FM27C040 4,194,304-Bit (512K x 8) High Performance CMOS EPROM
Connection Diagrams
27C010
FM27C040
XX/V
PP
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
O0
O1
O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
27C010
XX/V
PP
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
O0
O1
O2
GND
Note:
V
CC
A18
A17
A14
A13
A8
A9
A11
OE
A10
CE/PGM
O7
O6
O5
O4
O3
V
CC
XX/PGM
NC
A14
A13
A8
A9
A11
OE
A10
CE
O7
O6
O5
O4
O3
Compatible EPROM pin configurations are shown in the blocks adjacent to the FM27C040 pin.
Commercial Temperature Range
(0
°
C to +70
°
C) V
CC
= 5V
±
10%
Parameter/Order Number
FM27C040 Q, V 90
FM27C040 Q, V 120
FM27C040 Q, V 150
Extended Temperature Range
(-40
°
C to +85
°
C) V
CC
= 5V
±
10%
Parameter/Order Number
FM27C040 QE, VE 90
FM27C040 QE, VE 120
FM27C040 QE, VE 150
Package Types: FM27C040 Q,V XXX
Access Time (ns)
90
120
150
Access Time (ns)
90
120
150
Pin Names
A0–A18
CE/PGM
OE
O0–O7
XX
Addresses
Chip Enable/Program
Output Enable
Outputs
Don’t Care (During Read)
Q = Quartz-Windowed Ceramic DIP
V = PLCC
• All packages conform to the JEDEC standard.
• All versions are guaranteed to function for slower speeds.
2
FM27C040 Rev. B
www.fairchildsemi.com
FM27C040 4,194,304-Bit (512K x 8) High Performance CMOS EPROM
Absolute Maximum Ratings
(Note 1)
Storage Temperature
All Input Voltages except A9 with
Respect to Ground
V
PP
and A9 with Respect to Ground
V
CC
Supply Voltage with
Respect to Ground
ESD Protection
-65°C to +150°C
All Output Voltages with
Respect to Ground
V
CC
+1.0V to GND - 0.6V
Operating Range
-0.6V to +7V
-0.6V to +14V
-0.6V to +7V
>2000V
Range
Commercial
Industrial
Temperature
0°C to +70°C
-40°C to +85°C
V
CC
+5V
+5V
Tolerance
±10%
±10%
Read Operation
DC Electrical Characteristics
Over operating range with V
PP
= V
CC
Symbol
V
IL
V
IH
V
OL
V
OH
I
SB1
I
SB2
I
CC
I
PP
V
PP
I
LI
I
LO
Parameter
Input Low Level
Input High Level
Output Low Voltage
Output High Voltage
V
CC
Standby Current (CMOS)
V
CC
Standby Current
V
CC
Active Current
V
PP
Supply Current
V
PP
Read Voltage
Input Load Current
Output Leakage Current
Test Conditions
Min
-0.5
2.0
Max
0.8
V
CC
+1
0.4
Units
V
V
V
V
I
OL
= 2.1 mA
I
OH
= -2.5 mA
CE = V
CC
±
0.3V
CE = V
IH
CE = OE = V
IL
,
I/O = 0 mA
V
PP
= V
CC
V
CC
- 0.4
V
IN
= 5.5V or GND
V
OUT
= 5.5V or GND
-1
-10
f=5 MHz
3.5
100
1
30
10
V
CC
1
10
µA
mA
mA
µA
V
µA
µA
AC Electrical Characteristics
Over operating range with V
PP
= V
CC
Symbol
t
ACC
t
CE
t
OE
t
DF
(Note 2)
t
OH
(Note 2)
Parameter
Min
Address to Output Delay
CE to Output Delay
OE to Output Delay
Output Disable to
Output Float
Output Hold from Addresses
CE or OE , Whichever
Occurred First
0
90
Max
90
90
50
45
0
120
Min
Max
120
120
50
45
0
150
Min
Max
150
150
50
55
Units
ns
Capacitance
T
A
= +25°C, f = 1 MHz (Note 2)
Symbol
C
IN
C
OUT
Parameter
Input Capacitance
Output Capacitance
Conditions
V
IN
= 0V
V
OUT
= 0V
Typ
9
12
Max
15
15
Units
pF
pF
3
FM27C040 Rev. B
www.fairchildsemi.com
FM27C040 4,194,304-Bit (512K x 8) High Performance CMOS EPROM
AC Test Conditions
Output Load
1 TTL Gate and C
L
= 100 pF (Note 8)
≤5
ns
0.45V to 2.4V
Input Rise and Fall Times
Input Pulse Levels
Timing Measurement Reference Level (Note 10)
Inputs
0.8V and 2V
Outputs`
0.8V and 2V
AC Waveforms
(Notes 6, 7, 9)
ADDRESSES
2V
0.8V
Addresses Valid
CE
2V
0.8V
t CE
t CF
(Note 4, 5)
OE
2V
0.8V
t OE
(Note 3)
t DF
(Note 4, 5)
Valid Output
Hi-Z
t OH
OUTPUT
2V
0.8V
Hi-Z
t ACC
(Note 3)
Note 1:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
Note 2:
This parameter is only sampled and is not 100% tested.
