FT29F040B-90JM datasheet, PDF - EEWORLD Datasheet

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FT29F040B-90JM: DescriptionFlash, 512KX8, 90ns, PQCC32, PLASTIC, MO-052AAE, LCC-32; Categorystorage storage; File Size1MB，33 Pages; ManufacturerForce Technologies Ltd.

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FT29F040B-90JM Overview

Flash, 512KX8, 90ns, PQCC32, PLASTIC, MO-052AAE, LCC-32

FT29F040B-90JM Parametric

Parameter Name	Attribute value
Maker	Force Technologies Ltd.
package instruction	QCCJ,
Reach Compliance Code	compliant
Maximum access time	90 ns
JESD-30 code	R-PQCC-J32
length	13.97 mm
memory density	4194304 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX8
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Programming voltage	5 V
Maximum seat height	3.556 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
width	11.43 mm

FT29F040B-90JM Preview

)729F040B

4 Megabit (512 K x 8-Bit)

CMOS 5.0 Volt-only, Uniform Sector Flash Memory

DISTINCTIVE CHARACTERISTICS

●

5.0 V

10% for read and write operations

—

MinimiVes

system level power requirements

●

Embedded Algorithms

— Embedded Erase algorithm automatically

preprograms and erases the entire chip or any

combination of designated sectors

— Embedded Program algorithm automatically

writes and verifies bytes at specified addresses

●

Manufactured on 0.32 μm process technology

— Compatible with 0.5 μm

)729F040

device

●

High performance

— Access times as fast as

●

Minimum 1,000,000 program/erase cycles per

sector guaranteed

20-year data retention at 125qC

— Reliable operation for the life of the system

●

Low power consumption

— 20 mA typical active read current

— 30 mA typical program/erase current

— 1 μA typical standby current (standard access

time to active mode)

●

Package options

— 32-pin PLCC, TSOP, or PDIP

— Please consult factory for Ceramic package options

●

Flexible sector architecture

— 8 uniform sectors of 64 Kbytes each

— Any combination of sectors can be erased

— Supports full chip erase

— Sector protection:

A hardware method of locking sectors to prevent

any program or erase operations within that sector

●

Compatible with JEDEC standards

— Pinout and software compatible with

single-power-supply Flash standard

— Superior inadvertent write protection

●

Data# Polling and toggle bits

— Provides a software method of detecting

program or erase cycle completion

●

Erase Suspend/Erase Resume

— Suspends a sector erase operation to read data

from, or program data to, a non-erasing sector,

then resumes the erase operation

Rev 1

1/33

2011

)729F040B

GENERAL DESCRIPTION

The

)729F040B

is a 4 Mbit, 5.0 volt-only Flash mem-

ory organiVed as 524,288 Kbytes of 8 bits each. The

512 Kbytes of data are divided into eight sectors of 64

Kbytes each for flexible erase capability. The 8 bits of

data appear on DQ0–DQ7. The

)729F040B

is offered

in 32-pin PLCC, TSOP, and PDIP packages. This device

is designed to be programmed in-system with the stan-

dard system 5.0 volt V

supply. A 12.0 volt V

is not

required for write or erase operations. The device can

also be programmed in standard EPROM programmers.

This device is manufactured using 0.32 μm pro-

cess technology, and offers all the features and

benefits of the

)729F040,

which was manufactured

using 0.5 μm process technology. In addtion, the

)729F040B

has a second toggle bit, DQ2, and also of-

fers the ability to program in the Erase Suspend mode.

The standard

)729F040B

offers access times of

90, 120, and 150 ns, allowing high-speed micropro-

cessors to operate without wait states. To eliminate bus

contention the device has separate chip enable (CE#),

write enable (WE#) and output enable (OE#) controls.

The device requires only a

single 5.0 volt power sup-

ply

for both read and write functions. Internally

generated and regulated voltages are provided for the

program and erase operations.

The device is entirely command set compatible with the

JEDEC single-power-supply Flash standard.

Com-

mands are written to the command register using

standard microprocessor write timings. Register con-

tents serve as input to an internal state-machine that

controls the erase and programming circuitry. Write cy-

cles also internally latch addresses and data needed

for the programming and erase operations. Reading

data out of the device is similar to reading from other

Flash or EPROM devices.

Device programming occurs by executing the program

command sequence. This initiates the

Embedded

Program

algorithm—an internal algorithm that auto-

matically times the program pulse widths and verifies

proper cell margin.

Device erasure occurs by executing the erase com-

mand sequence. This initiates the

Embedded Erase

algorithm—an internal algorithm that automatically

preprograms the array (if it is not already programmed)

before executing the erase operation. During erase, the

device automatically times the erase pulse widths and

verifies proper cell margin.

The host system can detect whether a program or

erase operation is complete by reading the DQ7 (Data#

Polling) and DQ6 (toggle)

status bits.

After a program

or erase cycle has been completed, the device is ready

to read array data or accept another command.

The

sector erase architecture

allows memory sectors

to be erased and reprogrammed without affecting the

data contents of other sectors. The device is fully

erased when shipped from the factory.

