FIFO, 2KX9, 50ns, Asynchronous, CMOS, CDIP32, CERDIP-32
| Parameter Name | Attribute value |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 50 ns |
| Other features | RETRANSMIT |
| period time | 65 ns |
| JESD-30 code | R-GDIP-T32 |
| JESD-609 code | e0 |
| length | 41.91 mm |
| memory density | 18432 bit |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 2KX9 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| Maximum seat height | 5.334 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| 5962-9161801MXA | 5962-9161802MXA | |
|---|---|---|
| Description | FIFO, 2KX9, 50ns, Asynchronous, CMOS, CDIP32, CERDIP-32 | FIFO, 2KX9, 40ns, Asynchronous, CMOS, CDIP32, CERDIP-32 |
| Parts packaging code | DIP | DIP |
| package instruction | DIP, | DIP, |
| Contacts | 32 | 32 |
| Reach Compliance Code | unknown | unknow |
| ECCN code | EAR99 | EAR99 |
| Maximum access time | 50 ns | 40 ns |
| Other features | RETRANSMIT | RETRANSMIT |
| period time | 65 ns | 50 ns |
| JESD-30 code | R-GDIP-T32 | R-GDIP-T32 |
| JESD-609 code | e0 | e0 |
| length | 41.91 mm | 41.91 mm |
| memory density | 18432 bit | 18432 bi |
| memory width | 9 | 9 |
| Number of functions | 1 | 1 |
| Number of terminals | 32 | 32 |
| word count | 2048 words | 2048 words |
| character code | 2000 | 2000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C |
| organize | 2KX9 | 2KX9 |
| Output characteristics | 3-STATE | 3-STATE |
| Exportable | YES | YES |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified |
| Filter level | MIL-STD-883 | MIL-STD-883 |
| Maximum seat height | 5.334 mm | 5.334 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY |
| Terminal surface | TIN LEAD | TIN LEAD |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |
| width | 15.24 mm | 15.24 mm |