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HM3-7616-7

Description
HM3-7616-7
Categorystorage    storage   
File Size132KB,3 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

HM3-7616-7 Overview

HM3-7616-7

HM3-7616-7 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
package instructionDIP, DIP24,.6
Reach Compliance Codenot_compliant
JESD-30 codeR-PDIP-T24
JESD-609 codee0
memory density16384 bit
Memory IC TypeOTP ROM
memory width8
Number of terminals24
word count2048 words
character code2000
Maximum operating temperature70 °C
Minimum operating temperature
organize2KX8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

HM3-7616-7 Related Products

HM3-7616-7 HM1-7616-5 HM1-7616-2 HM3-7616-5 HM1-7616-7 HM1-7616-8
Description HM3-7616-7 HM1-7616-5 IC,PROM,2KX8,TTL,DIP,24PIN,CERAMIC HM3-7616-5 HM1-7616-7 HM1-7616-8
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP24,.6 DIP, DIP24,.6 DIP, DIP24,.6 DIP, DIP24,.6 DIP, DIP24,.6 DIP, DIP24,.6
Reach Compliance Code not_compliant _compli not_compliant not_compliant not_compliant not_compliant
JESD-30 code R-PDIP-T24 R-XDIP-T24 R-XDIP-T24 R-PDIP-T24 R-XDIP-T24 R-XDIP-T24
JESD-609 code e0 e0 e0 e0 e0 e0
memory density 16384 bit 16384 bi 16384 bit 16384 bit 16384 bit 16384 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8 8 8
Number of terminals 24 24 24 24 24 24
word count 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000 2000 2000
Maximum operating temperature 70 °C 70 °C 125 °C 70 °C 70 °C 125 °C
organize 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8
Package body material PLASTIC/EPOXY CERAMIC CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC
encapsulated code DIP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP24,.6 DIP24,.6 DIP24,.6 DIP24,.6 DIP24,.6 DIP24,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
surface mount NO NO NO NO NO NO
technology TTL TTL TTL TTL TTL TTL
Temperature level COMMERCIAL COMMERCIAL MILITARY COMMERCIAL COMMERCIAL MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maker Renesas Electronics Corporation - Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Certification status - Not Qualified Not Qualified Not Qualified - Not Qualified
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