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MX29F002BPI-70

Description
Flash, 256KX8, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Categorystorage    storage   
File Size908KB,49 Pages
ManufacturerMacronix
Websitehttp://www.macronix.com/en-us/Pages/default.aspx
Download Datasheet Parametric Compare View All

MX29F002BPI-70 Overview

Flash, 256KX8, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32

MX29F002BPI-70 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMacronix
Parts packaging codeDIP
package instructionDIP, DIP32,.6
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time70 ns
startup blockBOTTOM
command user interfaceYES
Data pollingYES
Durability100000 Write/Erase Cycles
JESD-30 codeR-PDIP-T32
JESD-609 codee0
length41.91 mm
memory density2097152 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size1,2,1,3
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height4.9 mm
Department size16K,8K,32K,64K
Maximum standby current0.000005 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width15.24 mm
MX29F002/002N
2M-BIT [256K x 8] CMOS FLASH MEMORY
FEATURES
262,144x 8 only
Fast access time: 55/70/90/120ns
Low power consumption
- 30mA maximum active current(5MHz)
- 1uA typical standby current
Programming and erasing voltage 5V ± 10%
Command register architecture
- Byte Programming (7us typical)
- Sector Erase (16K-Byte x1, 8K-Byte x 2, 32K-Byte
x1, and 64K-Byte x 3)
Auto Erase (chip & sector) and Auto Program
- Automatically erase any combination of sectors or the
whole chip with Erase Suspend capability.
- Automatically programs and verifies data at specified
address
Erase Suspend/Erase Resume
- Suspends an erase operation to read data from, or
program data to, a sector that is not being erased, then
resumes the erase operation.
Status Reply
- Data polling & Toggle bit for detection of program and
erase cycle completion.
Sector protection
- Hardware method to disable any combination of
sectors from program or erase operations
- Sector protect/unprotect for 5V only system or 5V/
12V system
100,000 minimum erase/program cycles
Latch-up protected to 100mA from -1 to VCC+1V
Boot Code Sector Architecture
- T = Top Boot Sector
- B = Bottom Boot Sector
Hardware RESET pin(only for 29F002T/B)
- Resets internal state machine to read mode
Low VCC write inhibit is equal to or less than 3.2V
Package type:
- 32-pin PDIP
- 32-pin PLCC
- 32-pin TSOP (Type 1)
20 years data retention
GENERAL DESCRIPTION
The MX29F002T/B is a 2-mega bit Flash memory organ-
ized as 256K bytes of 8 bits only. MXIC's Flash memories
offer the most cost-effective and reliable read/write non-
volatile random access memory. The MX29F002T/B is
packaged in 32-pin PDIP,PLCC and 32-pin TSOP(I). It is
designed to be reprogrammed and erased in-system or in-
standard EPROM programmers.
The standard MX29F002T/B offers access time as fast as
55ns, allowing operation of high-speed microprocessors
without wait states. To eliminate bus contention, the
MX29F002T/B has separate chip enable (CE) and output
enable (OE) controls.
MXIC's Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
MX29F002T/B uses a command register to manage this
functionality. The command register allows for 100% TTL
level control inputs and fixed power supply levels during
erase and programming, while maintaining maximum
EPROM compatibility.
MXIC's Flash technology reliably stores memory contents
even after 100,000 erase and program cycles. The MXIC
cell is designed to optimize the erase and programming
mechanisms. In addition, the combination of advanced
tunnel oxide processing and low internal electric fields for
erase and programming operations produces reliable
cycling. The MX29F002T/B uses a 5.0V ± 10% VCC
supply to perform the High Reliability Erase and auto
Program/Erase algorithms.
The highest degree of latch-up protection is achieved with
MXIC's proprietary non-epi process. Latch-up protection
is proved for stresses up to 100 milliamps on address and
data pin from -1V to VCC + 1V.
P/N: PM0547
1
REV. 1.1, JUN. 14, 2001

MX29F002BPI-70 Related Products

MX29F002BPI-70 MX29F002BTI-70
Description Flash, 256KX8, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Flash, 256KX8, 70ns, PDSO32, 8 X 20 MM, MO-142, PLASTIC, TSOP1-32
Is it Rohs certified? incompatible incompatible
Maker Macronix Macronix
Parts packaging code DIP TSOP1
package instruction DIP, DIP32,.6 TSOP1, TSSOP32,.8,20
Contacts 32 32
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
Maximum access time 70 ns 70 ns
startup block BOTTOM BOTTOM
command user interface YES YES
Data polling YES YES
Durability 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 code R-PDIP-T32 R-PDSO-G32
JESD-609 code e0 e0
length 41.91 mm 18.4 mm
memory density 2097152 bit 2097152 bit
Memory IC Type FLASH FLASH
memory width 8 8
Number of functions 1 1
Number of departments/size 1,2,1,3 1,2,1,3
Number of terminals 32 32
word count 262144 words 262144 words
character code 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
organize 256KX8 256KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP TSOP1
Encapsulate equivalent code DIP32,.6 TSSOP32,.8,20
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V
Programming voltage 5 V 5 V
Certification status Not Qualified Not Qualified
Maximum seat height 4.9 mm 1.2 mm
Department size 16K,8K,32K,64K 16K,8K,32K,64K
Maximum standby current 0.000005 A 0.000005 A
Maximum slew rate 0.05 mA 0.05 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount NO YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING
Terminal pitch 2.54 mm 0.5 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
switch bit YES YES
type NOR TYPE NOR TYPE
width 15.24 mm 8 mm

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