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SN74HC679NP1

Description
IC,ADDRESS COMPARATOR,HC-CMOS,DIP,20PIN,PLASTIC
Categorylogic    logic   
File Size279KB,6 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

SN74HC679NP1 Overview

IC,ADDRESS COMPARATOR,HC-CMOS,DIP,20PIN,PLASTIC

SN74HC679NP1 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDIP, DIP20,.3
Reach Compliance Codenot_compliant
JESD-30 codeR-PDIP-T20
Logic integrated circuit typeADDRESS COMPARATOR
Number of terminals20
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP20,.3
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

SN74HC679NP1 Related Products

SN74HC679NP1 SN74HC679DW3 SN74HC679N1 SN74HC679N3 SN74HC679NP3
Description IC,ADDRESS COMPARATOR,HC-CMOS,DIP,20PIN,PLASTIC IC,ADDRESS COMPARATOR,HC-CMOS,SOP,20PIN,PLASTIC IC,ADDRESS COMPARATOR,HC-CMOS,DIP,20PIN,PLASTIC IC,ADDRESS COMPARATOR,HC-CMOS,DIP,20PIN,PLASTIC IC,ADDRESS COMPARATOR,HC-CMOS,DIP,20PIN,PLASTIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
package instruction DIP, DIP20,.3 SOP, SOP20,.4 DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant
JESD-30 code R-PDIP-T20 R-PDSO-G20 R-PDIP-T20 R-PDIP-T20 R-PDIP-T20
Logic integrated circuit type ADDRESS COMPARATOR ADDRESS COMPARATOR ADDRESS COMPARATOR ADDRESS COMPARATOR ADDRESS COMPARATOR
Number of terminals 20 20 20 20 20
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP DIP DIP DIP
Encapsulate equivalent code DIP20,.3 SOP20,.4 DIP20,.3 DIP20,.3 DIP20,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE
surface mount NO YES NO NO NO
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
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