VR5DU646418EBP datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> VR5DU646418EBP

VR5DU646418EBP: DescriptionDDR DRAM Module, 64MX64, 0.6ns, CMOS, SODIMM-200; Categorystorage storage; File Size230KB，15 Pages; ManufacturerViking; Websitehttp://www.viking.com.tw/; Environmental Compliance; Guangjie Technology was established in October 1997 in Hsinchu Science Park. It is the first professional manufacturer in Taiwan that combines thin film/thick film process technology with high-frequency passive component/module design and development capabilities. It has an excellent technical R&D team and is committed to the research and development of thin film process technology and the design and development of high-frequency component/module integration. It provides key components such as integrated passive components and high-frequency modules that meet the high-frequency and miniaturization needs of system products. It has successfully integrated passive components such as resistors/capacitors/inductors/diodes (Integrated Passive Devices, IPDs), which can be widely used in mobile personal electronic products. Anti-static and electromagnetic filtering (ESD & EMI Filter), etc.

Download Datasheet Parametric View All

VR5DU646418EBP Overview

DDR DRAM Module, 64MX64, 0.6ns, CMOS, SODIMM-200

VR5DU646418EBP Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Viking
Parts packaging code	MODULE
package instruction	DIMM,
Contacts	200
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	SINGLE BANK PAGE BURST
Maximum access time	0.6 ns
Other features	AUTO/SELF REFRESH; SEATED HGT-NOM; WD-MAX
JESD-30 code	R-XDMA-N200
length	67.564 mm
memory density	4294967296 bit
Memory IC Type	DDR DRAM MODULE
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	200
word count	67108864 words
character code	64000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature
organize	64MX64
Package body material	UNSPECIFIED
encapsulated code	DIMM
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum seat height	29.972 mm
self refresh	YES
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	NO
technology	CMOS
Temperature level	OTHER
Terminal form	NO LEAD
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	2.54 mm

VR5DU646418EBP Preview

DDR2 UNBUFFERED SODIMM

VR5DUxxxx18xxx

MODULE CONFIGURATIONS

VMS Part Number

VR5DU646418EBP

VR5DU646418EBS

VR5DU646418EBW

VR5DU646418EBY

VR5DU646418EBZ

VR5DU286418EBP

VR5DU286418EBS

VR5DU286418EBW

VR5DU286418EBY

VR5DU286418EBZ

VR5DU286418FBP

VR5DU286418FBS

VR5DU286418FBW

VR5DU286418FBY

VR5DU286418FBZ

VR5DU566418GBP

VR5DU566418GBS

VR5DU566418GBW

VR5DU566418GBY

VR5DU566418GBZ

VR5DU566418FBP

VR5DU566418FBS

VR5DU566418FBW

VR5DU566418FBY

VR5DU566418FBZ

VR5DU126418GBP

VR5DU126418GBS

VR5DU126418GBW

VR5DU126418GBY

VR5DU126418GBZ

Capacity

512MB

1GB

2GB

4GB

Module

Configuration

64Mx64

128Mx64

256Mx64

512Mx64

Device

Configuration

64M x 8 (8)

64M x 8 (16)

128M x 8 (8)

256M x 8 (8)

128M x 8 (16)

256M x 8 (16)

Device

Package

FBGA

Module

Ranks

Performance

PC2-3200

PC2-4200

PC2-5300

PC2-6400

PC2-3200

PC2-4200

PC2-5300

PC2-6400

PC2-3200

PC2-4200

PC2-5300

PC2-6400

PC2-3200

PC2-4200

PC2-5300

PC2-6400

PC2-3200

PC2-4200

PC2-5300

PC2-6400

PC2-3200

PC2-4200

PC2-5300

PC2-6400

CAS

Latency

CL3 (3-3-3)

CL4 (4-4-4)

CL5 (5-5-5)

CL6 (6-6-6)

CL3 (3-3-3)

CL4 (4-4-4)

CL5 (5-5-5)

CL6 (6-6-6)

CL3 (3-3-3)

CL4 (4-4-4)

CL5 (5-5-5)

CL6 (6-6-6)

CL3 (3-3-3)

CL4 (4-4-4)

CL5 (5-5-5)

CL6 (6-6-6)

CL3 (3-3-3)

CL4 (4-4-4)

CL5 (5-5-5)

CL6 (6-6-6)

CL3 (3-3-3)

CL4 (4-4-4)

CL5 (5-5-5)

CL6 (6-6-6)

Features

•

200 pin SO-DIMM

Single 1.8V

0.1V Power Supply

Programmable CAS Latency: 3, 4, 5, 6

Burst Length (4, 8)

Burst type (Sequential & Interleave)

Auto & Self-Refresh.

