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NSHC102J16TRJ1F

Description
CAPACITOR, METALLIZED FILM, POLYPROPYLENE, 50 V, 0.000000012 uF, SURFACE MOUNT, 1210
CategoryPassive components   
File Size94KB,6 Pages
ManufacturerNIC
Websitehttps://www.niccomp.com
Download Datasheet Parametric View All

NSHC102J16TRJ1F Overview

CAPACITOR, METALLIZED FILM, POLYPROPYLENE, 50 V, 0.000000012 uF, SURFACE MOUNT, 1210

NSHC102J16TRJ1F Parametric

Parameter NameAttribute value
Maximum operating temperature125 Cel
Minimum operating temperature-55 Cel
negative deviation5 %
positive deviation5 %
Rated DC voltage urdc50 V
Processing package descriptionChip, ROHS COMPLIANT
Lead-freeYes
EU RoHS regulationsYes
China RoHS regulationsYes
stateACTIVE
terminal coatingtin silver copper
Installation featuressurface mount
Manufacturer SeriesNSHC
size code1210
capacitance1.20E-8 uF
packaging shapeRectangular PACKAGE
Capacitor typeMetallized film
Terminal shapeWRAPAROUND
dielectric materialsPolypropylene
Stacked Film Capacitor Chips
FEATURES
• STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM
• STANDARD EIA 0603, 0805, 1206, 1210, 1913 AND 2416 SIZES
• WIDE TEMPERATURE RANGE UP TO +125
O
C (100pF ~ 0.1μF)
• HIGH HEAT AND MOISTURE RESISTANT
• VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS
CHARACTERISTICS
• SUITABLE FOR REFLOW SOLDERING
• TAPE AND REEL PACKAGING
NSHC IS
RECOMMENDED
FOR NEW DESIGNS
NSHC Series
includes all homogeneous materials
RoHS
Compliant
*See Part Number System for Details
SPECIFICATIONS
Capacitance Range
Voltage Ratings
Capacitance Tolerance
Temperature Range
Dissipation Factor (20°C)
Insulation Resistance (20°C)
Dielectric Withstanding Voltage
Temperature Characteristic
Case Sizes
0603
0805
1206
1210
1913
2416
100pF ~ 0.0027μF 100pF ~ .01μF 3300pF ~ .047μF .012μF ~ .1μF .047μF ~ .1μF .12μF ~ .22μF
16Vdc (12Vrms), 50Vdc (40Vrms)
±5% Std, ±2% Opt.
-55°C ~ +125°C (0.12μF ~ 0.22μF voltage derated above +105°C)
0.6% max. @ 1KHz
3 Gigohms Minimum
150% of Rated Voltage 60 Seconds or
175% of Rated Voltage for 5 Seconds (except 1913 and 2416 case sizes)
±3%
ΔC
Maximum Over Temperature Range
ENVIRONMENTAL CHARACTERISTICS
Life Test At +125°C
1,000 Hours at 125% of
Rated Voltage
Resistance to Soldering Heat
+260°C Peak
Humidity Load Life:
(1) 1000 Hours, +40°C
(2) 500 Hours, +60°C
(3) 500 Hours +85°C/85% RH
Solderability with
25% Wt Rosin-Methanol Flux
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Within ±2% of Initial Value
0.68% Maximum
1 Gigohm Minimum
Within ±3% of Initial Value
0.66% Maximum
1 Gigohm Minimum
(1) & (2) Within ±2% of Initial value (3) Within ±10% of initial value
(1) & (2) 0.90% Maximum (3) 1.2% maximum
(1) 1 Gigohm Minimum (2) 0.5 Gigohm Minimum (3) 0.01 Gigohm min.
90% Minimum Coverage After 2.5 Second Dip into 255°C Solder Pot
RECOMMENDED REFLOW PROFILE
(maximum 2 times)
300
Peak Temperature
260°C
Temperature - Deg. C
RECOMMENDED LAND
PATTERN (mm)
Case Code
J1
A1, A2
B1, B2, B3
C2, C3
D5, D6
E6, E7, E8
EIA Size
0603
0805
1206
1210
1913
2416
A
0.6
0.8
1.8
1.8
3.0
4.0
B
2.0
2.4
3.6
3.6
5.6
7.0
C
0.7
1.1
1.4
2.3
3.0
3.8
250
200
150
100
50
25
Ramp-up
25°C ~ 150°C
90 sec. max.
Pre-heat
150°C ~ 180°C
120 sec. max.
Cool Down
Time above 230°C
30 sec. max.
0
Time
Solder within 1 year. Storage at +30°C and 60% RH
A
B
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
C
SPECIFICATIONS ARE SUBJECT TO CHANGE
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