MT47H64M16HR-25E datasheet, PDF

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MT47H64M16HR-25E: DescriptionDDR DRAM,; Categorystorage storage; File Size9MB，131 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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MT47H64M16HR-25E Overview

DDR DRAM,

MT47H64M16HR-25E Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Micron Technology
Reach Compliance Code	unknown
Memory IC Type	DDR DRAM

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1Gb: x4, x8, x16 DDR2 SDRAM

Features

DDR2 SDRAM

MT47H256M4 – 32 Meg x 4 x 8 banks

MT47H128M8 – 16 Meg x 8 x 8 banks

MT47H64M16 – 8 Meg x 16 x 8 banks

Features

•

= +1.8V ±0.1V, V

DDQ

= +1.8V ±0.1V

JEDEC-standard 1.8V I/O (SSTL_18-compatible)

Differential data strobe (DQS, DQS#) option

4n-bit prefetch architecture

Duplicate output strobe (RDQS) option for x8

DLL to align DQ and DQS transitions with CK

8 internal banks for concurrent operation

Programmable CAS latency (CL)

Posted CAS additive latency (AL)

WRITE latency = READ latency - 1

Selectable burst lengths (BL): 4 or 8

Adjustable data-output drive strength

64ms, 8192-cycle refresh

On-die termination (ODT)

Industrial temperature (IT) option

RoHS-compliant

Supports JEDEC clock jitter specification

Options

•

Configuration

–

256 Meg x 4 (32 Meg x 4 x 8 banks)

–

128 Meg x 8 (16 Meg x 8 x 8 banks)

–

64 Meg x 16 (8 Meg x 16 x 8 banks)

•

FBGA package (Pb-free) – x16

–

84-ball FBGA (8mm x 12.5mm)

Rev. G, H

•

FBGA package (Pb-free) – x4, x8

–

60-ball FBGA (8mm x 11.5mm)

Rev. G

•

FBGA package (Pb-free) – x4, x8

–

60-ball FBGA (8mm x 10mm) Rev. H

•

FBGA package (lead solder) – x16

–

84-ball FBGA (8mm x 12.5mm)

Rev. G, H

•

FBGA package (lead solder) – x4, x8

–

60-ball FBGA (8mm x 11.5mm)

Rev. G

•

FBGA package (lead solder) – x4, x8

–

60-ball FBGA (8mm x 10mm) Rev. H

•

Timing – cycle time

–

1.875ns @ CL = 7 (DDR2-1066)

–

2.5ns @ CL = 5 (DDR2-800)

–

2.5ns @ CL = 6 (DDR2-800)

–

3.0ns @ CL = 4 (DDR2-667)

–

3.0ns @ CL = 5 (DDR2-667)

–

3.75ns @ CL = 4 (DDR2-533)

•

Self refresh

–

Standard

–

Low-power

•

Operating temperature

–

Commercial (0°C

≤

85°C)

–

Industrial (–40°C

≤

95°C;

–40°C

≤

85°C)

–

Automotive (–40°C

≤

, T

≤

105ºC)

•

Revision

Note:

Marking

256M4

128M8

64M16

-187E

-25E

-25

-3E

-3

-37E

None

:G/:H

1. Not all options listed can be combined to

define an offered product. Use the Part

Catalog Search on

www.micron.com

for

product offerings and availability.

PDF: 09005aef821ae8bf

1GbDDR2.pdf – Rev. T 02/10 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1Gb: x4, x8, x16 DDR2 SDRAM

State Diagram .................................................................................................................................................. 9

Functional Description ................................................................................................................................... 10

Industrial Temperature .............................................................................................................................. 10

Automotive Temperature ........................................................................................................................... 11

General Notes ............................................................................................................................................ 11

Functional Block Diagrams ............................................................................................................................. 12

Ball Assignments and Descriptions ................................................................................................................. 15

Packaging ...................................................................................................................................................... 19

Package Dimensions .................................................................................................................................. 19

FBGA Package Capacitance ......................................................................................................................... 22

Electrical Specifications – Absolute Ratings ..................................................................................................... 23

Temperature and Thermal Impedance ........................................................................................................ 23

Electrical Specifications – I

Parameters ........................................................................................................ 26

Specifications and Conditions ............................................................................................................... 26

DD7

Conditions .......................................................................................................................................... 27

AC Timing Operating Specifications ................................................................................................................ 31

