M5M23401AP datasheet, PDF - EEWORLD Datasheet

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M5M23401AP: DescriptionMASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32; Categorystorage storage; File Size112KB，3 Pages; ManufacturerMitsubishi; Websitehttp://www.mitsubishielectric.com/semiconductors/

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M5M23401AP Overview

MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

M5M23401AP Parametric

Parameter Name	Attribute value
Maker	Mitsubishi
Parts packaging code	DIP
package instruction	0.600 INCH, PLASTIC, DIP-32
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	150 ns
JESD-30 code	R-PDIP-T32
length	40.6 mm
memory density	4194304 bit
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.1 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

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M5M23401AP Related Products

	M5M23401AP	M5M23401AFP	M5M23401ARV	M5M23401AVP
Description	MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	MASK ROM, 512KX8, 150ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32	MASK ROM, 512KX8, 150ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, REVERSE, TSOP1-40	MASK ROM, 512KX8, 150ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, TSOP1-40
Maker	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi
Parts packaging code	DIP	SOIC	TSOP1	TSOP1
package instruction	0.600 INCH, PLASTIC, DIP-32	SOP,	TSOP1-R,	TSOP1,
Contacts	32	32	40	40
Reach Compliance Code	unknown	unknown	unknow	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	150 ns	150 ns	150 ns	150 ns
JESD-30 code	R-PDIP-T32	R-PDSO-G32	R-PDSO-G40	R-PDSO-G40
length	40.6 mm	20.75 mm	12.4 mm	12.4 mm
memory density	4194304 bit	4194304 bit	4194304 bi	4194304 bi
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	32	32	40	40
word count	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	512KX8	512KX8	512KX8	512KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	TSOP1-R	TSOP1
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.1 mm	3.05 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING
Terminal pitch	2.54 mm	1.27 mm	0.5 mm	0.5 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
width	15.24 mm	11.4 mm	10 mm	10 mm

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