Telephone Multifunction Circuit, PDSO24, SO-24
| Parameter Name | Attribute value |
| Maker | Atmel (Microchip) |
| Parts packaging code | SOIC |
| package instruction | SOP, |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDSO-G24 |
| length | 15.425 mm |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 75 °C |
| Minimum operating temperature | -25 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Certification status | Not Qualified |
| Maximum seat height | 2.6 mm |
| surface mount | YES |
| Telecom integrated circuit types | TELEPHONE MULTIFUNCTION CIRCUIT |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| width | 7.4 mm |





| U4037B-MFLG3 | |
|---|---|
| Description | Telephone Multifunction Circuit, PDSO24, SO-24 |
| Maker | Atmel (Microchip) |
| Parts packaging code | SOIC |
| package instruction | SOP, |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDSO-G24 |
| length | 15.425 mm |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 75 °C |
| Minimum operating temperature | -25 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Certification status | Not Qualified |
| Maximum seat height | 2.6 mm |
| surface mount | YES |
| Telecom integrated circuit types | TELEPHONE MULTIFUNCTION CIRCUIT |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| width | 7.4 mm |