MT47H64M16HR-3 IT:H datasheet, PDF

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MT47H64M16HR-3 IT:H: DescriptionIC 64M X 16 DDR DRAM, 0.45 ns, PBGA84, 8 X 12.50 MM, ROHS COMPLIANT, FBGA-84, Dynamic RAM; Categorystorage storage; File Size9MB，131 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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MT47H64M16HR-3 IT:H Overview

IC 64M X 16 DDR DRAM, 0.45 ns, PBGA84, 8 X 12.50 MM, ROHS COMPLIANT, FBGA-84, Dynamic RAM

MT47H64M16HR-3 IT:H Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Micron Technology
package instruction	TFBGA, BGA84,9X15,32
Reach Compliance Code	unknown
ECCN code	3A991
access mode	MULTI BANK PAGE BURST
Maximum access time	0.45 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	333 MHz
I/O type	COMMON
interleaved burst length	4,8
JESD-30 code	R-PBGA-B84
JESD-609 code	e1
length	12.5 mm
memory density	1073741824 bit
Memory IC Type	DDR DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	84
word count	67108864 words
character code	64000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA84,9X15,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	1.8 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	1.2 mm
self refresh	YES
Continuous burst length	4,8
Maximum standby current	0.007 A
Maximum slew rate	0.23 mA
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	8 mm

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1Gb: x4, x8, x16 DDR2 SDRAM

Features

DDR2 SDRAM

MT47H256M4 – 32 Meg x 4 x 8 banks

MT47H128M8 – 16 Meg x 8 x 8 banks

MT47H64M16 – 8 Meg x 16 x 8 banks

Features

•

= +1.8V ±0.1V, V

DDQ

= +1.8V ±0.1V

JEDEC-standard 1.8V I/O (SSTL_18-compatible)

Differential data strobe (DQS, DQS#) option

4n-bit prefetch architecture

Duplicate output strobe (RDQS) option for x8

DLL to align DQ and DQS transitions with CK

8 internal banks for concurrent operation

Programmable CAS latency (CL)

Posted CAS additive latency (AL)

WRITE latency = READ latency - 1

Selectable burst lengths (BL): 4 or 8

Adjustable data-output drive strength

64ms, 8192-cycle refresh

On-die termination (ODT)

Industrial temperature (IT) option

RoHS-compliant

Supports JEDEC clock jitter specification

Options

•

Configuration

–

256 Meg x 4 (32 Meg x 4 x 8 banks)

–

128 Meg x 8 (16 Meg x 8 x 8 banks)

–

64 Meg x 16 (8 Meg x 16 x 8 banks)

•

FBGA package (Pb-free) – x16

–

84-ball FBGA (8mm x 12.5mm)

Rev. G, H

•

FBGA package (Pb-free) – x4, x8

–

60-ball FBGA (8mm x 11.5mm)

Rev. G

•

FBGA package (Pb-free) – x4, x8

–

60-ball FBGA (8mm x 10mm) Rev. H

•

FBGA package (lead solder) – x16

–

84-ball FBGA (8mm x 12.5mm)

Rev. G, H

•

FBGA package (lead solder) – x4, x8

–

60-ball FBGA (8mm x 11.5mm)

Rev. G

•

FBGA package (lead solder) – x4, x8

–

60-ball FBGA (8mm x 10mm) Rev. H

•

Timing – cycle time

–

1.875ns @ CL = 7 (DDR2-1066)

–

2.5ns @ CL = 5 (DDR2-800)

–

2.5ns @ CL = 6 (DDR2-800)

–

3.0ns @ CL = 4 (DDR2-667)

–

3.0ns @ CL = 5 (DDR2-667)

–

3.75ns @ CL = 4 (DDR2-533)

•

Self refresh

–

Standard

–

Low-power

•

Operating temperature

–

Commercial (0°C

≤

85°C)

–

Industrial (–40°C

≤

95°C;

–40°C

≤

85°C)

–

Automotive (–40°C

≤

, T

≤

105ºC)

•

Revision

Note:

Marking

256M4

128M8

64M16

-187E

-25E

-25

-3E

-3

-37E

None

:G/:H

1. Not all options listed can be combined to

define an offered product. Use the Part

Catalog Search on

www.micron.com

for

product offerings and availability.