Hardware data protection

measures include a low

detector that automatically inhibits write opera-

tions during power transitions. The

hardware sector

protection

feature disables both program and erase

operations in any combination of the sectors of mem-

ory. This can be achieved via programming equipment.

The

Erase Suspend

feature enables the user to put

erase on hold for any period of time to read data from,

or program data to, any sector that is not selected for

erasure. True background erase can thus be achieved.

The system can place the device into the

standby mode.

Power consumption is greatly reduced in this mode.

2XU

Flash technology combines years of Flash

memory manufacturing experience to produce the

highest levels of quality, reliability and cost effective-

ness. The device electrically erases all bits within a

sector simultaneously via Fowler-Nordheim tunneling.

The data is programmed using hot electron injection.

Rev 1

2/33

2011

)729F040B

PRODUCT SELECTOR GUIDE

Family Part Number

Speed Option

29F040B

= 5.0 V

10%

-90

-120

120

-150

150

Max access time, ns (t

ACC

)

Max CE# access time, ns (t

)

Max OE# access time, ns (t

)

Note:

See the “AC Characteristics” section for more information.

BLOCK DIAGRAM

DQ0–DQ7

Erase Voltage

Generator

Input/Output

Buffers

WE#

State

Control

Command

PGM Voltage

Generator

Chip Enable

Output Enable

Logic

STB

Data Latch

CE#

OE#

STB

Detector

Timer

Address Latch

Y-Decoder

Y-Gating

X-Decoder

Cell Matrix

A0–A18

Rev 1

3/33

2011

)729F040B

CONNECTION DIAGRAMS

A18

A16

A15

A12

DQ0

DQ1

DQ2

PDIP

WE#

A12

A15

A16

A18

A17

A14

A13

A11

OE#

A10

CE#

DQ7

DQ6

DQ5

DQ4

DQ3

DQ0

1 32 31 30

A14

A13

A11

OE#

A10

CE#

DQ7

PLCC

14 15 16 17 18 19 20

DQ1

DQ2

DQ3

DQ4

DQ5

DQ6

OE#

A10

CE#

DQ7

DQ6

DQ5

DQ4

DQ3

DQ2

DQ1

DQ0

A11

A13

A14

A17

WE#

A18

A16

A15

A12

A11

A13

A14

A17

WE#

A18

A16

A15

A12

32-Pin Standard TSOP

OE#

A10

CE#

DQ7

DQ6

DQ5

DQ4

DQ3

DQ2

DQ1

DQ0

32-Pin Reverse TSOP

Rev 1

4/33

A17

WE#

2011

)729F040B

PIN CONFIGURATION

A0–A18

Address Inputs

Data Input/Output

Chip Enable

Write Enable

Output Enable

Device Ground

+5.0 V single power supply

(see Product Selector Guide for

device speed ratings and voltage

supply tolerances)

CE#

OE#

WE#

A0–A18

DQ0–DQ7

LOGIC SYMBOL

DQ0–DQ7 =

CE#

WE#

OE#

Rev 1

5/33

2011

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	FT29F040B-90JM	FT29F040B-150FM	FT29F040B-150JM	FT29F040B-150EM	FT29F040B-120PM	FT29F040B-90FM
Description	Flash, 512KX8, 90ns, PQCC32, PLASTIC, MO-052AAE, LCC-32	Flash, 512KX8, 150ns, PDSO32, MO-142BBD, TSOP-32	Flash, 512KX8, 150ns, PQCC32, PLASTIC, MO-052AAE, LCC-32	Flash, 512KX8, 150ns, PDSO32, MO-142BBD, TSOP-32	Flash, 512KX8, 120ns, PDIP32, PLASTIC, MO-015GAP, DIP-32	Flash, 512KX8, 90ns, PDSO32, MO-142BBD, TSOP-32
Maker	Force Technologies Ltd.	Force Technologies Ltd.	Force Technologies Ltd.	Force Technologies Ltd.	Force Technologies Ltd.	Force Technologies Ltd.
package instruction	QCCJ,	TSSOP,	QCCJ,	TSSOP,	DIP,	TSSOP,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compli
Maximum access time	90 ns	150 ns	150 ns	150 ns	120 ns	90 ns
JESD-30 code	R-PQCC-J32	R-PDSO-G32	R-PQCC-J32	R-PDSO-G32	R-PDIP-T32	R-PDSO-G32
length	13.97 mm	18.4 mm	13.97 mm	18.4 mm	42.037 mm	18.4 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bi
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	TSSOP	QCCJ	TSSOP	DIP	TSSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	CHIP CARRIER	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Programming voltage	5 V	5 V	5 V	5 V	5 V	5 V
Maximum seat height	3.556 mm	1.2 mm	3.556 mm	1.2 mm	5.715 mm	1.2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	J BEND	GULL WING	J BEND	GULL WING	THROUGH-HOLE	GULL WING
Terminal pitch	1.27 mm	0.5 mm	1.27 mm	0.5 mm	2.54 mm	0.5 mm
Terminal location	QUAD	DUAL	QUAD	DUAL	DUAL	DUAL
width	11.43 mm	8 mm	11.43 mm	8 mm	15.24 mm	8 mm

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