TC55464AP-20 datasheet, PDF - EEWORLD Datasheet

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TC55464AP-20: DescriptionIC 64K X 4 CACHE SRAM, 20 ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24, Static RAM; Categorystorage storage; File Size155KB，7 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TC55464AP-20 Overview

IC 64K X 4 CACHE SRAM, 20 ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24, Static RAM

TC55464AP-20 Parametric

Parameter Name	Attribute value
Maker	Toshiba Semiconductor
Parts packaging code	DIP
package instruction	0.300 INCH, PLASTIC, DIP-24
Contacts	24
Reach Compliance Code	unknown
Maximum access time	20 ns
JESD-30 code	R-PDIP-T24
length	29.8 mm
memory density	262144 bit
Memory IC Type	CACHE SRAM
memory width	4
Number of functions	1
Number of terminals	24
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64KX4
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	4.45 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm

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TC55464AP-20 Related Products

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Description	IC 64K X 4 CACHE SRAM, 20 ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24, Static RAM	IC 64K X 4 CACHE SRAM, 35 ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24, Static RAM	IC 64K X 4 CACHE SRAM, 35 ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24, Static RAM	IC 64K X 4 CACHE SRAM, 20 ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24, Static RAM	IC 64K X 4 CACHE SRAM, 15 ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24, Static RAM	IC 64K X 4 CACHE SRAM, 25 ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24, Static RAM	IC 64K X 4 CACHE SRAM, 15 ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24, Static RAM	IC 64K X 4 CACHE SRAM, 25 ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24, Static RAM
Maker	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor
Parts packaging code	DIP	SOJ	DIP	SOJ	DIP	DIP	SOJ	SOJ
package instruction	0.300 INCH, PLASTIC, DIP-24	SOJ,	DIP,	SOJ,	DIP,	DIP,	SOJ,	SOJ,
Contacts	24	24	24	24	24	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	20 ns	35 ns	35 ns	20 ns	15 ns	25 ns	15 ns	25 ns
JESD-30 code	R-PDIP-T24	R-PDSO-J24	R-PDIP-T24	R-PDSO-J24	R-PDIP-T24	R-PDIP-T24	R-PDSO-J24	R-PDSO-J24
length	29.8 mm	15.88 mm	29.8 mm	15.88 mm	29.8 mm	29.8 mm	15.88 mm	15.88 mm
memory density	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM
memory width	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	24	24	24	24	24	24	24	24
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOJ	DIP	SOJ	DIP	DIP	SOJ	SOJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.45 mm	3.7 mm	4.45 mm	3.7 mm	4.45 mm	4.45 mm	3.7 mm	3.7 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	YES	NO	NO	YES	YES
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	J BEND	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.62 mm	7.7 mm	7.62 mm	7.7 mm	7.62 mm	7.62 mm	7.7 mm	7.7 mm
Is it lead-free?	-	Contains lead	Contains lead	Contains lead	Contains lead	-	Contains lead	Contains lead
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	-	incompatible	incompatible
ECCN code	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-609 code	-	e0	e0	e0	e0	-	e0	e0
Peak Reflow Temperature (Celsius)	-	240	240	240	240	-	240	240
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal surface	-	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	-	TIN LEAD	TIN LEAD
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED

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