CA82C55A-8ID datasheet, PDF - EEWORLD Datasheet

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CA82C55A-8ID: DescriptionParallel IO Port, CMOS, CDIP40,; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，18 Pages; ManufacturerTundra Semiconductor Corp

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CA82C55A-8ID Overview

Parallel IO Port, CMOS, CDIP40,

CA82C55A-8ID Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Tundra Semiconductor Corp
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T40
JESD-609 code	e0
Number of terminals	40
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	10 mA
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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CA82C55A-8ID Related Products

	CA82C55A-8ID	CA82C55A-10CD	CA82C55A-10ID	CA82C55A-8CD	CA82C55A-5CD	CA82C55A-8ED	CA82C55A-10ED	CA82C55A-5ED	CA82C55A-5ID
Description	Parallel IO Port, CMOS, CDIP40,	Parallel IO Port, CMOS, CDIP40,	Parallel IO Port, CMOS, CDIP40,	Parallel IO Port, CMOS, CDIP40,	Parallel IO Port, CMOS, CDIP40,	Parallel IO Port, CMOS, CDIP40,	Parallel IO Port, CMOS, CDIP40,	Parallel IO Port, CMOS, CDIP40,	Parallel IO Port, CMOS, CDIP40,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
Number of terminals	40	40	40	40	40	40	40	40	40
Maximum operating temperature	85 °C	70 °C	85 °C	70 °C	70 °C	125 °C	125 °C	125 °C	85 °C
Minimum operating temperature	-40 °C	-	-40 °C	-	-	-55 °C	-55 °C	-55 °C	-40 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	10 mA	10 mA	10 mA	10 mA	10 mA	10 mA	10 mA	10 mA	10 mA
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	MILITARY	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	Tundra Semiconductor Corp	Tundra Semiconductor Corp	Tundra Semiconductor Corp	-	-	Tundra Semiconductor Corp	Tundra Semiconductor Corp	Tundra Semiconductor Corp	Tundra Semiconductor Corp

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