•

8k/64ms Refresh Period.

Differential CLK (#CLK) inputs.

On-die termination (ODT)

Off-chip driver (OCD) impedance calibration

Serial Presence Detect with EEPROM.

RoHS Compliant* (see last page)

Viking Modular Solutions♦20091 Ellipse♦Foothill Ranch, CA 92610

Tel (800) 338-2361 Fax (949) 666-8159♦Website:

http://www.vikingmodular.com

This Data Sheet is subject to change without notice.

Doc. # PS5DUxxxx18xxx Revision E Created By: Brian Ouellette

Page 1 of 15

DDR2 UNBUFFERED SODIMM

VR5DUxxxx18xxx

PIN CONFIGURATIONS

VREF

GND

DQ4

DQ0

DQ5

DQ1

GND

DM0

#DQS0

GND

DQS0

DQ6

GND

DQ7

DQ2

GND

DQ3

DQ12

VSS

DQ13

DQ8

GND

DQ9

DM1

GND

#DQS1

CK0

DQS1

#CK0

GND

DQ10

DQ14

DQ11

DQ15

GND

DQ16

DQ20

DQ17

DQ21

GND

#DQS2

#EVENT

DQS2

DM2

GND

DQ18

DQ22

DQ19

DQ23

GND

DQ24

DQ28

DQ25

DQ29

GND

DM3

#DQS3

DQS3

GND

DQ26

DQ30

DQ27

100

DQ31

GND

CKE0

**CKE1

VDD

*A15

†BA2

‡A14

VDD

A12

A11

VDD

101

102

103

104

105

106

107

108

109

110

111

112

113

114

115

116

117

118

119

120

121

122

123

124

125

VDD

A10/AP

BA1

BA0

#RAS

#WE

#S0

VDD

#CAS

ODT0

**S1

A13

VDD

**ODT1

GND

DQ32

DQ36

DQ33

126

127

128

129

130

131

132

133

134

135

136

137

138

139

140

141

142

143

144

145

146

147

148

149

150

DQ37

GND

#DQS4

DM4

DQS4

GND

DQ38

DQ34

DQ39

DQ35

GND

DQ44

DQ40

DQ45

DQ41

GND

#DQS5

DM5

DQS5

GND

151

152

153

154

155

156

157

158

159

160

161

162

163

164

165

166

167

168

169

170

171

172

173

174

175

DQ42

DQ46

DQ43

DQ47

GND

DQ48

DQ52

DQ49

DQ53

GND

CK1

GND

#CK1

#DQS6

GND

DQS6

DM6

GND

DQ50

DQ54

DQ51

176

177

178

179

180

181

182

183

184

185

186

187

188

189

190

191

192

193

194

195

196

197

198

199

200

DQ55

GND

DQ56

DQ60

DQ57

DQ61

GND

DM7

#DQS7

GND

DQS7

DQ58

GND

DQ59

DQ62

GND

DQ63

SDA

GND

SCL

SA0

VDDSPD

SA1

*Pins are not used on module.

** Pins are used on 2 rank modules.

† Pins are used on 1Gb based modules.

‡ Pins are used on 2Gb based modules.

Viking Modular Solutions♦20091 Ellipse♦Foothill Ranch, CA 92610

Tel (800) 338-2361 Fax (949) 666-8159♦Website:

http://www.vikingmodular.com

This Data Sheet is subject to change without notice.

Doc. # PS5DUxxxx18xxx Revision E Created By: Brian Ouellette

Page 2 of 15

DDR2 UNBUFFERED SODIMM

VR5DUxxxx18xxx

PIN FUNCTION DESCRIPTION

SYMBOL

CK0, CK1

/CK0, /CK1

CKE0 ~ CKE1

TYPE

POLARITY

Positive Edge

Negative Edge

Active High

DESCRIPTION

Clock: CK and /CK are differential clock inputs. All addresses and control input

signals are sampled on the crossing of the positive edge of CK and negative edge of

/CK. Output data (DQs, DQS and /DQS) is referenced to the crossings of CK and /CK.

