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TC534200P

Description
IC 512K X 8 MASK PROM, 150 ns, PDIP40, 0.600 INCH, PLASTIC, DIP-40, Programmable ROM
Categorystorage    storage   
File Size109KB,6 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Download Datasheet Parametric Compare View All

TC534200P Overview

IC 512K X 8 MASK PROM, 150 ns, PDIP40, 0.600 INCH, PLASTIC, DIP-40, Programmable ROM

TC534200P Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerToshiba Semiconductor
Parts packaging codeDIP
package instruction0.600 INCH, PLASTIC, DIP-40
Contacts40
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time150 ns
Spare memory width16
JESD-30 codeR-PDIP-T40
JESD-609 codee0
length50.7 mm
memory density4194304 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals40
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP40,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply5 V
Certification statusNot Qualified
Maximum seat height4.8 mm
Maximum standby current0.00002 A
Maximum slew rate0.06 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm

TC534200P Related Products

TC534200P TC534200F
Description IC 512K X 8 MASK PROM, 150 ns, PDIP40, 0.600 INCH, PLASTIC, DIP-40, Programmable ROM IC 512K X 8 MASK PROM, 150 ns, PDSO40, 0.525 INCH, PLASTIC, SOP-40, Programmable ROM
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Maker Toshiba Semiconductor Toshiba Semiconductor
Parts packaging code DIP SOIC
package instruction 0.600 INCH, PLASTIC, DIP-40 0.525 INCH, PLASTIC, SOP-40
Contacts 40 40
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
Maximum access time 150 ns 150 ns
Spare memory width 16 16
JESD-30 code R-PDIP-T40 R-PDSO-G40
JESD-609 code e0 e0
length 50.7 mm 25.7 mm
memory density 4194304 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM
memory width 8 8
Number of functions 1 1
Number of terminals 40 40
word count 524288 words 524288 words
character code 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 512KX8 512KX8
Output characteristics 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP
Encapsulate equivalent code DIP40,.6 SOP40,.5,30
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 240
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
Maximum seat height 4.8 mm 2.8 mm
Maximum standby current 0.00002 A 0.00002 A
Maximum slew rate 0.06 mA 0.06 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount NO YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING
Terminal pitch 2.54 mm 1.27 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 15.24 mm 10.7 mm
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