AC and DC Operating Conditions .................................................................................................................... 41

ODT DC Electrical Characteristics ................................................................................................................... 42

Input Electrical Characteristics and Operating Conditions ............................................................................... 43

Output Electrical Characteristics and Operating Conditions ............................................................................. 46

Output Driver Characteristics ......................................................................................................................... 48

Power and Ground Clamp Characteristics ....................................................................................................... 52

AC Overshoot/Undershoot Specification ......................................................................................................... 53

Input Slew Rate Derating ................................................................................................................................ 55

Commands .................................................................................................................................................... 68

Truth Tables ............................................................................................................................................... 68

DESELECT ................................................................................................................................................. 72

NO OPERATION (NOP) .............................................................................................................................. 73

LOAD MODE (LM) ..................................................................................................................................... 73

ACTIVATE .................................................................................................................................................. 73

READ ......................................................................................................................................................... 73

WRITE ....................................................................................................................................................... 73

PRECHARGE .............................................................................................................................................. 74

REFRESH ................................................................................................................................................... 74

SELF REFRESH ........................................................................................................................................... 74

Mode Register (MR) ........................................................................................................................................ 74

Burst Length .............................................................................................................................................. 75

Burst Type ................................................................................................................................................. 76

Operating Mode ......................................................................................................................................... 76

DLL RESET ................................................................................................................................................. 76

Write Recovery ........................................................................................................................................... 77

Power-Down Mode .................................................................................................................................... 77

CAS Latency (CL) ........................................................................................................................................ 78

Extended Mode Register (EMR) ....................................................................................................................... 79

DLL Enable/Disable ................................................................................................................................... 80

Output Drive Strength ................................................................................................................................ 80

DQS# Enable/Disable ................................................................................................................................. 80

RDQS Enable/Disable ................................................................................................................................. 80

Output Enable/Disable ............................................................................................................................... 80

On-Die Termination (ODT) ........................................................................................................................ 81

Contents

PDF: 09005aef821ae8bf

1GbDDR2.pdf – Rev. T 02/10 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1Gb: x4, x8, x16 DDR2 SDRAM

Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 81

Posted CAS Additive Latency (AL) ............................................................................................................... 81

Extended Mode Register 2 (EMR2) .................................................................................................................. 83

Extended Mode Register 3 (EMR3) .................................................................................................................. 84

Initialization .................................................................................................................................................. 85

ACTIVATE ...................................................................................................................................................... 88

READ ............................................................................................................................................................. 90

READ with Precharge ................................................................................................................................. 94

READ with Auto Precharge .......................................................................................................................... 96

WRITE .......................................................................................................................................................... 101

PRECHARGE ................................................................................................................................................. 111

REFRESH ...................................................................................................................................................... 112

SELF REFRESH .............................................................................................................................................. 113

Power-Down Mode ....................................................................................................................................... 115

Precharge Power-Down Clock Frequency Change .......................................................................................... 122

Reset ............................................................................................................................................................. 123

CKE Low Anytime ...................................................................................................................................... 123

ODT Timing .................................................................................................................................................. 125

MRS Command to ODT Update Delay ........................................................................................................ 127

