MCM36200ASG80 datasheet, PDF - EEWORLD Datasheet

MCM36200ASG80: DescriptionMEMORY MODULE,DRAM,FAST PAGE,2MX36,CMOS,SSIM,72PIN,PLASTIC; Categorystorage storage; File Size840KB，12 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MCM36200ASG80 Overview

MEMORY MODULE,DRAM,FAST PAGE,2MX36,CMOS,SSIM,72PIN,PLASTIC

Parameter Name	Attribute value
Maker	NXP
package instruction	SIMM, SSIM72
Reach Compliance Code	unknown
Maximum access time	80 ns
I/O type	COMMON
JESD-30 code	R-PSMA-N72
memory density	75497472 bit
Memory IC Type	FAST PAGE DRAM MODULE
memory width	36
Number of terminals	72
word count	2097152 words
character code	2000000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SIMM
Encapsulate equivalent code	SSIM72
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	5 V
Certification status	Not Qualified
refresh cycle	1024
Maximum seat height	31.877 mm
Maximum standby current	0.024 A
Maximum slew rate	0.984 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	SINGLE

	MCM36200ASG80
Description	MEMORY MODULE,DRAM,FAST PAGE,2MX36,CMOS,SSIM,72PIN,PLASTIC
Maker	NXP
package instruction	SIMM, SSIM72
Reach Compliance Code	unknown
Maximum access time	80 ns
I/O type	COMMON
JESD-30 code	R-PSMA-N72
memory density	75497472 bit
Memory IC Type	FAST PAGE DRAM MODULE
memory width	36
Number of terminals	72
word count	2097152 words
character code	2000000
Maximum operating temperature	70 °C
organize	2MX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SIMM
Encapsulate equivalent code	SSIM72
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	5 V
Certification status	Not Qualified
refresh cycle	1024
Maximum seat height	31.877 mm
Maximum standby current	0.024 A
Maximum slew rate	0.984 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	SINGLE

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