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DP5Z2MX8PAA3-70I

Description
Flash, 2MX8, 70ns, DENSE SLCC, PGA-50
Categorystorage    storage   
File Size630KB,25 Pages
ManufacturerB&B Electronics Manufacturing Company
Download Datasheet Parametric View All

DP5Z2MX8PAA3-70I Overview

Flash, 2MX8, 70ns, DENSE SLCC, PGA-50

DP5Z2MX8PAA3-70I Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerB&B Electronics Manufacturing Company
Parts packaging codeQMA
package instructionPGA, PGA50,5X10
Contacts50
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time70 ns
Data pollingYES
JESD-30 codeR-XQMA-P50
JESD-609 codee0
memory density16777216 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size32
Number of terminals50
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX8
Package body materialUNSPECIFIED
encapsulated codePGA
Encapsulate equivalent codePGA50,5X10
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
ready/busyYES
Department size64K
Maximum standby current0.000005 A
Maximum slew rate0.06 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationQUAD
switch bitYES
typeNOR TYPE
write protectHARDWARE
16 Megabit FLASH EEPROM
DP5Z2MX8PAnY
PRELIMINARY
DESCRIPTION:
The DP5Z2MX8PAnY “SLCC” devices are a revolutionary new memory
subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip
Carriers (SLCC). Available unleaded, straight leaded, “J” leaded, gullwing
leaded packages, or mounted on a 50-pin PGA co-fired ceramic substrate.
The Device packs 16-Megabits of FLASH EEPROM in an area as small as
0.463 in2 while maintaining a total height as low as 0.171 inches.
The DP5Z2MX8PAnY is a 2 Meg x 8 FLASH EEPROM based memory module.
Each SLCC is hermetically sealed making the module suitable for commercial,
industrial and military applications.
By using SLCCs, the “Stack” family of modules offer a higher board density
of memory than available with conventional through-hole, surface mount or
hybrid techniques.
DP5Z2MX8PAY3
DP5Z2MX8PAH3
FEATURES:
Organization: 2 Meg x 8
Fast Access Times: 70*, 90, 120, 150ns (max.)
* V
DD
= 5.0V
±
5%
Single 5.0 Volt Power Supply
High-Density Symmetrically Blocked Architecture
- 32 Uniform Sectors of 64 Kbytes Each
Extended Cycling Capability
- 100,000 Write/Erase Cycles per Sector
Automated Erase and Program Cycles
- Command User Interface
- Status Register
DP5Z2MX8PAJ3
SRAM-Compatible Write Interface
Hardware Data Protection Feature
Packages Available:
DP5Z2MX8PAY
DP5Z2MX8PAIY
DP5Z2MX8PAHY
DP5Z2MX8PAJY
DP5Z2MX8PAA3
- Erase / Write Lockout during Power Transitions
48 - Pin SLCC
48 - Pin Straight Leaded SLCC
48 - Pin Gullwing Leaded SLCC
48 - Pin J Leaded SLCC
50 - Pin PGA Dense-SLCC
DP5Z2MX8PAA3
DP5Z2MX8PAI3
30A161-A1
Rev. A
This document contains information on a product under consideration for
development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the right
to
c
hange or discontinue information on this product without prior notice.
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