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LF80537GF0484MSLGFJ

Description
Microprocessor, 64-Bit, 2160MHz, CMOS, CPGA478, UFCPGA-478
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size773KB,8 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

LF80537GF0484MSLGFJ Overview

Microprocessor, 64-Bit, 2160MHz, CMOS, CPGA478, UFCPGA-478

LF80537GF0484MSLGFJ Parametric

Parameter NameAttribute value
MakerIntel
Parts packaging codePGA
package instructionUFCPGA-478
Contacts478
Reach Compliance Codecompliant
Address bus width
bit size64
boundary scanNO
External data bus width
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeX-CPGA-P478
low power modeYES
Number of terminals478
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Package shapeUNSPECIFIED
Package formGRID ARRAY
speed2160 MHz
surface mountNO
technologyCMOS
Terminal formPIN/PEG
Terminal locationPERPENDICULAR
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR

LF80537GF0484MSLGFJ Preview

Product Brief
Intel® Core™2 Duo Processors
Embedded Computing
Intel
®
Core
2 Duo Processors
for Embedded Computing
Processors T9400, P8400, SL9400, SL9380, SP9300, SU9300,
T7500, T7400, L7500, L7400 and U7500
Product Overview
Intel® Core™2 Duo processors – members of Intel’s growing prod-
uct line of multi-core processors based on Intel® Core™ microarchi-
tecture – now feature 45nm process technology to deliver even
greater energy-efficient performance. Intel Core 2 Duo processor
technology makes it possible to integrate two complete execu-
tion cores in one physical package, providing advancements in
simultaneous computing for multi-threaded applications and multi-
tasking environments. Intel’s hafnium-based 45nm Hi-k silicon
process technology enables even more processor performance
by doubling transistor density and increasing cache size by up to
50 percent. The result is improved speed and efficiency, relative
to previous-generation dual-core Intel® processors.
Intel Core 2 Duo processors meet the needs of a wide range
of performance-intensive, low-power embedded applications
in smaller form factors such as retail and transaction services
(i.e., point-of-service terminals and ATMs), gaming platforms,
industrial control and automation, digital security surveillance
and medical imaging. While incorporating advanced processor
technology, they remain software-compatible with previous
IA-32 processors.
Arch State
Thermal Control
Execution
Resources
L1 Caches
APIC
Arch State
Thermal Control
Execution
Resources
L1 Caches
APIC
• Intel® Smart Memory Access accelerates out-of-order
execution, reduces time in-flight instructions must wait
for data, and moves data from system memory into fast
L2 cache prior to execution.
• Intel® Advanced Digital Media Boost accelerates execution of
Streaming SIMD Extension (SSE) instructions to significantly
improve performance of video, audio, and image processing
for multimedia, encryption, financial, engineering, and scientific
applications. 128-bit SSE instructions, issued at a throughput
rate of one per clock cycle, effectively doubles speed of execu-
tion over previous-generation processors. 45nm versions include
new Super Shuffle Engine to improve existing SSE instructions
while enabling significant gains on the latest SSE4 instruction
set. This provides additional performance improvements in
SSE4-optimized applications, such as video editing and
encoding in high-definition resolution.
Intel® Core™ Microarchitecture
Energy-efficient performance helps equipment manufacturers
optimally balance processing capabilities within power and
space constraints.
• Intel® Wide Dynamic Execution allows each core to simultaneously
complete up to four full instructions per clock cycle.
• Intel® Advanced Smart Cache significantly reduces memory
latency to frequently used data through dynamic allocation
of shared L2 cache.
Shared L2 Cache
Power Mgmt.
Coordination Logic
Core
Coordination Logic
Bus Interface
Intel® Core™2 Duo processors, based on Intel® Core™ microarchi-
tecture, include two complete execution cores, shared L2 cache,
and intelligent power management capabilities. These features
deliver significantly greater performance-per-watt over previous-
generation dual-core Intel® processors.
Intel® Core™ Microarchitecture (continued)
• Intel® Virtualization Technology
1
allows one hardware platform
to function as multiple “virtual” platforms, improving manage-
ability, limiting downtime and maintaining worker productivity.
Provides greater isolation and security between different
applications and operating systems for added protection.
• Intel® 64 Architecture
2
supports 64-bit instructions,
providing flexibility for 64-bit and 32-bit applications
and operating systems.
• Intel® Trusted Execution Technology
