LC5512MC-75F484C datasheet, PDF

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LC5512MC-75F484C: DescriptionEE PLD, 9.5 ns, PBGA484, FPBGA-484; CategoryProgrammable logic devices Programmable logic; File Size1MB，93 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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LC5512MC-75F484C Overview

EE PLD, 9.5 ns, PBGA484, FPBGA-484

LC5512MC-75F484C Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
Parts packaging code	BGA
package instruction	BGA,
Contacts	484
Reach Compliance Code	unknown
JESD-30 code	S-PBGA-B484
JESD-609 code	e0
length	23 mm
Humidity sensitivity level	3
Dedicated input times
Number of I/O lines	253
Number of terminals	484
organize	0 DEDICATED INPUTS, 253 I/O
Output function	MACROCELL
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	225
Programmable logic type	EE PLD
propagation delay	9.5 ns
Certification status	COMMERCIAL
Maximum seat height	2.6 mm
Maximum supply voltage	1.95 V
Minimum supply voltage	1.65 V
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	23 mm

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LC5512MC-75F484C Related Products

	LC5512MC-75F484C	LC5512MC-45F256C	LC5512MC-45F484C	LC5512MC-45Q208C	LC5256MC-75F256C	LC5512MC-75F256C
Description	EE PLD, 9.5 ns, PBGA484, FPBGA-484	EE PLD, 5.7 ns, PBGA256, FPBGA-256	EE PLD, 5.7 ns, PBGA484, FPBGA-484	EE PLD, 5.7 ns, PQFP208, PLASTIC, QFP-208	EE PLD, 9.5 ns, PBGA256, FPBGA-256	EE PLD, 9.5 ns, PBGA256, FPBGA-256
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
Parts packaging code	BGA	BGA	BGA	QFP	BGA	BGA
package instruction	BGA,	BGA,	BGA,	FQFP,	BGA,	BGA,
Contacts	484	256	484	208	256	256
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	S-PBGA-B484	S-PBGA-B256	S-PBGA-B484	S-PQFP-G208	S-PBGA-B256	S-PBGA-B256
JESD-609 code	e0	e0	e0	e0	e0	e0
length	23 mm	17 mm	23 mm	28 mm	17 mm	17 mm
Humidity sensitivity level	3	3	3	3	3	3
Number of I/O lines	253	193	253	149	141	193
Number of terminals	484	256	484	208	256	256
organize	0 DEDICATED INPUTS, 253 I/O	0 DEDICATED INPUTS, 193 I/O	0 DEDICATED INPUTS, 253 I/O	0 DEDICATED INPUTS, 149 I/O	0 DEDICATED INPUTS, 141 I/O	0 DEDICATED INPUTS, 193 I/O
Output function	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	FQFP	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	FLATPACK, FINE PITCH	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	225	225	225	225	225	225
Programmable logic type	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD
propagation delay	9.5 ns	5.7 ns	5.7 ns	5.7 ns	9.5 ns	9.5 ns
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maximum seat height	2.6 mm	2.1 mm	2.6 mm	4.1 mm	2.1 mm	2.1 mm
Maximum supply voltage	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V
Minimum supply voltage	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V
Nominal supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	BALL	BALL	BALL	GULL WING	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	0.5 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	QUAD	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	30	30	30	30	30	30
width	23 mm	17 mm	23 mm	28 mm	17 mm	17 mm

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