IC 2K X 4 OTPROM, 90 ns, CDIP18, 0.300 INCH, CERAMIC, DIP-18, Programmable ROM
| Parameter Name | Attribute value |
| Maker | NXP |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 18 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 90 ns |
| JESD-30 code | R-GDIP-T18 |
| JESD-609 code | e3/e4 |
| memory density | 8192 bit |
| Memory IC Type | OTP ROM |
| memory width | 4 |
| Number of functions | 1 |
| Number of terminals | 18 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 2KX4 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal surface | TIN/NICKEL PALLADIUM GOLD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| 82S185B/BVA | 82S185/BYA | 82S185A/BYA | 82S185B/BYA | 82S185/BVA | 82S185A/BVA | |
|---|---|---|---|---|---|---|
| Description | IC 2K X 4 OTPROM, 90 ns, CDIP18, 0.300 INCH, CERAMIC, DIP-18, Programmable ROM | IC 2K X 4 OTPROM, 115 ns, CDFP18, CERAMIC, FP-18, Programmable ROM | IC 2K X 4 OTPROM, 55 ns, CDFP18, CERAMIC, FP-18, Programmable ROM | IC 2K X 4 OTPROM, 90 ns, CDFP18, CERAMIC, FP-18, Programmable ROM | IC 2K X 4 OTPROM, 115 ns, CDIP18, 0.300 INCH, CERAMIC, DIP-18, Programmable ROM | IC 2K X 4 OTPROM, 55 ns, CDIP18, 0.300 INCH, CERAMIC, DIP-18, Programmable ROM |
| Maker | NXP | NXP | NXP | NXP | NXP | NXP |
| Parts packaging code | DIP | DFP | DFP | DFP | DIP | DIP |
| package instruction | DIP, | DFP, | DFP, | DFP, | DIP, | DIP, |
| Contacts | 18 | 18 | 18 | 18 | 18 | 18 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 90 ns | 115 ns | 55 ns | 90 ns | 115 ns | 55 ns |
| JESD-30 code | R-GDIP-T18 | R-CDFP-F18 | R-CDFP-F18 | R-CDFP-F18 | R-GDIP-T18 | R-GDIP-T18 |
| memory density | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 18 | 18 | 18 | 18 | 18 | 18 |
| word count | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| character code | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 2KX4 | 2KX4 | 2KX4 | 2KX4 | 2KX4 | 2KX4 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DFP | DFP | DFP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | FLATPACK | FLATPACK | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | YES | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | FLAT | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
京公网安备 11010802033920号
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