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K7N163645M-QC160

Description
ZBT SRAM, 512KX36, 3.5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100
Categorystorage    storage   
File Size356KB,20 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K7N163645M-QC160 Overview

ZBT SRAM, 512KX36, 3.5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100

K7N163645M-QC160 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeQFP
package instructionLQFP,
Contacts100
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time3.5 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PQFP-G100
length20 mm
memory density18874368 bit
Memory IC TypeZBT SRAM
memory width36
Number of functions1
Number of terminals100
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX36
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
width14 mm
K7N163645M
K7N161845M
Document Title
512Kx36 & 1Mx18 Pipelined NtRAM
TM
512Kx36 & 1Mx18-Bit Pipelined NtRAM
TM
Revision History
Rev. No.
0.0
0.1
0.2
History
1. Initial document.
1. Update ICC & ISB values.
1. Change pin allocation at 119BGA .
- A4 ; from NC to A .
- B2 ; from A to CS2
- B4 ; from CKE to ADV
- B6 ; from A to CS2
- G4 ; from ADV to A
- H4 ; from NC to WE
- M4 ; from WE toCKE
2. Changed DC condition at Icc and parameters
Icc ; from 320mA to 300mA at -67,
from 300mA to 280mA at -75,
Add tCYC 167MHz.
Final spec release
1. Remove 100MHz
Draft Date
Dec. 22. 1998
May. 27. 1999
Nov. 19. 1999
Remark
Preliminary
Preliminary
Preliminary
0.3
1.0
2.0
Nov. 26. 1999
Jan. 28. 2000
Feb. 23. 2001
Preliminary
Fianl
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to c hange the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-1-
February 2001
Rev 2.0
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