PDF: 09005aef821ae8bf

1GbDDR2.pdf – Rev. T 02/10 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1Gb: x4, x8, x16 DDR2 SDRAM

State Diagram .................................................................................................................................................. 9

Functional Description ................................................................................................................................... 10

Industrial Temperature .............................................................................................................................. 10

Automotive Temperature ........................................................................................................................... 11

General Notes ............................................................................................................................................ 11

Functional Block Diagrams ............................................................................................................................. 12

Ball Assignments and Descriptions ................................................................................................................. 15

Packaging ...................................................................................................................................................... 19

Package Dimensions .................................................................................................................................. 19

FBGA Package Capacitance ......................................................................................................................... 22

Electrical Specifications – Absolute Ratings ..................................................................................................... 23

Temperature and Thermal Impedance ........................................................................................................ 23

Electrical Specifications – I

Parameters ........................................................................................................ 26

Specifications and Conditions ............................................................................................................... 26

DD7

Conditions .......................................................................................................................................... 27

AC Timing Operating Specifications ................................................................................................................ 31

AC and DC Operating Conditions .................................................................................................................... 41

ODT DC Electrical Characteristics ................................................................................................................... 42

Input Electrical Characteristics and Operating Conditions ............................................................................... 43

Output Electrical Characteristics and Operating Conditions ............................................................................. 46

Output Driver Characteristics ......................................................................................................................... 48

Power and Ground Clamp Characteristics ....................................................................................................... 52

AC Overshoot/Undershoot Specification ......................................................................................................... 53

Input Slew Rate Derating ................................................................................................................................ 55

Commands .................................................................................................................................................... 68

Truth Tables ............................................................................................................................................... 68

DESELECT ................................................................................................................................................. 72

NO OPERATION (NOP) .............................................................................................................................. 73

LOAD MODE (LM) ..................................................................................................................................... 73

ACTIVATE .................................................................................................................................................. 73

READ ......................................................................................................................................................... 73

WRITE ....................................................................................................................................................... 73

PRECHARGE .............................................................................................................................................. 74

REFRESH ................................................................................................................................................... 74

SELF REFRESH ........................................................................................................................................... 74

Mode Register (MR) ........................................................................................................................................ 74

Burst Length .............................................................................................................................................. 75

Burst Type ................................................................................................................................................. 76

Operating Mode ......................................................................................................................................... 76

DLL RESET ................................................................................................................................................. 76

Write Recovery ........................................................................................................................................... 77

Power-Down Mode .................................................................................................................................... 77

CAS Latency (CL) ........................................................................................................................................ 78

Extended Mode Register (EMR) ....................................................................................................................... 79

DLL Enable/Disable ................................................................................................................................... 80

Output Drive Strength ................................................................................................................................ 80

DQS# Enable/Disable ................................................................................................................................. 80

RDQS Enable/Disable ................................................................................................................................. 80

Output Enable/Disable ............................................................................................................................... 80

On-Die Termination (ODT) ........................................................................................................................ 81

Contents

PDF: 09005aef821ae8bf

1GbDDR2.pdf – Rev. T 02/10 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1Gb: x4, x8, x16 DDR2 SDRAM

Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 81

Posted CAS Additive Latency (AL) ............................................................................................................... 81

Extended Mode Register 2 (EMR2) .................................................................................................................. 83

Extended Mode Register 3 (EMR3) .................................................................................................................. 84

Initialization .................................................................................................................................................. 85

ACTIVATE ...................................................................................................................................................... 88

READ ............................................................................................................................................................. 90

READ with Precharge ................................................................................................................................. 94

READ with Auto Precharge .......................................................................................................................... 96

WRITE .......................................................................................................................................................... 101

PRECHARGE ................................................................................................................................................. 111

REFRESH ...................................................................................................................................................... 112

SELF REFRESH .............................................................................................................................................. 113

Power-Down Mode ....................................................................................................................................... 115

Precharge Power-Down Clock Frequency Change .......................................................................................... 122

Reset ............................................................................................................................................................. 123

CKE Low Anytime ...................................................................................................................................... 123

ODT Timing .................................................................................................................................................. 125

MRS Command to ODT Update Delay ........................................................................................................ 127

