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IDT72P51759L5BB8

Description
FIFO, 64KX36, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256
Categorystorage    storage   
File Size804KB,87 Pages
ManufacturerIDT (Integrated Device Technology)
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IDT72P51759L5BB8 Overview

FIFO, 64KX36, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256

IDT72P51759L5BB8 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionBGA, BGA256,16X16,40
Contacts256
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time3.6 ns
Maximum clock frequency (fCLK)200 MHz
period time5 ns
JESD-30 codeS-PBGA-B256
JESD-609 codee0
length17 mm
memory density2359296 bit
Memory IC TypeOTHER FIFO
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals256
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX36
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA256,16X16,40
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
power supply1.8 V
Certification statusNot Qualified
Maximum seat height3.5 mm
Maximum standby current0.1 A
Maximum slew rate0.15 mA
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width17 mm
1.8V MULTI-QUEUE FLOW-CONTROL DEVICES
(128 QUEUES) 36 BIT WIDE CONFIGURATION
1,179,648 bits
2,359,296 bits
4,718,592 bits
ADVANCE INFORMATION
IDT72P51749
IDT72P51759
IDT72P51769
FEATURES
Choose from among the following memory density options:
IDT72P51749
Total Available Memory = 1,179,648 bits
IDT72P51759
Total Available Memory = 2,359,296 bits
IDT72P51769
Total Available Memory = 4,718,592 bits
Configurable from 1 to 128 Queues
Default configuration of 128 or 64 symmetrical queues
Default multi-queue device configurations
– IDT72P51749: 256 x 36 x 128Q
– IDT72P51759: 512 x 36 x 128Q
– IDT72P51769: 1,024 x 36 x 128Q
Default configuration can be augmented via the queue address
bus
Number of queues and individual queue sizes may be
configured at master reset though serial programming
200 MHz High speed operation (5ns cycle time)
3.6ns access time
Independent Read and Write access per queue
User Selectable Bus Matching Options:
– x36 in to x36 out
– x18 in to x36 out
– x9 in to x36 out
– x36in to x18out
– x18 in to x18 out
– x9 in to x18 out
– x36in to x9out
– x18 in to x9 out
– x9 in to x9 out
User selectable I/O: 1.5V HSTL, 1.8V eHSTL, or 2.5V LVTTL
100% Bus Utilization, Read and Write on every clock cycle
Selectable First Word Fall Through (FWFT) or IDT standard
mode of operation
Ability to operate on packet or word boundaries
Mark and Re-Write operation
Mark and Re-Read operation
Individual, Active queue flags (OR /
EF, IR
/
FF, PAE, PAF, PR)
8 bit parallel flag status on both read and write ports
Direct or polled operation of flag status bus
Expansion of up to 256 queues
JTAG Functionality (Boundary Scan)
Available in a 256-pin PBGA, 1mm pitch, 17mm x 17mm
HIGH Performance submicron CMOS technology
Industrial temperature range (-40°C to +85°C) is available
FUNCTIONAL BLOCK DIAGRAM
MULTI-QUEUE FLOW-CONTROL DEVICE
WADEN
FSTR
WRADD
WEN
WCLK
WCS
8
READ CONTROL
Q127
RADEN
ESTR
RDADD
8
WRITE CONTROL
Q126
REN
RCLK
RCS
OE
Q125
Din
Qout
x36, 18 or x9
DATA IN
x36, x18 or x9
DATA OUT
READ FLAGS
EF/OR
PR
PAE
PAEn
8
WRITE FLAGS
FF/IR
PAF
PAFn
8
Q0
PRn
6714 drw01
IDT and the IDT logo are trademarks of Integrated Device Technology, Inc
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2004
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
SEPTEMBER 2004
DSC-6714/-

IDT72P51759L5BB8 Related Products

IDT72P51759L5BB8 IDT72P51749L6BB8 IDT72P51759L6BB8 IDT72P51749L5BB8 IDT72P51769L5BB8 IDT72P51769L6BB8
Description FIFO, 64KX36, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 FIFO, 32KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 FIFO, 64KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 FIFO, 32KX36, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 FIFO, 128KX36, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 128KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA BGA BGA BGA BGA BGA
package instruction BGA, BGA256,16X16,40 BGA, BGA256,16X16,40 BGA, BGA256,16X16,40 BGA, BGA256,16X16,40 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
Contacts 256 256 256 256 256 256
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 3.6 ns 3.7 ns 3.7 ns 3.6 ns 3.6 ns 3.7 ns
Maximum clock frequency (fCLK) 200 MHz 166 MHz 166 MHz 200 MHz 200 MHz 166 MHz
period time 5 ns 6 ns 6 ns 5 ns 5 ns 6 ns
JESD-30 code S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
JESD-609 code e0 e0 e0 e0 e0 e0
length 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm
memory density 2359296 bit 1179648 bit 2359296 bit 1179648 bit 4718592 bit 4718592 bit
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
memory width 36 36 36 36 36 36
Humidity sensitivity level 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1
Number of terminals 256 256 256 256 256 256
word count 65536 words 32768 words 65536 words 32768 words 131072 words 131072 words
character code 64000 32000 64000 32000 128000 128000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 64KX36 32KX36 64KX36 32KX36 128KX36 128KX36
Exportable YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm
Maximum standby current 0.1 A 0.1 A 0.1 A 0.1 A 0.1 A 0.1 A
Maximum slew rate 0.15 mA 0.15 mA 0.15 mA 0.15 mA 0.15 mA 0.15 mA
Maximum supply voltage (Vsup) 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal form BALL BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
width 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm
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