DM74ALS689J/A+ datasheet, PDF - EEWORLD Datasheet

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DM74ALS689J/A+: DescriptionIC,IDENTITY COMPARATOR,ALS-TTL,DIP,20PIN,CERAMIC; Categorylogic logic; File Size164KB，3 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM74ALS689J/A+ Overview

IC,IDENTITY COMPARATOR,ALS-TTL,DIP,20PIN,CERAMIC

DM74ALS689J/A+ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP20,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T20
JESD-609 code	e0
Logic integrated circuit type	IDENTITY COMPARATOR
Number of terminals	20
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

DM74ALS689J/A+ Related Products

	DM74ALS689J/A+	DM54ALS689J	DM74ALS689WM/A+	DM74ALS689WM/B+	DM74ALS689N/A+
Description	IC,IDENTITY COMPARATOR,ALS-TTL,DIP,20PIN,CERAMIC	IC,IDENTITY COMPARATOR,ALS-TTL,DIP,20PIN,CERAMIC	IC,IDENTITY COMPARATOR,ALS-TTL,SOP,20PIN,PLASTIC	IC,IDENTITY COMPARATOR,ALS-TTL,SOP,20PIN,PLASTIC	IC,IDENTITY COMPARATOR,ALS-TTL,DIP,20PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP, DIP20,.3	DIP, DIP20,.3	SOP, SOP20,.4	SOP, SOP20,.4	DIP, DIP20,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T20	R-XDIP-T20	R-PDSO-G20	R-PDSO-G20	R-PDIP-T20
JESD-609 code	e0	e0	e0	e0	e0
Logic integrated circuit type	IDENTITY COMPARATOR	IDENTITY COMPARATOR	IDENTITY COMPARATOR	IDENTITY COMPARATOR	IDENTITY COMPARATOR
Number of terminals	20	20	20	20	20
Maximum operating temperature	70 °C	125 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	SOP	DIP
Encapsulate equivalent code	DIP20,.3	DIP20,.3	SOP20,.4	SOP20,.4	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES	NO
technology	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL

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