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M5M23401AVP

Description
MASK ROM, 512KX8, 150ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, TSOP1-40
Categorystorage    storage   
File Size112KB,3 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
Download Datasheet Parametric Compare View All

M5M23401AVP Overview

MASK ROM, 512KX8, 150ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, TSOP1-40

M5M23401AVP Parametric

Parameter NameAttribute value
MakerMitsubishi
Parts packaging codeTSOP1
package instructionTSOP1,
Contacts40
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time150 ns
JESD-30 codeR-PDSO-G40
length12.4 mm
memory density4194304 bi
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals40
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
width10 mm

M5M23401AVP Related Products

M5M23401AVP M5M23401AP M5M23401AFP M5M23401ARV
Description MASK ROM, 512KX8, 150ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, TSOP1-40 MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 MASK ROM, 512KX8, 150ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 MASK ROM, 512KX8, 150ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, REVERSE, TSOP1-40
Maker Mitsubishi Mitsubishi Mitsubishi Mitsubishi
Parts packaging code TSOP1 DIP SOIC TSOP1
package instruction TSOP1, 0.600 INCH, PLASTIC, DIP-32 SOP, TSOP1-R,
Contacts 40 32 32 40
Reach Compliance Code unknow unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum access time 150 ns 150 ns 150 ns 150 ns
JESD-30 code R-PDSO-G40 R-PDIP-T32 R-PDSO-G32 R-PDSO-G40
length 12.4 mm 40.6 mm 20.75 mm 12.4 mm
memory density 4194304 bi 4194304 bit 4194304 bit 4194304 bi
Memory IC Type MASK ROM MASK ROM MASK ROM MASK ROM
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 40 32 32 40
word count 524288 words 524288 words 524288 words 524288 words
character code 512000 512000 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 512KX8 512KX8 512KX8 512KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 DIP SOP TSOP1-R
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE IN-LINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 5.1 mm 3.05 mm 1.2 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES NO YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING THROUGH-HOLE GULL WING GULL WING
Terminal pitch 0.5 mm 2.54 mm 1.27 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL
width 10 mm 15.24 mm 11.4 mm 10 mm
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