IC 64K X 4 CACHE SRAM, 25 ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24, Static RAM
| Parameter Name | Attribute value |
| Maker | Toshiba Semiconductor |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 25 ns |
| JESD-30 code | R-PDIP-T24 |
| length | 29.8 mm |
| memory density | 262144 bit |
| Memory IC Type | CACHE SRAM |
| memory width | 4 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 64KX4 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 4.45 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| TC55464AP-25 | TC55464AJ-35 | TC55464AP-20 | TC55464AP-35 | TC55464AJ-20 | TC55464AP-15 | TC55464AJ-15 | TC55464AJ-25 | |
|---|---|---|---|---|---|---|---|---|
| Description | IC 64K X 4 CACHE SRAM, 25 ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24, Static RAM | IC 64K X 4 CACHE SRAM, 35 ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24, Static RAM | IC 64K X 4 CACHE SRAM, 20 ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24, Static RAM | IC 64K X 4 CACHE SRAM, 35 ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24, Static RAM | IC 64K X 4 CACHE SRAM, 20 ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24, Static RAM | IC 64K X 4 CACHE SRAM, 15 ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24, Static RAM | IC 64K X 4 CACHE SRAM, 15 ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24, Static RAM | IC 64K X 4 CACHE SRAM, 25 ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24, Static RAM |
| Maker | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor |
| Parts packaging code | DIP | SOJ | DIP | DIP | SOJ | DIP | SOJ | SOJ |
| package instruction | DIP, | SOJ, | 0.300 INCH, PLASTIC, DIP-24 | DIP, | SOJ, | DIP, | SOJ, | SOJ, |
| Contacts | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 25 ns | 35 ns | 20 ns | 35 ns | 20 ns | 15 ns | 15 ns | 25 ns |
| JESD-30 code | R-PDIP-T24 | R-PDSO-J24 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-J24 | R-PDIP-T24 | R-PDSO-J24 | R-PDSO-J24 |
| length | 29.8 mm | 15.88 mm | 29.8 mm | 29.8 mm | 15.88 mm | 29.8 mm | 15.88 mm | 15.88 mm |
| memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| Memory IC Type | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| word count | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| character code | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 64KX4 | 64KX4 | 64KX4 | 64KX4 | 64KX4 | 64KX4 | 64KX4 | 64KX4 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOJ | DIP | DIP | SOJ | DIP | SOJ | SOJ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.45 mm | 3.7 mm | 4.45 mm | 4.45 mm | 3.7 mm | 4.45 mm | 3.7 mm | 3.7 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | NO | YES | NO | YES | YES |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | J BEND |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 7.62 mm | 7.7 mm | 7.62 mm | 7.62 mm | 7.7 mm | 7.62 mm | 7.7 mm | 7.7 mm |
| ECCN code | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| technology | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| Is it lead-free? | - | Contains lead | - | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | - | incompatible | - | incompatible | incompatible | incompatible | incompatible | incompatible |
| JESD-609 code | - | e0 | - | e0 | e0 | e0 | e0 | e0 |
| Peak Reflow Temperature (Celsius) | - | 240 | - | 240 | 240 | 240 | 240 | 240 |
| Terminal surface | - | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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