CKE HIGH activates, and CKE LOW deactivates internal clock signals, and device

input buffers and output drivers of the SDRAMs. Taking CKE LOW provides

PRECHARGE POWER-DOWN and SELF REFRESH operation (all banks idle), or

ACTIVE POWER DOWN (row ACTIVE in any bank)

Enables the associated SDRAM command decoder when low and disables decoder

when high. When decoder is disabled, new commands are ignored and previous

operations continue. These input signals also disable all outputs (except CKE and

ODT) of the register(s) on the DIMM when both inputs are high. When both S[0:1] are

high, all register outputs (except CKE, ODT and

Chip select) remain in the previous state.

On-Die Termination control signals

CAS, WE When sampled at the positive rising edge of the clock, /CAS, /RAS, and /WE

define the operation to be executed by the SDRAM.

Reference voltage for SSTL18 inputs

Isolated power supply for the DDR SDRAM output buffers to provide improved noise

immunity

Selects which SDRAM bank of four or eight is activated.

During a Bank Activate command cycle, Address defines the row address. During a

Read or Write command cycle, Address defines the column address. In addition to the

column address, AP is used to invoke autoprecharge operation at the end of the burst

read or write cycle. If AP is high, autoprecharge is selected and BA0, BA1, BA2

defines the bank to be precharged. If AP is low, autoprecharge is disabled. During a

Precharge command cycle, AP is used in conjunction with BA0, BA1, and BA2 to

control which bank(s) to precharge. If AP is high, all banks will be precharged

regardless of the state of BA0 or BA1 or BA2. If AP is low, BA0 and BA1 and BA2 are

used to define which bank to precharge.

Data Input/Output pins

Masks write data when high, issued concurrently with input data.

Power and ground for the DDR SDRAM input buffers and core logic.

Positive line of the differential data strobe for input and output data.

Negative line of the differential data strobe for input and output data.

The optional EVENT pin is reserved for use to flag critical module temperatures and is

used in conjunction with a SPD temperature sensing option.

These signals are tied at the system planar to either VSS or VDDSPD to configure the

serial SPD EEPROM address range.

This bi-directional pin is used to transfer data into or out of the SPD EEPROM. A

resistor must be connected from the SDA bus line to VDDSPD on the system planar to

act as a pull-up.

This signal is used to clock data into and out of the SPD EEPROM. A resistor may be

connected from the SCL bus time to VDDSPD on the system planar to act as a pull-up.

Serial EEPROM positive power supply (wired to a separate power pin at the connector,

which supports from 1.7 Volt to 3.6 Volt (nominal 1.8 Volt, 2.5 Volt and 3.3 Volt)

operations.

/S0 ~ /S1

Active Low

ODT0 ~ ODT1

/RAS, /CAS, /WE

VREF

VDD

BA [2:0]

Supply

Active High

Active Low

A [14:0]

DQ [63:0]

DM [7:0]

VDD, GND

DQS [7:0]

/DQS [7:0]

/EVENT

SA [1:0]

SDA

SCL

VDDSPD

I/O

Supply

I/O

Out

I/O

Supply

Active High

Positive Edge

Negative Edge

Viking Modular Solutions♦20091 Ellipse♦Foothill Ranch, CA 92610

Tel (800) 338-2361 Fax (949) 666-8159♦Website:

http://www.vikingmodular.com

This Data Sheet is subject to change without notice.

Doc. # PS5DUxxxx18xxx Revision E Created By: Brian Ouellette

Page 3 of 15

DDR2 UNBUFFERED SODIMM

VR5DUxxxx18xxx

MECHANICAL OUTLINE

All dimensions are in inches with a tolerance of +/- 0.05 unless otherwise specified.

Viking Modular Solutions♦20091 Ellipse♦Foothill Ranch, CA 92610

Tel (800) 338-2361 Fax (949) 666-8159♦Website:

http://www.vikingmodular.com

This Data Sheet is subject to change without notice.

