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Am29LV160BB80RFI

Description
2M X 8 FLASH 3V PROM, 90 ns, PDSO48
Categorystorage   
File Size315KB,46 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric View All

Am29LV160BB80RFI Overview

2M X 8 FLASH 3V PROM, 90 ns, PDSO48

Am29LV160BB80RFI Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals48
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage3.6 V
Minimum supply/operating voltage2.7 V
Rated supply voltage3 V
maximum access time90 ns
Processing package descriptionTSOP-48
stateTRANSFERRED
CraftsmanshipCMOS
packaging shapeRECTANGULAR
Package SizeSMALL OUTLINE
surface mountYes
Terminal formGULL WING
Terminal locationDUAL
Packaging MaterialsPLASTIC/EPOXY
Temperature levelINDUSTRIAL
memory width8
organize2M X 8
storage density1.68E7 deg
operating modeASYNCHRONOUS
Number of digits2.10E6 words
Number of digits2M
Memory IC typeFLASH 3V PROM
serial parallelPARALLEL
PRELIMINARY
Am29LV160B
16 Megabit (2 M x 8-Bit/1 M x 16-Bit)
CMOS 3.0 Volt-only Boot Sector Flash Memory
DISTINCTIVE CHARACTERISTICS
s
Single power supply operation
— Full voltage range: 2.7 to 3.6 volt read and write
operations for battery-powered applications
— Regulated voltage range: 3.0 to 3.6 volt read
and write operations and for compatibility with
high performance 3.3 volt microprocessors
s
Manufactured on 0.35 µm process technology
s
Supports Common Flash Memory Interface
(CFI)
s
High performance
— Full voltage range: access times as fast as 90 ns
— Regulated voltage range: access times as fast
as 80 ns
s
Ultra low power consumption (typical values at
5 MHz)
— 200 nA Automatic Sleep mode current
— 200 nA standby mode current
— 9 mA read current
— 20 mA program/erase current
s
Flexible sector architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
thirty-one 64 Kbyte sectors (byte mode)
— One 8 Kword, two 4 Kword, one 16 Kword, and
thirty-one 32 Kword sectors (word mode)
— Supports full chip erase
— Sector Protection features:
A hardware method of locking a sector to
prevent any program or erase operations within
that sector
Sectors can be locked in-system or via
programming equipment
Temporary Sector Unprotect feature allows code
changes in previously locked sectors
s
Unlock Bypass Program Command
— Reduces overall programming time when
issuing multiple program command sequences
s
Top or bottom boot block configurations
available
s
Embedded Algorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies data at specified addresses
s
Minimum 1,000,000 write cycle guarantee per
sector
s
Package option
— 48-ball FBGA
— 48-pin TSOP
— 44-pin SO
s
CFI (Common Flash Interface) compliant
— Provides device-specific information to the
system, allowing host software to easily
reconfigure for different Flash devices
s
Compatibility with JEDEC standards
— Pinout and software compatible with single-
power supply Flash
— Superior inadvertent write protection
s
Data# Polling and toggle bits
— Provides a software method of detecting
program or erase operation completion
s
Ready/Busy# pin (RY/BY#)
— Provides a hardware method of detecting
program or erase cycle completion (not
available on 44-pin SO)
s
Erase Suspend/Erase Resume
— Suspends an erase operation to read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation
s
Hardware reset pin (RESET#)
— Hardware method to reset the device to reading
array data
Publication#
21358
Rev:
F
Amendment/+2
Issue Date:
March 1998
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