Quad-Core Intel
®
Xeon
®
Processor
3200 Series
Datasheet
—on 65 nm Process in the 775-land LGA Package supporting
Intel
®
64 architecture and Intel
®
Virtualization Technology
±
January 2007
Document Number: 316133-001
2
Quad-Core Intel® Xeon® Processor 3200 Series Datasheet
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,
BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,
AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING
LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY
PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL,
LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to them.
The Quad-Core Intel® Xeon® Processor 3200 Series may contain design defects or errors known as errata which may cause the
product to deviate from published specifications.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor
family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time
processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not
intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number
progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.
Intel
®
64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled
for Intel 64. Processor will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary
depending on your hardware and software configurations. See http://www.intel.com/technology/intel64/index.htm for more
information including details on which processors support Intel 64, or consult with your system vendor for more information.
No computer system can provide absolute security under all conditions. Intel
®
Trusted Execution Technology (Intel
®
TXT) is a
security technology under development by Intel and requires for operation a computer system with Intel
®
Virtualization
Technology, a Intel Trusted Execution Technology-enabled Intel processor, chipset, BIOS, Authenticated Code Modules, and an Intel
or other Intel Trusted Execution Technology compatible measured virtual machine monitor. In addition, Intel Trusted Execution
Technology requires the system to contain a TPMv1.2 as defined by the Trusted Computing Group and specific software for some
uses.
Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting
operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.
Intel
®
Virtualization Technology requires a computer system with an enabled Intel
®
processor, BIOS, virtual machine monitor
(VMM) and, for some uses, certain platform software enabled for it. Functionality, performance or other benefits will vary
depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible
with all operating systems. Please check with your application vendor.
Intel, Pentium, Itanium, Xeon, Intel SpeedStep, and the Intel logo are trademarks or registered trademarks of Intel Corporation or
its subsidiaries in the United States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2006–2007 Intel Corporation.
±
Δ
3
Quad-Core Intel® Xeon® Processor 3200 Series Datasheet
Contents
1
Introduction
............................................................................................................11
1.1
Terminology......................................................................................................11
1.1.1 Processor Terminology ............................................................................12
1.2
References........................................................................................................13
Electrical Specifications
...........................................................................................15
2.1
Power and Ground Lands ....................................................................................15
2.2
Decoupling Guidelines ........................................................................................15
2.2.1 VCC Decoupling ......................................................................................15
2.2.2 VTT Decoupling ......................................................................................15
2.2.3 FSB Decoupling ......................................................................................16
2.3
Voltage Identification .........................................................................................16
2.4
Reserved, Unused, and TESTHI Signals.................................................................18
2.5
Voltage and Current Specification ........................................................................19
2.5.1 Absolute Maximum and Minimum Ratings...................................................19
2.5.2 DC Voltage and Current Specification ........................................................20
2.5.3 VCC Overshoot .......................................................................................22
2.5.4 Die Voltage Validation .............................................................................23
2.6
Signaling Specifications ......................................................................................23
2.6.1 FSB Signal Groups ..................................................................................24
2.6.2 CMOS and Open Drain Signals ..................................................................25
2.6.3 Processor DC Specifications......................................................................26
2.6.3.1 GTL+ Front Side Bus Specifications..............................................28
2.7
Clock Specifications............................................................................................28
2.7.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................28
2.7.2 FSB Frequency Select Signals (BSEL[2:0]) .................................................29
2.7.3 Phase Lock Loop (PLL) and Filter...............................................................29
2.7.4 BCLK[1:0] Specifications .........................................................................30
Package Mechanical Specifications...........................................................................33
3.1
Package Mechanical Drawing ...............................................................................33
3.2
Processor Component Keep-Out Zones .................................................................38
3.3
Package Loading Specifications ............................................................................38
3.4
Package Handling Guidelines ...............................................................................38
3.5
Package Insertion Specifications ..........................................................................39
3.6
Processor Mass Specification ...............................................................................39
3.7
Processor Materials ............................................................................................39
3.8
Processor Markings ............................................................................................39
3.9
Processor Land Coordinates ................................................................................40
Land Listing and Signal Descriptions
........................................................................41
4.1
Processor Land Assignments ...............................................................................41
4.2
Alphabetical Signals Reference ............................................................................66
Thermal Specifications and Design Considerations...................................................73
5.1
Processor Thermal Specifications .........................................................................73
5.1.1 Thermal Specifications.............................................................................73
5.1.2 Thermal Metrology ..................................................................................76
5.2
Processor Thermal Features ................................................................................76
5.2.1 Thermal Monitor .....................................................................................76
5.2.2 Thermal Monitor 2 ..................................................................................77
5.2.3 On-Demand Mode ...................................................................................78
5.2.4 PROCHOT# Signal ..................................................................................79
2
3
4
5
4
Quad-Core Intel® Xeon® Processor 3200 Series Datasheet
5.3
5.2.5 THERMTRIP# Signal ............................................................................... 79
Platform Environment Control Interface (PECI) ...................................................... 80
5.3.1 Introduction .......................................................................................... 80
5.3.1.1 Key Difference with Legacy Diode-Based Thermal Management ....... 80
5.3.2 PECI Specifications ................................................................................. 81
5.3.2.1 PECI Device Address ................................................................. 81
5.3.2.2 PECI Command Support ............................................................ 81
5.3.2.3 PECI Fault Handling Requirements .............................................. 81
5.3.2.4 PECI GetTemp0() and GetTemp1() Error Code Support .................. 81
6
Features
.................................................................................................................. 83
6.1
Power-On Configuration Options.......................................................................... 83
6.2
Clock Control and Low Power States .................................................................... 83
6.2.1 Normal State ......................................................................................... 84
6.2.2 HALT and Extended HALT Powerdown States.............................................. 84
6.2.2.1 HALT Powerdown State.............................................................. 84
6.2.2.2 Extended HALT Powerdown State ................................................ 85
6.2.3 Stop Grant State .................................................................................... 85
6.2.4 Extended HALT Snoop or HALT Snoop State,
Stop Grant Snoop State .......................................................................... 86
6.2.4.1 HALT Snoop State, Stop Grant Snoop State .................................. 86
6.2.4.2 Extended HALT Snoop State ....................................................... 86
Boxed Processor Specifications
............................................................................... 87
7.1
Mechanical Specifications ................................................................................... 88
7.1.1 Boxed Processor Cooling Solution Dimensions ............................................ 88
7.1.2 Boxed Processor Fan Heatsink Weight ....................................................... 89
7.1.3 Boxed Processor Retention Mechanism and
Heatsink Attach Clip Assembly ................................................................. 90
7.2
Electrical Requirements ...................................................................................... 90
7.2.1 Fan Heatsink Power Supply...................................................................... 90
7.3
Thermal Specifications ....................................................................................... 91
7.3.1 Boxed Processor Cooling Requirements ..................................................... 91
7.3.2 Fan Speed Control Operation ................................................................... 93
Debug Tools Specifications
...................................................................................... 95
8.1
Logic Analyzer Interface (LAI) ............................................................................. 95
8.1.1 Mechanical Considerations ....................................................................... 95
8.1.2 Electrical Considerations.......................................................................... 95
7
8
Quad-Core Intel® Xeon® Processor 3200 Series Datasheet
5
京公网安备 11010802033920号
EEWORLD