3
(Intel® TXT) defends
against software-based attacks and helps protect confiden-
tiality and integrity of data stored or created on the system.
Enables each application to run within its own space, protected
from all other software on the system.
• Execute Disable Bit
4
marks memory regions as executable or non-
executable when combined with a supporting operating system.
• Digital Thermal Sensor (DTS) enables efficient processor and
platform thermal control. Thermal sensors located within the
processor measure maximum temperature on the die at any
given time.
• Embedded lifecycle support protects system investment by
enabling extended product availability for embedded customers.
• Along with a strong ecosystem of hardware and software
vendors, including members of the Intel® Embedded and Commu-
nications Alliance (intel.com/go/eca), Intel helps cost-effectively
meet development challenges and speed time-to-market.
Intel® Core™2 Duo Processor Platform Features
Intel® Core™2 Duo Processors
T9400
/P8400
/SL9400
/SL9380
/
SP9300
/SU9300
• Based on Intel® 45nm process technology
• Validated with Mobile Intel® GM45 Express chipset (T9400, P8400) and Mobile Intel® GS45 Express
chipset (SL9400, SP9300, SU9300)
– Excellent processor and graphics performance, storage speed and reliability
– Up to 8 GB 667/800 MHz DDR2 or 800/1066 MHz DDR3 SODIMM system memory
– Graphics core performance up to 533 MHz
• Validated with power-optimized Intel® 5100 Memory Controller Hub chipset with
Intel® 82801IR I/O Controller Hub 9R (T9400, SL9400)
– 30 lanes of PCI Express* for I/O connectivity
– Supports dual-channel DDR2 registered ECC memory (533 MHz and 667 MHz) to help safeguard
data and improve reliability
– Performance-per-watt advantage for single-processor bladed form factor applications
• Validated with integrated Intel® 3100 chipset (SL9380, SU9300)
– Supports single-channel DDR2, providing up to 16 GB max memory support
– Optimized performance-per-watt for small form factors: PrAMC, CompactPCI* and COM Express*
– Brings enterprise-level reliability, availability, serviceability, usability and manageability (RASUM)
to embedded platforms
Intel® Core™2 Duo Processors
T7500
/L7500
/U7500
• Based on Intel® 65nm process technology
• Validated with Mobile Intel® GME965 Express chipset
– Excellent storage speed, reliability and remote asset management capabilities
– Integrated 32-bit 3D graphics engine, and up to 4 GB of 533/667 MHz DDR2 SODIMM system memory
– Graphics core performance up to 500 MHz
• L7500 offers low-power, value-sensitive solution
• U7500 provides ultra low-power solution with excellent graphics performance
Intel® Core™2 Duo Processors
T7400
/L7400
/U7500
• Based on Intel® 65nm process technology
• Validated with Mobile Intel® 945GME Express chipset
– Superb graphics, I/O bandwidth, storage speed, reliability and remote asset management capabilities
– Integrated 32-bit 3D graphics engine
– Up to 4 GB of 400/533/667 MHz DDR2 SODIMM system memory
• T7400 and L7400 also validated with Intel® E7520 chipset, addressing the needs of high-performance,
low-power platforms within small form factor designs
• L7400 and U7500 also validated with Intel® 3100 chipset, an integrated chipset offering low-power
platform solutions for thermally sensitive and performance-intensive embedded, communications
and storage applications
Intel® Core™2 Duo Processors for Embedded Computing
Product Number
45nm process technology
Intel® Core™2 Duo Processor T9400
AV80576GH0616M
2.53 GHz
AW80576GH0616M
2.53 GHz
Intel® Core™2 Duo Processor P8400
AV80577SH0513M
2.26 GHz
AW80577SH0513M
2.26 GHz
Intel® Core™2 Duo Processor SL9400
1.86 GHz
AV80576LH0366M
Intel® Core™2 Duo Processor SL9380
AV80576LG0336M
1.80 GHz
Intel® Core™2 Duo Processor SP9300
AV80576SH0516M
2.26 GHz
Intel® Core™2 Duo Processor SU9300
AV80577UG0093M
1.20 GHz
65nm process technology
Intel® Core™2 Duo Processor T7500
LE80537GG0494M
2.20 GHz
LF80537GG0494M
2.20 GHz
Intel® Core™2 Duo Processor T7400
LE80537GF0484M
2.16 GHz
LF80537GF0484M
2.16 GHz
Intel® Core™2 Duo Processor L7500
LE80537LG0254M
1.60 GHz
Intel® Core™2 Duo Processor L7400
LE80537LF0214M
1.50 GHz
Intel® Core™2 Duo Processor U7500
LE80537UE0042M
1.06 GHz
800 MHz
800 MHz
667 MHz
667 MHz
800 MHz
667 MHz
533 MHz
4 MB Unified
4 MB Unified
4 MB Unified
4 MB Unified
4 MB Unified
4 MB Unified
2 MB Unified
35 watts
35 watts
34 watts
34 watts
17 watts
17 watts
10 watts
0.75 V-1.35 V
0.75 V-1.35 V
0.75 V-1.3 V
0.75 V-1.3 V
0.75 V-1.3 V
0.75 V-1.1 V
0.75 V-0.975 V
100° C
100° C
100° C
100° C
100° C
100° C
100° C
479 μFC-BGA
478 μFC-PGA
479 μFC-BGA
478 μFC-PGA
479 μFC-BGA
479 μFC-BGA
479 μFC-BGA
1066 MHz
1066 MHz
1066 MHz
1066 MHz
1066 MHz
800 MHz
1066 MHz
800 MHz
6 MB Unified
6 MB Unified
