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IRGS14C40L

Description
IGBT with on-chip Gate-Emitter and Gate-Collector clamps
CategoryDiscrete semiconductor    The transistor   
File Size291KB,12 Pages
ManufacturerInternational Rectifier ( Infineon )
Websitehttp://www.irf.com/
Download Datasheet Parametric Compare View All

IRGS14C40L Overview

IGBT with on-chip Gate-Emitter and Gate-Collector clamps

IRGS14C40L Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerInternational Rectifier ( Infineon )
Parts packaging codeD2PAK
package instructionSMALL OUTLINE, R-PSSO-G2
Contacts3
Reach Compliance Codecompli
Other featuresLOW SATURATION VOLTAGE
Maximum collector current (IC)20 A
Collector-emitter maximum voltage370 V
ConfigurationSINGLE WITH BUILT-IN DIODE AND RESISTOR
Gate emitter threshold voltage maximum2.2 V
Gate-emitter maximum voltage12 V
JEDEC-95 codeTO-263AB
JESD-30 codeR-PSSO-G2
JESD-609 codee0
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)225
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)125 W
Certification statusNot Qualified
Maximum rise time (tr)4000 ns
surface mountYES
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal locationSINGLE
Maximum time at peak reflow temperature30
transistor applicationsAUTOMOTIVE IGNITION
Transistor component materialsSILICON
Nominal on time (ton)3700 ns
PD - 95193A
Ignition IGBT
Features
•
Most Rugged in Industry
•
Logic-Level Gate Drive
•
> 6KV ESD Gate Protection
•
Low Saturation Voltage
•
High Self-clamped Inductive Switching Energy
•
Lead-Free
Description
The advanced IGBT process family includes a
MOS gated, N-channel logic level device which
is intended for coil-on-plug automotive ignition
applications and small-engine ignition circuits.
Unique features include on-chip active voltage
clamps between the Gate-Emitter and
Gate-Collector which provide over voltage
protection capability in ignition circuits.
Absolute Maximum Ratings
Parameter
Max
Clamped
20
14
1
10
Clamped
125
54
- 40 to 175
- 40 to 175
6
11.5
IGBT with on-chip Gate-Emitter and Gate-Collector clamps
TERMINAL DIAGRAM
Collector
IRGS14C40LPbF
IRGSL14C40LPbF
IRGB14C40LPbF
•
BV
CES =
370V min, 430V max
Gate
R
1
R
2
•
I
C
@ T
C
= 110°C = 14A
•
V
CE(on)
typ= 1.2V @7A @25°C
•
I
L(min)
=11.5A @25°C,L=4.7mH
Emitter
JEDEC TO-263AB
JEDEC TO-262AA
JEDEC TO-220AB
IRGS14C40L
IRGSL14C40L
IRGB14C40L
NOTE: IRGS14C40L is available in tape and reel. Add a suffix of
TRR or TRL to the part number to determine the orientation of the
device in the pocket, i.e, IRGS14C40LTRR or IRGS14C40LTRL.
Unit
V
A
A
mA
Condition
R
G
= 1K
ohm
V
GE
= 5V
V
GE
= 5V
V
CES
I
C
@ T
C
= 25°C
I
C
@ T
C
= 110°C
I
G
I
Gp
V
GE
P
D
@ T
C
= 25°C
T
J
T
STG
V
ESD
I
L
Collector-to-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Continuous Gate Current
Peak Gate Current
Gate-to-Emitter Voltage
Maximum Power Dissipation
mA t
PK
= 1ms, f = 100Hz
V
W
W
°C
°C
KV C = 100pF, R = 1.5K
ohm
A
L = 4.7mH, T = 25°C
P
D
@ T = 110°C
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Electrostatic Voltage
Self-clamped Inductive Switching Current
Thermal Resistance
Parameter
Min
Typ
Max
1.2
40
°C/W
Unit
R
θ
JC
R
θ
JA
Z
θ
JC
www.irf.com
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient
(PCB Mounted, Steady State)
Transient Thermal Impedance, Juction-to-Case (Fig.11)
Page 1
11/19/04

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Description IGBT with on-chip Gate-Emitter and Gate-Collector clamps Insulated Gate Bipolar Transistor, 20A I(C), 370V V(BR)CES, N-Channel, TO-263AB, PLASTIC PACKAGE-3 PIN Insulated Gate Bipolar Transistor, 20A I(C), 370V V(BR)CES, N-Channel, TO-263AB, PLASTIC PACKAGE-3 PIN Insulated Gate Bipolar Transistor, 20A I(C), 370V V(BR)CES, N-Channel, TO-263AB, PLASTIC PACKAGE-3 PIN Insulated Gate Bipolar Transistor, 20A I(C), 370V V(BR)CES, N-Channel, TO-263AB, PLASTIC PACKAGE-3 PIN
Is it Rohs certified? incompatible incompatible conform to incompatible conform to
Maker International Rectifier ( Infineon ) International Rectifier ( Infineon ) International Rectifier ( Infineon ) International Rectifier ( Infineon ) International Rectifier ( Infineon )
Parts packaging code D2PAK D2PAK D2PAK D2PAK D2PAK
package instruction SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2
Contacts 3 3 3 3 3
Reach Compliance Code compli compliant compliant compliant compliant
Other features LOW SATURATION VOLTAGE LOW SATURATION VOLTAGE LOW SATURATION VOLTAGE LOW SATURATION VOLTAGE LOW SATURATION VOLTAGE
Maximum collector current (IC) 20 A 20 A 20 A 20 A 20 A
Collector-emitter maximum voltage 370 V 370 V 370 V 370 V 370 V
Configuration SINGLE WITH BUILT-IN DIODE AND RESISTOR SINGLE WITH BUILT-IN DIODE AND RESISTOR SINGLE WITH BUILT-IN DIODE AND RESISTOR SINGLE WITH BUILT-IN DIODE AND RESISTOR SINGLE WITH BUILT-IN DIODE AND RESISTOR
Gate emitter threshold voltage maximum 2.2 V 2.2 V 2.2 V 2.2 V 2.2 V
Gate-emitter maximum voltage 12 V 12 V 12 V 12 V 12 V
JEDEC-95 code TO-263AB TO-263AB TO-263AB TO-263AB TO-263AB
JESD-30 code R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2
JESD-609 code e0 e0 e3 e0 e3
Humidity sensitivity level 1 1 1 1 1
Number of components 1 1 1 1 1
Number of terminals 2 2 2 2 2
Maximum operating temperature 175 °C 175 °C 175 °C 175 °C 175 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 225 225 260 225 260
Polarity/channel type N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL
Maximum power dissipation(Abs) 125 W 125 W 125 W 125 W 125 W
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum rise time (tr) 4000 ns 4000 ns 4000 ns 4000 ns 4000 ns
surface mount YES YES YES YES YES
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) MATTE TIN OVER NICKEL Tin/Lead (Sn/Pb) MATTE TIN OVER NICKEL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal location SINGLE SINGLE SINGLE SINGLE SINGLE
Maximum time at peak reflow temperature 30 30 30 30 30
transistor applications AUTOMOTIVE IGNITION AUTOMOTIVE IGNITION AUTOMOTIVE IGNITION AUTOMOTIVE IGNITION AUTOMOTIVE IGNITION
Transistor component materials SILICON SILICON SILICON SILICON SILICON
Nominal on time (ton) 3700 ns 3700 ns 3700 ns 3700 ns 3700 ns
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