Approval sheet
Low Distortion Capacitors
1. INTRODUCTION
WTC low distortion series MLCC is designed by special materials of ceramic and inner electrodes, which is with lower
DF value and lower power consumption in higher frequency applications. This series MLCC is designed specially for using
in analog or digital and AC voltage circuits.
2. FEATURES
b.
c.
d.
High voltage in a given case size.
Low DF value.
Low power consumption in AC voltage application.
3. APPLICATIONS
a.
b.
c.
AC voltage and high current applications.
Lighting and related products.
Network communications.
4. HOW TO ORDER
LD
Series
31
Size
B
Dielectric
102
Capacitance
K
Tolerance
201
Rated voltage
L
Termination
T
Packaging
T=7”
reeled
G=13”
reeled
LD=Low
distortion
31=1206
(3216)
B=X7R
Two significant
K=±10%
digits followed by
M=±20%
no. of zeros. And R
is in place of
decimal point.
eg.:
102=10x10
2
=1000pF
Two significant
L=Ag/Ni/Sn
digits followed by
no. of zeros. And
R is in place of
decimal point.
101=100
VDC
201=200
VDC
251=250
VDC
351=350
VDC
501=500
VDC
631=630
VDC
Page 2 of 9
ASC_ Low Distortion_(LD)_013I_AS
Oct. 2012
Approval sheet
Low Distortion Capacitors
5. EXTERNAL DIMENSIONS
Size
L (mm)
Inch (mm)
T
W (mm)
T (mm)/Symbol
Remark
M
B
(mm)
L
3.20±0.15
1206 (3216)
3.20±0.20
1.60±0.15
1.60±0.20
1.25±0.10
1.60±0.20
D
#
G
M
B
M
B
0.60±0.20
W
# Reflow soldering only is recommended.
Fig. 1 The outline of MLCC
6. GENERAL ELECTRICAL DATA
Dielectric
Size
Capacitance*
Capacitance tolerance**
Rated voltage (WVDC)
Tan
δ*
Insulation resistance at Ur
Dielectric strength
Operating temperature
Capacitance characteristic
Termination
X7R
1206
150pF to 0.1µF
K (±10%), M (±20%)
100V, 200V, 250V, 350V, 500V, 630V
100V :
≤1.4%
≥200V
:
≤1.0%
≥10G
or RxC≥500 -F whichever is smaller
100 to 350V:
≥2
x WVDC
500V & 630V:
≥1.5
x WVDC
-55 to +125°
C
±15%
Ni/Sn (lead-free termination)
* Measured at 25° ambient temperature and 30~70% r elated humidity. Apply 1.0±0.2Vrms, 1.0kHz±10%.
C
** Preconditioning for Class II MLCC: Perform a heat treatment at 150±10° for 1 hour, then leave in a mbient condition for 24±2 hours
C
before measurement.
Page 3 of 9
ASC_ Low Distortion_(LD)_013I_AS
Oct. 2012
Approval sheet
Low Distortion Capacitors
9. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No.
1.
2.
3.
Item
Visual and
Mechanical
Capacitance
Q/ D.F.
(Dissipation
Factor)
1.0±0.2Vrms, 1kHz±10%
---
Test Condition
* No remarkable defect.
Requirements
* Dimensions to conform to individual specification sheet.
* Shall not exceed the limits given in the detailed spec.
100V: D.F. ≤1.4%
≥200V: D.F. ≤1.0%
4.
Dielectric
Strength
* To apply voltage:
100 to 350V: ≥2 times VDC
500V to 630V: ≥1.5 times VDC
* Cut-off, set at 10mA
* TEST= 15 sec.
* RAMP=0
* No evidence of damage or flash over during test.
5.
6.
7.
Insulation
Resistance
Temperature
Coefficient
Adhesive
Strength of
Termination
100V, To apply rated voltage for max. 120 sec.
≥200V, To apply rated voltage for 60 sec.
With no electrical load.
Operating temperature: -55~125°C at 25°C
* Pressurizing force：
5N (≤0603) and 10N (>0603)
* Test time: 10±1 sec.
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
* Measurement to be made after keeping at room temp. for
24±2 hrs.
≥10G or RxC≥100 -F whichever is smaller.
X7R=100V: RxC≥100 -F
Within ±15%.
* No remarkable damage or removal of the terminations.
8.
Vibration
Resistance
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
9.
10.
Solderability
* Solder temperature: 235±5°C
* Dipping time: 2±0.5 sec.
95% min. coverage of all metalized area.
Bending Test
* The middle part of substrate shall be pressurized by means
* No remarkable damage.
of the pressurizing rod at a rate of about 1 mm per second until
* Cap change: X7R: within ±12.5%
the deflection becomes 1 mm and then the pressure shall be
maintained for 5±1 sec.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
(This capacitance change means the change of capacitance under
specified flexure of substrate from the capacitance measured
before the test.)
11.
Resistance to
* Solder temperature: 260±5°
C
* No remarkable damage.
* Cap change: X7R: within ±7.5%
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max. leaching on each edge.
Soldering Heat
* Dipping time: 10±1 sec
* Preheating: 120 to 150° for 1 minute before imme rse the
C
capacitor in a eutectic solder.
* Before initial measurement (Class II only): Perform
150+0/-10° for 1 hr and then set for 24±2 hrs at r oom temp.
C
* Measurement to be made after keeping at room temp. for
24±2 hrs.
Page 5 of 9
ASC_ Low Distortion_(LD)_013I_AS
Oct. 2012
Embedded System
京公网安备 11010802033920号
EEWORLD
