HM3-7616-5 datasheet, PDF - EEWORLD Datasheet

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HM3-7616-5: DescriptionHM3-7616-5; Categorystorage storage; File Size132KB，3 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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HM3-7616-5 Overview

HM3-7616-5

HM3-7616-5 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
package instruction	DIP, DIP24,.6
Reach Compliance Code	not_compliant
JESD-30 code	R-PDIP-T24
JESD-609 code	e0
memory density	16384 bit
Memory IC Type	OTP ROM
memory width	8
Number of terminals	24
word count	2048 words
character code	2000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2KX8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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HM3-7616-5 Related Products

	HM3-7616-5	HM1-7616-5	HM1-7616-2	HM3-7616-7	HM1-7616-7	HM1-7616-8
Description	HM3-7616-5	HM1-7616-5	IC,PROM,2KX8,TTL,DIP,24PIN,CERAMIC	HM3-7616-7	HM1-7616-7	HM1-7616-8
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6
Reach Compliance Code	not_compliant	_compli	not_compliant	not_compliant	not_compliant	not_compliant
JESD-30 code	R-PDIP-T24	R-XDIP-T24	R-XDIP-T24	R-PDIP-T24	R-XDIP-T24	R-XDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0
memory density	16384 bit	16384 bi	16384 bit	16384 bit	16384 bit	16384 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8
Number of terminals	24	24	24	24	24	24
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000
Maximum operating temperature	70 °C	70 °C	125 °C	70 °C	70 °C	125 °C
organize	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
surface mount	NO	NO	NO	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	Renesas Electronics Corporation	-	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Certification status	Not Qualified	Not Qualified	Not Qualified	-	-	Not Qualified

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