Note 3:
OE may be delayed up to t
ACC
- t
OE
after the falling edge of CE without impacting t
ACC
.
Note 4:
The t
DF
and t
CF
compare level is determined as follows:
High to TRI-STATE
®
, the measured V
OH1
(DC) - 0.10V;
Low to TRI-STATE, the measured V
OL1
(DC) + 0.10V.
Note 5:
TRI-STATE may be attained using OE or CE .
Note 6:
The power switching characteristics of EPROMs require careful device decoupling. It is recommended that at least a 0.1
µF
ceramic capacitor be used on every device
between V
CC
and GND.
Note 7:
The outputs must be restricted to V
CC
+ 1.0V to avoid latch-up and device damage.
Note 8:
1 TTL Gate: I
OL
= 1.6 mA, I
OH
= -400
µA.
C
L
: 100 pF includes fixture capacitance.
Note 9:
V
PP
may be connected to V
CC
except during programming.
Note 10:
Inputs and outputs can undershoot to -2.0V for 20 ns Max.
[b] I still don't understand how to connect the MSP430F149 JTAG. Can you tell me how many pins should be left on the target board (considering the power supply of the target board)? Also, does F149 ha...
Reading a Single Byte The single-byte read function is the most complex of the four read and write functions. The reason for the complexity is that the UCTXSTP flag needs to be operated before reading...
I can't find it on Baidu. Can anyone send me some information? Can anyone who has used this chip tell me the pros and cons of this chip? Thanks! Share it.EMAIL:xhbbit@yahoo.com.cn QQ:472149942 MSN:xhb...
The switching power supply transformer will generate heat after a long time of use. So, what causes this phenomenon? In fact, the reason is very simple. It is because the switching power supply transf...
01
GaN’s Highlight MomentXiaomi held a press conference on February 13th, where it not only released its latest flagship phone, but also its first charger using GaN gallium nitride material. For a tim...
This program is written to simulate the serial port hardware mechanism. When used, a timed interrupt can be set with a time interval of 1/4 baud rate. The receiving function is called once for ea...[Details]
Microcontrollers (MCUs), which are widely used in automotive electronics, are rapidly facing time and cost pressures. The main advantage of using MCUs has always been to create high-level system in...[Details]
Analog engineers have traditionally struggled with complexity when designing power supplies that required multiple outputs, dynamic load sharing, hot-swap, or extensive fault-handling capabilities....[Details]
The Mobile Industry Processor Interface (MIPI) Alliance is an organization responsible for promoting the standardization of software and hardware in mobile devices. It has released the D-PHY specif...[Details]
The reason for the light decay of white LEDs: the decline of phosphor performance
So far, the rapid decline of the luminous performance of white light LEDs, especially low-power white light LE...[Details]
DSP (digital signal processor) is used more and more frequently in today's engineering applications. There are three main reasons for this: first, it has powerful computing power and is capable of ...[Details]
With the continuous improvement of the requirements of intelligent building security systems and the continuous improvement of people's safety awareness, indoor anti-theft has gradually attracted peop...[Details]
1 Introduction
Ultrasonic waves have strong directivity, slow energy consumption, and can propagate over long distances in a medium, so they are used for distance measurement. Ultrasonic detec...[Details]
Investment in
the
medical device
industry has been on the rise in recent years. In the past two years, venture capital for medical devices has almost doubled, reaching $4 billion in 2007. Fr...[Details]
Recently, news came from the certification department that the photovoltaic grid-connected inverter of Samil New Energy Co., Ltd. (hereinafter referred to as "Samil New Energy") has once again obta...[Details]
LED technology has made rapid progress, and improvements in chip design and materials have promoted the development of brighter and more durable light sources, and the scope of light source applica...[Details]
The production process of lithium batteries does not mention the previous processes such as material preparation, winding, liquid injection, and packaging, but only talks about the final formation ...[Details]
1. Brief Introduction
With the continuous development and improvement of single-chip microcomputer technology, single-chip microcomputers have been widely used in all walks of life, and ...[Details]
0 Introduction
Pneumatic
artificial muscle,
also known as pneumatic muscle actuator (PMA), began to be studied in the 1950s. In recent years, it has been widely studied and applied ...[Details]