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LC5512MC-75F256C

Description
EE PLD, 9.5 ns, PBGA256, FPBGA-256
CategoryProgrammable logic devices    Programmable logic   
File Size1MB,93 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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LC5512MC-75F256C Overview

EE PLD, 9.5 ns, PBGA256, FPBGA-256

LC5512MC-75F256C Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRochester Electronics
Parts packaging codeBGA
package instructionBGA,
Contacts256
Reach Compliance Codeunknown
JESD-30 codeS-PBGA-B256
JESD-609 codee0
length17 mm
Humidity sensitivity level3
Dedicated input times
Number of I/O lines193
Number of terminals256
organize0 DEDICATED INPUTS, 193 I/O
Output functionMACROCELL
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
Programmable logic typeEE PLD
propagation delay9.5 ns
Certification statusCOMMERCIAL
Maximum seat height2.1 mm
Maximum supply voltage1.95 V
Minimum supply voltage1.65 V
Nominal supply voltage1.8 V
surface mountYES
technologyCMOS
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width17 mm
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LC5512MC-75F256C Related Products

LC5512MC-75F256C LC5512MC-45F256C LC5512MC-45F484C LC5512MC-45Q208C LC5256MC-75F256C LC5512MC-75F484C
Description EE PLD, 9.5 ns, PBGA256, FPBGA-256 EE PLD, 5.7 ns, PBGA256, FPBGA-256 EE PLD, 5.7 ns, PBGA484, FPBGA-484 EE PLD, 5.7 ns, PQFP208, PLASTIC, QFP-208 EE PLD, 9.5 ns, PBGA256, FPBGA-256 EE PLD, 9.5 ns, PBGA484, FPBGA-484
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
Parts packaging code BGA BGA BGA QFP BGA BGA
package instruction BGA, BGA, BGA, FQFP, BGA, BGA,
Contacts 256 256 484 208 256 484
Reach Compliance Code unknown unknown unknown unknown unknown unknown
JESD-30 code S-PBGA-B256 S-PBGA-B256 S-PBGA-B484 S-PQFP-G208 S-PBGA-B256 S-PBGA-B484
JESD-609 code e0 e0 e0 e0 e0 e0
length 17 mm 17 mm 23 mm 28 mm 17 mm 23 mm
Humidity sensitivity level 3 3 3 3 3 3
Number of I/O lines 193 193 253 149 141 253
Number of terminals 256 256 484 208 256 484
organize 0 DEDICATED INPUTS, 193 I/O 0 DEDICATED INPUTS, 193 I/O 0 DEDICATED INPUTS, 253 I/O 0 DEDICATED INPUTS, 149 I/O 0 DEDICATED INPUTS, 141 I/O 0 DEDICATED INPUTS, 253 I/O
Output function MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA FQFP BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY FLATPACK, FINE PITCH GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 225 225 225 225 225 225
Programmable logic type EE PLD EE PLD EE PLD EE PLD EE PLD EE PLD
propagation delay 9.5 ns 5.7 ns 5.7 ns 5.7 ns 9.5 ns 9.5 ns
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 2.1 mm 2.1 mm 2.6 mm 4.1 mm 2.1 mm 2.6 mm
Maximum supply voltage 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V
Minimum supply voltage 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V
Nominal supply voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form BALL BALL BALL GULL WING BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 0.5 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM QUAD BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 30 30 30 30
width 17 mm 17 mm 23 mm 28 mm 17 mm 23 mm
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