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FM27C040VE120

Description
512KX8 OTPROM, 120ns, PQCC32, PLASTIC, LCC-32
Categorystorage    storage   
File Size779KB,11 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
Download Datasheet Parametric Compare View All

FM27C040VE120 Overview

512KX8 OTPROM, 120ns, PQCC32, PLASTIC, LCC-32

FM27C040VE120 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRochester Electronics
Parts packaging codeQFJ
package instructionPLASTIC, LCC-32
Contacts32
Reach Compliance Codeunknown
Maximum access time120 ns
JESD-30 codeR-PQCC-J32
JESD-609 codee0
length13.995 mm
memory density4194304 bit
Memory IC TypeOTP ROM
memory width8
Humidity sensitivity levelNOT SPECIFIED
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX8
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusCOMMERCIAL
Maximum seat height3.56 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.455 mm
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FM27C040VE120 Related Products

FM27C040VE120 FM27C040V120 FM27C040V150 FM27C040Q90 FM27C040QE120 FM27C040QE150 FM27C040Q150 FM27C040Q120
Description 512KX8 OTPROM, 120ns, PQCC32, PLASTIC, LCC-32 512KX8 OTPROM, 120ns, PQCC32, PLASTIC, LCC-32 512KX8 OTPROM, 150ns, PQCC32, PLASTIC, LCC-32 512KX8 UVPROM, 90ns, CDIP32, WINDOWED, CERDIP-32 512KX8 UVPROM, 120ns, CDIP32, WINDOWED, CERDIP-32 512KX8 UVPROM, 150ns, CDIP32, WINDOWED, CERDIP-32 512KX8 UVPROM, 150ns, CDIP32, WINDOWED, CERDIP-32 512KX8 UVPROM, 120ns, CDIP32, WINDOWED, CERDIP-32
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Lead free Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible conform to incompatible
Maker Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
Parts packaging code QFJ QFJ QFJ DIP DIP DIP DIP DIP
package instruction PLASTIC, LCC-32 PLASTIC, LCC-32 PLASTIC, LCC-32 WDIP, WINDOWED, CERDIP-32 WINDOWED, CERDIP-32 WINDOWED, CERDIP-32 WINDOWED, CERDIP-32
Contacts 32 32 32 32 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
Maximum access time 120 ns 120 ns 150 ns 90 ns 120 ns 150 ns 150 ns 120 ns
JESD-30 code R-PQCC-J32 R-PQCC-J32 R-PQCC-J32 R-CDIP-T32 R-CDIP-T32 R-CDIP-T32 R-CDIP-T32 R-CDIP-T32
memory density 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit
Memory IC Type OTP ROM OTP ROM OTP ROM UVPROM UVPROM UVPROM UVPROM UVPROM
memory width 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32 32 32
word count 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
character code 512000 512000 512000 512000 512000 512000 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 70 °C 85 °C 85 °C 70 °C 70 °C
organize 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code QCCJ QCCJ QCCJ WDIP WDIP WDIP WDIP WDIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER IN-LINE, WINDOW IN-LINE, WINDOW IN-LINE, WINDOW IN-LINE, WINDOW IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 3.56 mm 3.56 mm 3.56 mm 5.969 mm 5.969 mm 5.969 mm 5.969 mm 5.969 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD NOT SPECIFIED TIN LEAD
Terminal form J BEND J BEND J BEND THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location QUAD QUAD QUAD DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 11.455 mm 11.455 mm 11.455 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm
JESD-609 code e0 e0 e0 e0 e0 e0 - e0
Humidity sensitivity level NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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