|
TC534200F |
TC534200P |
| Description |
IC 512K X 8 MASK PROM, 150 ns, PDSO40, 0.525 INCH, PLASTIC, SOP-40, Programmable ROM |
IC 512K X 8 MASK PROM, 150 ns, PDIP40, 0.600 INCH, PLASTIC, DIP-40, Programmable ROM |
| Is it lead-free? |
Contains lead |
Contains lead |
| Is it Rohs certified? |
incompatible |
incompatible |
| Maker |
Toshiba Semiconductor |
Toshiba Semiconductor |
| Parts packaging code |
SOIC |
DIP |
| package instruction |
0.525 INCH, PLASTIC, SOP-40 |
0.600 INCH, PLASTIC, DIP-40 |
| Contacts |
40 |
40 |
| Reach Compliance Code |
unknown |
unknown |
| ECCN code |
EAR99 |
EAR99 |
| Maximum access time |
150 ns |
150 ns |
| Spare memory width |
16 |
16 |
| JESD-30 code |
R-PDSO-G40 |
R-PDIP-T40 |
| JESD-609 code |
e0 |
e0 |
| length |
25.7 mm |
50.7 mm |
| memory density |
4194304 bit |
4194304 bit |
| Memory IC Type |
MASK ROM |
MASK ROM |
| memory width |
8 |
8 |
| Number of functions |
1 |
1 |
| Number of terminals |
40 |
40 |
| word count |
524288 words |
524288 words |
| character code |
512000 |
512000 |
| Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
| Maximum operating temperature |
70 °C |
70 °C |
| organize |
512KX8 |
512KX8 |
| Output characteristics |
3-STATE |
3-STATE |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
SOP |
DIP |
| Encapsulate equivalent code |
SOP40,.5,30 |
DIP40,.6 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE |
IN-LINE |
| Parallel/Serial |
PARALLEL |
PARALLEL |
| Peak Reflow Temperature (Celsius) |
240 |
240 |
| power supply |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
| Maximum seat height |
2.8 mm |
4.8 mm |
| Maximum standby current |
0.00002 A |
0.00002 A |
| Maximum slew rate |
0.06 mA |
0.06 mA |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
| surface mount |
YES |
NO |
| technology |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
GULL WING |
THROUGH-HOLE |
| Terminal pitch |
1.27 mm |
2.54 mm |
| Terminal location |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
10.7 mm |
15.24 mm |