PDF: 09005aef821ae8bf

1GbDDR2.pdf – Rev. T 02/10 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

MT47H64M16HR-3 IT:H Related Products

	MT47H64M16HR-3 IT:H	MT47H64M16BT-37E	MT47H128M8BT-5E	MT47H256M4BT-5E	MT47H256M4BT-37E	MT47H128M8BT-37E	MT47H64M16HR-25E	MT47H64M16HR-3	MT47H64M16BT-5E
Description	IC 64M X 16 DDR DRAM, 0.45 ns, PBGA84, 8 X 12.50 MM, ROHS COMPLIANT, FBGA-84, Dynamic RAM	DDR DRAM, 64MX16, 0.5ns, CMOS, PBGA92, 11 X 19 MM, LEAD FREE, FBGA-92	DDR DRAM, 128MX8, 0.6ns, CMOS, PBGA92, 11 X 19 MM, LEAD FREE, FBGA-92	DDR DRAM, 256MX4, 0.6ns, CMOS, PBGA92, 11 X 19 MM, LEAD FREE, FBGA-92	DDR DRAM, 256MX4, 0.5ns, CMOS, PBGA92, 11 X 19 MM, LEAD FREE, FBGA-92	DDR DRAM, 128MX8, 0.5ns, CMOS, PBGA92, 11 X 19 MM, LEAD FREE, FBGA-92	DDR DRAM,	DDR DRAM,	DDR DRAM, 64MX16, 0.6ns, CMOS, PBGA92, 11 X 19 MM, LEAD FREE, FBGA-92
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	compliant	unknow
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
Maker	Micron Technology	Micron Technology	Micron Technology	Micron Technology	-	Micron Technology	Micron Technology	Micron Technology	Micron Technology
package instruction	TFBGA, BGA84,9X15,32	TFBGA, BGA92,9X21,32	TFBGA, BGA92,9X21,32	TFBGA, BGA92,9X21,32	TFBGA, BGA92,9X21,32	TFBGA, BGA92,9X21,32	-	-	TFBGA, BGA92,9X21,32
ECCN code	3A991	EAR99	EAR99	EAR99	EAR99	EAR99	-	-	EAR99
access mode	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	-	-	MULTI BANK PAGE BURST
Maximum access time	0.45 ns	0.5 ns	0.6 ns	0.6 ns	0.5 ns	0.5 ns	-	-	0.6 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-	-	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	333 MHz	267 MHz	200 MHz	200 MHz	267 MHz	267 MHz	-	-	200 MHz
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	-	-	COMMON
interleaved burst length	4,8	4,8	4,8	4,8	4,8	4,8	-	-	4,8
JESD-30 code	R-PBGA-B84	R-PBGA-B92	R-PBGA-B92	R-PBGA-B92	R-PBGA-B92	R-PBGA-B92	-	-	R-PBGA-B92
JESD-609 code	e1	e1	e1	e1	e1	e1	-	-	e1
length	12.5 mm	19 mm	19 mm	19 mm	19 mm	19 mm	-	-	19 mm
memory density	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	-	-	1073741824 bi
memory width	16	16	8	4	4	8	-	-	16
Number of functions	1	1	1	1	1	1	-	-	1
Number of ports	1	1	1	1	1	1	-	-	1
Number of terminals	84	92	92	92	92	92	-	-	92
word count	67108864 words	67108864 words	134217728 words	268435456 words	268435456 words	134217728 words	-	-	67108864 words
character code	64000000	64000000	128000000	256000000	256000000	128000000	-	-	64000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	-	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	-	-	85 °C
organize	64MX16	64MX16	128MX8	256MX4	256MX4	128MX8	-	-	64MX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-	-	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	-	-	TFBGA
Encapsulate equivalent code	BGA84,9X15,32	BGA92,9X21,32	BGA92,9X21,32	BGA92,9X21,32	BGA92,9X21,32	BGA92,9X21,32	-	-	BGA92,9X21,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	-	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	-	-	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	-	NOT SPECIFIED	260
power supply	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	-	-	1.8 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-	Not Qualified
refresh cycle	8192	8192	8192	8192	8192	8192	-	-	8192
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	-	-	1.2 mm
self refresh	YES	YES	YES	YES	YES	YES	-	-	YES
Continuous burst length	4,8	4,8	4,8	4,8	4,8	4,8	-	-	4,8
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	-	-	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	-	-	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	-	-	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	-	-	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	-	-	CMOS
Temperature level	INDUSTRIAL	OTHER	OTHER	OTHER	OTHER	OTHER	-	-	OTHER
Terminal surface	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	-	-	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	-	-	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	-	-	BOTTOM
Maximum time at peak reflow temperature	30	30	30	30	30	30	-	NOT SPECIFIED	30
width	8 mm	11 mm	11 mm	11 mm	11 mm	11 mm	-	-	11 mm
Parts packaging code	-	BGA	BGA	BGA	BGA	BGA	-	-	BGA
Contacts	-	92	92	92	92	92	-	-	92

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Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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