Doc. # PS5DUxxxx18xxx Revision E Created By: Brian Ouellette

Page 4 of 15

DDR2 UNBUFFERED SODIMM

VR5DUxxxx18xxx

FUNCTIONAL BLOCK DIAGRAM SINGLE RANK

/S0

/DQS0

DQS0

DM0

DQ0

DQ1

DQ2

DQ3

DQ4

DQ5

DQ6

DQ7

/DQS1

DQS1

DM1

DQ8

DQ9

DQ10

DQ11

DQ12

DQ13

DQ14

DQ15

/DQS2

DQS2

DM2

DQ16

DQ17

DQ18

DQ19

DQ20

DQ21

DQ22

DQ23

/DQS3

DQS3

DM3

DQ24

DQ25

DQ26

DQ27

DQ28

DQ29

DQ30

DQ31

DM /CS DQS /DQS

I/O 0

I/O 1

I/O 2

I/O 3

I/O 4

I/O 5

I/O 6

I/O 7

DM /CS DQS /DQS

I/O 0

I/O 1

I/O 2

I/O 3

I/O 4

I/O 5

I/O 6

I/O 7

DM /CS DQS /DQS

I/O 0

I/O 1

I/O 2

I/O 3

I/O 4

I/O 5

I/O 6

I/O 7

DM /CS DQS /DQS

I/O 0

I/O 1

I/O 2

I/O 3

I/O 4

I/O 5

I/O 6

I/O 7

/DQS4

DQS4

DM4

DQ32

DQ33

DQ34

DQ35

DQ36

DQ37

DQ38

DQ39

/DQS5

DQS5

DM5

DQ40

DQ41

DQ42

DQ43

DQ44

DQ45

DQ46

DQ47

/DQS6

DQS6

DM6

DQ48

DQ49

DQ50

DQ51

DQ52

DQ53

DQ54

DQ55

/DQS7

DQS7

DM7

DQ56

DQ57

DQ58

DQ59

DQ60

DQ61

DQ62

DQ63

DM /CS DQS /DQS

I/O 0

I/O 1

I/O 2

I/O 3

I/O 4

I/O 5

I/O 6

I/O 7

DM /CS DQS /DQS

I/O 0

I/O 1

I/O 2

I/O 3

I/O 4

I/O 5

I/O 6

I/O 7

DM /CS DQS /DQS

I/O 0

I/O 1

I/O 2

I/O 3

I/O 4

I/O 5

I/O 6

I/O 7

DM /CS DQS /DQS

I/O 0

I/O 1

I/O 2

I/O 3

I/O 4

I/O 5

I/O 6

I/O 7

SCL

A0 A1 A2

SA0 SA1

VDDSPD

VDD/VDDQ

VREF

VSS

BA0~BA2

A0~An

CKE0

/RAS

/CAS

/WE

ODT0

BA0~BA2: SDRAMs D0~D7

A0~An: SDRAMs D0~D7

CKE0: SDRAMs D0~D7

/RAS: SDRAMs D0~D7

/CAS: SDRAMs D0~D7

/WE: SDRAMs D0~D7

ODT0: SDRAMs D0~D7

SDA

Serial PD

D0~D17

Notes:

1. Unless otherwise noted, resistor values are 22 Ohms +/- 5%

Viking Modular Solutions♦20091 Ellipse♦Foothill Ranch, CA 92610

Tel (800) 338-2361 Fax (949) 666-8159♦Website:

http://www.vikingmodular.com

This Data Sheet is subject to change without notice.

Doc. # PS5DUxxxx18xxx Revision E Created By: Brian Ouellette

Page 5 of 15

More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

Recommended Resources

A single-section transistor performance test circuit

30W power amplifier circuit

Power supply circuit diagram without power transformer

Black light wiring method wiring

Type 3211B 3 3/4 digit pen type automatic ranging digital multimeter circuit

Optoelectronic control circuit applied on four-link machine

Protel DXP 2004 Practical Tutorial CD Version: Protel DXP 2004 Practical Tutorial CD Version...; 最好的从该花 PCB Design

How to add TFTP to Ltib? Thank you: I am using the 8315E development board. When using LTIB to compile, I always use the default method without changing the configuration items. After compiling, I download the generated kernel to the de...; jutlmh NXP MCU

OVP Circuit Design in TPS92692-Q1 Buck-Boost Circuit: [i=s]This post was last edited by qwqwqw2088 on 2020-7-31 08:21[/i]Since it can be designed into various topologies such as Boost, Buck-Boost, SEPIC, etc., it has been widely used in automotive LED li...; qwqwqw2088 Analogue and Mixed Signal

Post a summary of the general Makefile: This makefile only needs to modify the compiler and target name, as well as the source file, header file, and .o storage directoryYou can use it directly, and you don’t need to modify the makefile to ...; wuquan-1230 Linux and Android

TI Live: Detailed introduction to "Bidirectional CLLLC Resonant, Dual Active Bridge (DAB) Reference Design": The CLLLC resonant DAB with bidirectional power flow and soft switching characteristics is an ideal candidate for hybrid electric vehicle/electric vehicle (HEV/EV) onboard charger and energy storage a...; EEWORLD社区 TI Technology Forum

Can I ask if the RA2A1 series microcontroller can be upgraded online?: In this regard, who has a detailed routine, thank you ~ ~preferably the Renesas R7FA2A1AB system chip...; beyondabcd Renesas Electronics MCUs

Popular Components