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IDT72274L15TF8

Description
FIFO, 32KX9, Synchronous, CMOS, PQFP64, 10 X 10, 1.40 MM HEIGHT, STQFP-64
Categorystorage    storage   
File Size1MB,31 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

IDT72274L15TF8 Overview

FIFO, 32KX9, Synchronous, CMOS, PQFP64, 10 X 10, 1.40 MM HEIGHT, STQFP-64

IDT72274L15TF8 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeQFP
package instructionLFQFP,
Contacts64
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresRETRANSMIT
period time15 ns
JESD-30 codeS-PQFP-G64
JESD-609 codee0
length10 mm
memory density294912 bit
memory width9
Humidity sensitivity level3
Number of functions1
Number of terminals64
word count32768 words
character code32000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX9
Output characteristics3-STATE
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature20
width10 mm

IDT72274L15TF8 Related Products

IDT72274L15TF8 IDT72264L20TF8 IDT72264L20PF8 IDT72264L15TF8 IDT72274L20PF8 IDT72274L15PF8 IDT72274L20TF8 IDT72264L15PF8
Description FIFO, 32KX9, Synchronous, CMOS, PQFP64, 10 X 10, 1.40 MM HEIGHT, STQFP-64 FIFO, 16KX9, Synchronous, CMOS, PQFP64, 10 X 10, 1.40 MM HEIGHT, STQFP-64 FIFO, 16KX9, Synchronous, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 FIFO, 16KX9, Synchronous, CMOS, PQFP64, 10 X 10, 1.40 MM HEIGHT, STQFP-64 FIFO, 32KX9, Synchronous, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 FIFO, 32KX9, Synchronous, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 FIFO, 32KX9, Synchronous, CMOS, PQFP64, 10 X 10, 1.40 MM HEIGHT, STQFP-64 FIFO, 16KX9, Synchronous, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code QFP QFP QFP QFP QFP QFP QFP QFP
package instruction LFQFP, LFQFP, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 LFQFP, LQFP, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 LFQFP, LQFP,
Contacts 64 64 64 64 64 64 64 64
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Other features RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT
period time 15 ns 20 ns 20 ns 15 ns 20 ns 15 ns 20 ns 15 ns
JESD-30 code S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
length 10 mm 10 mm 14 mm 10 mm 14 mm 14 mm 10 mm 14 mm
memory density 294912 bit 147456 bit 147456 bit 147456 bit 294912 bit 294912 bit 294912 bit 147456 bit
memory width 9 9 9 9 9 9 9 9
Humidity sensitivity level 3 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 64 64 64 64 64 64 64 64
word count 32768 words 16384 words 16384 words 16384 words 32768 words 32768 words 32768 words 16384 words
character code 32000 16000 16000 16000 32000 32000 32000 16000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 32KX9 16KX9 16KX9 16KX9 32KX9 32KX9 32KX9 16KX9
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Exportable YES YES YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP LFQFP LQFP LFQFP LQFP LQFP LFQFP LQFP
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 240 240 240 240 240 240 240
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.8 mm 0.5 mm 0.8 mm 0.8 mm 0.5 mm 0.8 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 20 20 20 20 20 20 20 20
width 10 mm 10 mm 14 mm 10 mm 14 mm 14 mm 10 mm 14 mm
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