EEWORLDEEWORLDEEWORLD

Part Number

Search

IDT71V65612S200BQ

Description
ZBT SRAM, 256KX36, 3.2ns, CMOS, PBGA165, 13 X 15 MM, FINE PITCH, BGA-165
Categorystorage    storage   
File Size533KB,26 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric View All

IDT71V65612S200BQ Overview

ZBT SRAM, 256KX36, 3.2ns, CMOS, PBGA165, 13 X 15 MM, FINE PITCH, BGA-165

IDT71V65612S200BQ Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionTBGA,
Contacts165
Reach Compliance Codenot_compliant
ECCN code3A991.B.2.A
Maximum access time3.2 ns
JESD-30 codeR-PBGA-B165
JESD-609 codee0
length15 mm
memory density9437184 bit
Memory IC TypeZBT SRAM
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals165
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX36
Package body materialPLASTIC/EPOXY
encapsulated codeTBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width13 mm
256K x 36, 512K x 18
3.3V Synchronous ZBT™ SRAMs
2.5V I/O, Burst Counter
Pipelined Outputs
Features
u
256K x 36, 512K x 18 memory configurations
u
Supports high performance system speed - 200 MHz
u
ZBT
TM
Feature - No dead cycles between write and read cycles
u
Internally synchronized output buffer enable eliminates the
u
Single R/W (READ/WRITE) control pin
u
Positive clock-edge triggered address, data, and control
signal registers for fully pipelined applications
u
4-word burst capability (interleaved or linear)
u
Individual byte write (BW
1
-
BW
4
) control (May tie active)
u
Three chip enables for simple depth expansion
u
3.3V power supply (±5%)
u
2.5V I/O Supply (V
DDQ
)
u
Power down controlled by ZZ input
u
Packaged in a JEDEC standard 100-pin plastic thin quad
need to control
OE
(3.2 ns Clock-to-Data Access)
Preliminary
IDT71V65612
IDT71V65812
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array (fBGA)
The IDT71V65612/5812 are 3.3V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMS. They are designed to eliminate dead
bus cycles when turning the bus around between reads and writes, or
writes and reads. Thus, they have been given the name ZBT
TM
, or Zero
Bus Turnaround.
Description
Address and control signals are applied to the SRAM during one clock
cycle, and two cycles later the associated data cycle occurs, be it read
or write. The IDT71V65612/5812 contain data I/O, address and control
signal registers. Output enable is the only asynchronous signal and can
be used to disable the outputs at any given time.
A Clock Enable (CEN) pin allows operation of the IDT71V65612/5812
to be suspended as long as necessary. All synchronous inputs are
ignored when (CEN) is high and the internal device registers will hold their
previous values.
There are three chip enable pins (CE
1
, CE
2
,
CE
2
) that allow the
user to deselect the device when desired. If any one of these three are
not asserted when ADV/LD is low, no new memory operation can be
initiated. However, any pending data transfers (reads or writes) will be
completed. The data bus will tri-state two cycles after chip is deselected or
a write is initiated.
The IDT71V65612/5812 has an on-chip burst counter. In the burst
mode, the IDT71V65612/5812 can provide four cycles of data for a single
address presented to the SRAM. The order of the burst sequence is
defined by the
LBO
input pin. The
LBO
pin selects between linear and
interleaved burst sequence. The ADV/LD signal is used to load a new
external address (ADV/LD = LOW) or increment the internal burst counter
(ADV/LD = HIGH).
The IDT71V65612/5812 SRAM utilize IDT's latest high-performance
CMOS process, and are packaged in a JEDEC Standard 14mm x 20mm
100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array
(BGA) and 165 fine pitch ball grid array (fBGA).
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Output
Input
I/O
Supply
Supply
Synchronous
Synchronous
Asynchronous
Synchronous
Synchronous
Synchronous
N/A
Synchronous
Static
N/A
N/A
N/A
N/A
Asynchronous
Synchronous
Static
Static
5314 tbl 01
Pin Description Summary
A
0
-A
18
CE
1
, CE
2
,
CE
2
OE
R/W
CEN
BW
1
,
BW
2
,
BW
3
,
BW
4
CLK
ADV/LD
LBO
TMS
TDI
TCK
TDO
ZZ
I/O
0
-I/O
31
, I/O
P1
-I/O
P4
V
DD
, V
DDQ
V
SS
Address Inputs
Chip Enables
Output Enable
Read/Write Signal
Clock Enable
Individual Byte Write Selects
Clock
Advance burst address / Load new address
Linear / Interleaved Burst Order
Test Mode Select
Test Data Input
Test Clock
Test Data Output
Sleep Mode
Data Input / Output
Core Power, I/O Power
Ground
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
NOVEMBER 2000
DSC-5314/01
1
©2000 Integrated Device Technology, Inc.
Today afternoon 14:00 live broadcast [Latest TI C2000 real-time control chip - F28003X]
Texas Instruments' C2000 real-time control series will soon add the F28003X member. The F28003X provides higher computing performance and larger FLASH space than the F28002X/F28004X . Combined with th...
EEWORLD社区 Microcontroller MCU
How to calculate the frequency after AD conversion
Can anyone help me out? I input a sine signal of about 4KHZ into an AD chip (24-bit 44KHZ), and then connected this AD chip to 2812. Now I want to receive the data after AD conversion through the SPI ...
小喇叭 Microcontroller MCU
[Experience Summary] How to prevent the MCU from being cracked and attacked, and how to achieve safe landing of the MCU
[i=s] This post was last edited by Wu Jianying on 2015-4-14 21:11 [/i] [size=2] [color=#0000ff][b]Currently, there are three main techniques for attacking MCUs, namely: [/b][/color] [color=#3e3e3e][co...
吴鉴鹰. MCU
When debugging axd, DBT Warning 00008: Already at base of stack always appears
When I download *.bin directly to the board, it can run, but when debugging, whether it is single-step debugging or full-speed running, this appears: DBT Warning 00008: Already at base of stack...
mimixi666 ARM Technology
Guo Tianxiang: My Six Years in College
[color=rgb(17,17,17)][backcolor=rgb(255,255,255)]I have been in the Electronic Innovation Laboratory of Harbin Engineering University for five years. During these four years, the Innovation Laboratory...
豆豆花 Download Centre
[TI Engineer Experience] Operational Amplifier Gain Error Design Guide
When you sit down to choose the right operational amplifier (op amp) for your circuit, the first thing to do is to determine the bandwidth of the signal that your system will pass through the amplifie...
soso Analogue and Mixed Signal

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1474  1410  92  1964  1188  30  29  2  40  24 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号