	0.275 mA	0.275 mA	0.22 mA	0.285 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Matte Tin (Sn) - annealed	Matte Tin (Sn)	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed
Terminal form	FLAT	J BEND	PIN/PEG	GULL WING	PIN/PEG
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	0.8 mm	2.54 mm
Terminal location	QUAD	QUAD	PERPENDICULAR	QUAD	PERPENDICULAR
Maximum time at peak reflow temperature	30	30	30	30	30
Parts packaging code	QFP	LCC	-	QFP	-
Contacts	68	68	-	64	-
length	24.0792 mm	24.2062 mm	-	14 mm	-
Number of functions	1	1	-	1	-
Maximum seat height	3.683 mm	4.572 mm	-	1.6 mm	-
Maximum supply voltage (Vsup)	5.5 V	5.5 V	-	5.5 V	-
Minimum supply voltage (Vsup)	4.5 V	4.5 V	-	4.5 V	-
width	24.0792 mm	24.2062 mm	-	14 mm	-
Humidity sensitivity level	-	1	-	3	1
Base Number Matches	-	1	1	1	-

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