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BAV99_NL

Description
Rectifier Diode, 2 Element, 0.2A, 70V V(RRM), Silicon, SOT-23, 3 PIN
CategoryDiscrete semiconductor    diode   
File Size45KB,4 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
Environmental Compliance  
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BAV99_NL Overview

Rectifier Diode, 2 Element, 0.2A, 70V V(RRM), Silicon, SOT-23, 3 PIN

BAV99_NL Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerFairchild
Parts packaging codeSOT-23
package instructionR-PDSO-G3
Contacts3
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresULTRA FAST
ConfigurationSERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)1.3 V
JESD-30 codeR-PDSO-G3
JESD-609 codee3
Humidity sensitivity level1
Number of components2
Number of terminals3
Maximum operating temperature175 °C
Maximum output current0.2 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Maximum power dissipation0.35 W
Certification statusNot Qualified
Maximum repetitive peak reverse voltage70 V
Maximum reverse recovery time0.006 µs
surface mountYES
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED

BAV99_NL Preview

BAV99
BAV99
Connection Diagram
3
3
3
A7
2
1
1
2
1
2
SOT-23
Small Signal Diode
Absolute Maximum Ratings*
Symbol
V
RRM
I
F(AV)
I
FSM
T
A
= 25°C unless otherwise noted
Parameter
Maximum Repetitive Reverse Voltage
Average Rectified Forward Current
Non-repetitive Peak Forward Surge Current
Pulse width = 1.0 second
Pulse width = 1.0 microsecond
Storage Temperature Range
Operating Junction Temperature
Value
70
200
1.0
2.0
-55 to +150
150
Units
V
mA
A
A
°C
°C
T
stg
T
J
*
These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1)
These ratings are based on a maximum junction temperature of 150 degrees C.
2)
These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Thermal Characteristics
Symbol
P
D
R
θJA
Power Dissipation
Thermal Resistance, Junction to Ambient
Parameter
Value
350
357
Units
mW
°C/W
Electrical Characteristics
Symbol
V
R
V
F
T
A
= 25°C unless otherwise noted
Parameter
Breakdown Voltage
Forward Voltage
Test Conditions
I
R
= 100
µA
I
F
= 1.0 mA
I
F
= 10 mA
I
F
= 50 mA
I
F
= 150 mA
V
R
= 70 V
V
R
= 25 V, T
A
= 150°C
V
R
= 70 V, T
A
= 150°C
V
R
= 0, f = 1.0 MHz
I
F
= I
R
= 10 mA, I
RR
= 1.0 mA,
R
L
= 100Ω
Min
70
Max
715
855
1.0
1.25
2.5
30
50
1.5
6.0
Units
V
mV
mV
V
V
µA
µA
µA
pF
ns
I
R
Reverse Current
C
T
t
rr
Total Capacitance
Reverse Recovery Time
2001
Fairchild Semiconductor Corporation
BAV99, Rev. B
BAV99
Small Signal Diode
(continued)
Typical Characteristics
150
Ta= 25
°
C
300
Ta= 25
°
C
Reverse Voltage, V
R
[V]
Reverse Current, I
R
[nA]
1
2
3
5
10
20
30
50
100
140
250
200
130
150
120
100
50
110
0
Reverse Current, I
R
[uA]
10
20
30
50
70
100
Reverse Voltage, V
R
[V]
Figure 1. Reverse Voltage vs Reverse Current
BV - 1.0 to 100uA
Figure 2. Reverse Current vs Reverse Voltage
IR - 10 to 100 V
Ta= 25
°
C
700
450
Ta= 25
°
C
Forward Voltage, V
F
[mV]
Forward Voltage, V
F
[mV]
650
400
600
350
550
300
500
250
450
1
2
3
5
10
20
30
50
100
0.1
0.2
0.3
0.5
1
2
3
5
10
Forward Current, I
F
[uA]
Forward Current, I
F
[mA]
Figure 3. Forward Voltage vs Forward Current
VF - 1.0 to 100 uA
Figure 4. Forward Voltage vs Forward Current
VF - 0.1 to 10 mA
1.3
Ta= 25
°
C
Ta= 25
°
C
Forward Voltage, V
F
[V]
Total Capacitance [pF]
10
20
30
50
100
200
300
500
1.4
1.2
1.2
1.0
1.1
0.8
0.6
1.0
0
2
4
6
8
10
12
14
Forw ard C urrent, I
F
[m A ]
R everse V oltage [V ]
Figure 5. Forward Voltage vs Forward Current
VF - 10 - 800 mA
Figure 6. Total Capacitance vs Reverse Voltage
BAV99, Rev. B
BAV99
Small Signal Diode
(continued)
Typical Characteristics
(continued)
4.0
400
Ta= 25
°
C
Reverse Recovery Time [nS]
3.5
300
3.0
Current [mA]
2.5
200
I
F
(A V
)
-A
VE
RA
GE
2.0
RE
CT
100
IF IE
DC
UR
R
1.5
0
EN
T-
mA
150
1.0
10
20
30
40
50
60
0
50
100
o
Reverse Current [mA]
Ambient Temperature, T
A
[ C]
Figure 7. Reverse Recovery Time
vs Reverse Current
TRR - IR 10 mA vs 60 mA
Figure 8. Average Rectified Current (I
F(AV)
)
versus Ambient Temperature (T
A
)
500
Power Dissipation, P [mW ]
D
400
DO -35 P kg
300
SO T-23 P kg
200
100
0
0
50
100
150
o
200
Average Tem perature, I
O
[ C ]
Figure 9. Power Derating Curve
BAV99, Rev. B
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
DenseTrench™
DOME™
EcoSPARK™
E
2
CMOS
TM
EnSigna
TM
FACT™
FACT Quiet Series™
DISCLAIMER
FAST
®
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
ISOPLANAR™
LittleFET™
MicroFET™
MicroPak™
MICROWIRE™
OPTOLOGIC™
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerTrench
®
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SILENT SWITCHER
®
SMART START™
STAR*POWER™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
TruTranslation™
UHC™
UltraFET
®
VCX™
STAR*POWER is used under license
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
2. A critical component is any component of a life
systems which, (a) are intended for surgical implant into
support device or system whose failure to perform can
the body, or (b) support or sustain life, or (c) whose
be reasonably expected to cause the failure of the life
failure to perform when properly used in accordance
support device or system, or to affect its safety or
with instructions for use provided in the labeling, can be
effectiveness.
reasonably expected to result in significant injury to the
user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Advance Information
Product Status
Formative or
In Design
Definition
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. H4

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