PDF: 09005aef821ae8bf

1GbDDR2.pdf – Rev. T 02/10 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

MT47H64M16HR-25E Related Products

	MT47H64M16HR-25E	MT47H64M16BT-37E	MT47H128M8BT-5E	MT47H256M4BT-5E	MT47H256M4BT-37E	MT47H64M16HR-3 IT:H	MT47H128M8BT-37E	MT47H64M16HR-3	MT47H64M16BT-5E
Description	DDR DRAM,	DDR DRAM, 64MX16, 0.5ns, CMOS, PBGA92, 11 X 19 MM, LEAD FREE, FBGA-92	DDR DRAM, 128MX8, 0.6ns, CMOS, PBGA92, 11 X 19 MM, LEAD FREE, FBGA-92	DDR DRAM, 256MX4, 0.6ns, CMOS, PBGA92, 11 X 19 MM, LEAD FREE, FBGA-92	DDR DRAM, 256MX4, 0.5ns, CMOS, PBGA92, 11 X 19 MM, LEAD FREE, FBGA-92	IC 64M X 16 DDR DRAM, 0.45 ns, PBGA84, 8 X 12.50 MM, ROHS COMPLIANT, FBGA-84, Dynamic RAM	DDR DRAM, 128MX8, 0.5ns, CMOS, PBGA92, 11 X 19 MM, LEAD FREE, FBGA-92	DDR DRAM,	DDR DRAM, 64MX16, 0.6ns, CMOS, PBGA92, 11 X 19 MM, LEAD FREE, FBGA-92
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	compliant	unknow
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
Maker	Micron Technology	Micron Technology	Micron Technology	Micron Technology	-	Micron Technology	Micron Technology	Micron Technology	Micron Technology
Parts packaging code	-	BGA	BGA	BGA	BGA	-	BGA	-	BGA
package instruction	-	TFBGA, BGA92,9X21,32	TFBGA, BGA92,9X21,32	TFBGA, BGA92,9X21,32	TFBGA, BGA92,9X21,32	TFBGA, BGA84,9X15,32	TFBGA, BGA92,9X21,32	-	TFBGA, BGA92,9X21,32
Contacts	-	92	92	92	92	-	92	-	92
ECCN code	-	EAR99	EAR99	EAR99	EAR99	3A991	EAR99	-	EAR99
access mode	-	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	-	MULTI BANK PAGE BURST
Maximum access time	-	0.5 ns	0.6 ns	0.6 ns	0.5 ns	0.45 ns	0.5 ns	-	0.6 ns
Other features	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	-	267 MHz	200 MHz	200 MHz	267 MHz	333 MHz	267 MHz	-	200 MHz
I/O type	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	-	COMMON
interleaved burst length	-	4,8	4,8	4,8	4,8	4,8	4,8	-	4,8
JESD-30 code	-	R-PBGA-B92	R-PBGA-B92	R-PBGA-B92	R-PBGA-B92	R-PBGA-B84	R-PBGA-B92	-	R-PBGA-B92
JESD-609 code	-	e1	e1	e1	e1	e1	e1	-	e1
length	-	19 mm	19 mm	19 mm	19 mm	12.5 mm	19 mm	-	19 mm
memory density	-	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	-	1073741824 bi
memory width	-	16	8	4	4	16	8	-	16
Number of functions	-	1	1	1	1	1	1	-	1
Number of ports	-	1	1	1	1	1	1	-	1
Number of terminals	-	92	92	92	92	84	92	-	92
word count	-	67108864 words	134217728 words	268435456 words	268435456 words	67108864 words	134217728 words	-	67108864 words
character code	-	64000000	128000000	256000000	256000000	64000000	128000000	-	64000000
Operating mode	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS
Maximum operating temperature	-	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	-	85 °C
organize	-	64MX16	128MX8	256MX4	256MX4	64MX16	128MX8	-	64MX16
Output characteristics	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-	3-STATE
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	-	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	-	TFBGA
Encapsulate equivalent code	-	BGA92,9X21,32	BGA92,9X21,32	BGA92,9X21,32	BGA92,9X21,32	BGA84,9X15,32	BGA92,9X21,32	-	BGA92,9X21,32
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	-	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	-	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	-	260	260	260	260	260	260	NOT SPECIFIED	260
power supply	-	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	-	1.8 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
refresh cycle	-	8192	8192	8192	8192	8192	8192	-	8192
Maximum seat height	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	-	1.2 mm
self refresh	-	YES	YES	YES	YES	YES	YES	-	YES
Continuous burst length	-	4,8	4,8	4,8	4,8	4,8	4,8	-	4,8
Maximum supply voltage (Vsup)	-	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	-	1.9 V
Minimum supply voltage (Vsup)	-	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	-	1.7 V
Nominal supply voltage (Vsup)	-	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	-	1.8 V
surface mount	-	YES	YES	YES	YES	YES	YES	-	YES
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	-	CMOS
Temperature level	-	OTHER	OTHER	OTHER	OTHER	INDUSTRIAL	OTHER	-	OTHER
Terminal surface	-	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Tin/Silver/Copper (Sn/Ag/Cu)	-	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	-	BALL	BALL	BALL	BALL	BALL	BALL	-	BALL
Terminal pitch	-	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	-	0.8 mm
Terminal location	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	-	BOTTOM
Maximum time at peak reflow temperature	-	30	30	30	30	30	30	NOT SPECIFIED	30
width	-	11 mm	11 mm	11 mm	11 mm	8 mm	11 mm	-	11 mm

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