3 MB Unified
3 MB Unified
6 MB Unified
6 MB Unified
6 MB Unified
3 MB Unified
35 watts
35 watts
25 watts
25 watts
17 watts
17 watts
25 watts
10 watts
0.75 V-1.3 V
0.75 V-1.3 V
0.75 V-1.3 V
0.75 V-1.3 V
0.75 V-1.25 V
0.75 V-1.25 V
0.75 V-1.3 V
0.75 V-1.3 V
105° C
105° C
105° C
105° C
105° C
105° C
105° C
105° C
479
µFC-BGA
478
µFC-PGA
479 μFC-BGA
478 μFC-PGA
956 μFC-BGA (SFF)
956
µFC-BGA
(SFF)
956
µFC-BGA
(SFF)
956
µFC-BGA
(SFF)
Core Speed
Front-Side
Bus Speed
L2 Cache
Thermal
Design Power
VID
Tj Max
Package
5
Intel in Embedded and Communications:
Intel.com/go/embedded
Intel
®
processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families.
See http://www.intel.com/products/processor_number for details.
1
Intel
®
Virtualization Technology requires a computer system with an enabled Intel
®
processor, BIOS, virtual machine monitor (VMM) and, for some uses, certain platform software enabled for it. Functionality,
performance or other benefits will vary depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check
with your application vendor.
2
64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel
®
64 architecture. Performance will vary
depending on your hardware and software configurations. Consult with your system vendor for more information.
3
No computer system can provide absolute security under all conditions. Intel
®
Trusted Execution Technology (Intel
®
TXT) requires a computer system with Intel
®
Virtualization Technology, an Intel TXT-enabled
processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible measured launched environment (MLE). The MLE could consist of a virtual machine monitor, an OS or an application. In addi-
tion, Intel TXT requires the system to contain a TPM v1.2, as defined by the Trusted Computing Group and specific software for some uses. For more information, see http://www.intel.com/technology/security
4
Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check with your PC manufacturer on whether your system delivers
Execute Disable Bit functionality.
5
SFF = Small Form Factor package.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL
®
PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROP-
ERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,
AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A
PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL,
THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
ntel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or
I
instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from
future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may
contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order
number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or by visiting Intel’s Web Site www.intel.com/.
Intel, the Intel logo, and Intel Core are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2009 Intel Corporation. All rights reserved.
Printed in USA
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Intel® Core™2 Duo Processor T7400 (4M Cache, 2.16 GHz, 667 MHz FSB)
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Product Specs
Intel® Processors
Intel® Core™2 Duo Mobile Processor
Intel® Core™2 Duo Processor T7000 Series
T7400
Intel® Core™2 Duo Processor T7400
(4M Cache, 2.16 GHz, 667 MHz FSB)
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LF80537GF0484MSLGFJ LE80537GF0484MSL9SK LE80537GF0484MSLGFV LF80537GF0484MSL9SE BX80537T7400SL9SE
Description Microprocessor, 64-Bit, 2160MHz, CMOS, CPGA478, UFCPGA-478 Microprocessor, 64-Bit, 2160MHz, CMOS, PBGA479, UFCBGA-479 Microprocessor, 64-Bit, 2160MHz, CMOS, PBGA479, UFCBGA-479 Microprocessor, 64-Bit, 2160MHz, CMOS, CPGA478, UFCPGA-478 Microprocessor, 64-Bit, 2160MHz, CMOS, CPGA478, UFCPGA-478
Maker Intel Intel Intel Intel Intel
Parts packaging code PGA BGA BGA PGA PGA
package instruction UFCPGA-478 UFCBGA-479 UFCBGA-479 UFCPGA-478 PGA,
Contacts 478 479 479 478 478
Reach Compliance Code compliant unknown compliant unknow unknow
bit size 64 64 64 64 64
boundary scan NO NO NO NO NO
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache YES YES YES YES YES
JESD-30 code X-CPGA-P478 X-PBGA-B479 X-PBGA-B479 X-CPGA-P478 X-CPGA-P478
low power mode YES YES YES YES YES
Number of terminals 478 479 479 478 478
Package body material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code PGA BGA BGA PGA PGA
Package shape UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
speed 2160 MHz 2160 MHz 2160 MHz 2160 MHz 2160 MHz
surface mount NO YES YES NO NO
technology CMOS CMOS CMOS CMOS CMOS
Terminal form PIN/PEG BALL BALL PIN/PEG PIN/PEG
Terminal location PERPENDICULAR BOTTOM BOTTOM PERPENDICULAR PERPENDICULAR
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR
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