Notices
Before using this information and the product it supports, be sure to read the general information on the
back cover of this book.
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The following are trademarks of International Business Machines Corporation in the United States, or
other countries, or both:
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AIX
PowerPC 750
Other company, product, and service names may be trademarks or service marks of others.
This document contains information on a new product under development by IBM. IBM reserves the
right to change or discontinue this product without notice.
© International Business Machines Corporation 1999.
Portions hereof ©International Business Machines Corporation, 1991-1999.
All rights reserved.
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
Table of Contents
Preface ..................................................................................................................................................... 1
Overview ................................................................................................................................................... 1
Features ................................................................................................................................................... 3
General Parameters ................................................................................................................................. 6
Electrical and Thermal Characteristics ..................................................................................................... 7
DC Electrical Characteristics ................................................................................................................ 7
AC Electrical Characteristics .................................................................................................................. 11
Clock AC Specifications ...................................................................................................................... 11
60x Bus Input AC Specifications ......................................................................................................... 12
60x Bus Output AC Specifications ...................................................................................................... 14
L2 Clock AC Specifications ................................................................................................................. 16
L2 Bus Input AC Specifications ........................................................................................................... 18
L2 Bus Output AC Specifications ........................................................................................................ 19
IEEE 1149.1 AC Timing Specifications .................................................................................................. 20
PowerPC 740 Microprocessor Pin Assignments .................................................................................... 22
PowerPC 740 Microprocessor Pinout Listings ....................................................................................... 23
PowerPC 740 Package .......................................................................................................................... 26
Mechanical Dimensions of the 255 CBGA Package ........................................................................... 27
PowerPC 750 Microprocessor Pin Assignments .................................................................................... 28
PowerPC 750 Package .......................................................................................................................... 32
Mechanical Dimensions of the 360 CBGA Package........................................................................... 33
System Design Information .................................................................................................................... 35
PLL Configuration ............................................................................................................................... 35
PLL Power Supply Filtering ................................................................................................................. 36
Decoupling Recommendations ........................................................................................................... 36
Connection Recommendations ........................................................................................................... 36
Output Buffer DC Impedance .............................................................................................................. 37
Pull-up Resistor Requirements ........................................................................................................... 38
Thermal Management Information ...................................................................................................... 39
Internal Package Conduction Resistance ........................................................................................... 40
Heat Sink Selection Example .............................................................................................................. 43
Ordering Information ............................................................................................................................... 45
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PowerPC 740 and PowerPC 750 Datasheet
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PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
Preface
The PowerPC 740 and PowerPC 750 embedded microprocessors are implementations of the PowerPC
TM
family of reduced instruction set computer (RISC) microprocessors. This document covers PowerPC 740 and
PowerPC 750 microprocessors using the IBM CMOS 7S 0.20 um copper technology. In this document, “740”
refers to the PowerPC 740 microprocessor, and “750” refers to the PowerPC 750 microprocessor, with the
document’s primary focus on the features of the 750 microprocessor; however, unless otherwise noted, all
features apply equally to the 740 microprocessor.
The 740 uses the same die as the 750, but the 740 does not pin out the L2 cache interface.
Overview
The 750 is targeted for high performance, low power systems and supports the following power management
features: doze, nap, sleep, and dynamic power management. The 750 consists of a processor core and an
internal L2 Tag combined with a dedicated L2 cache interface and a 60x bus. The L2 cache is not available
with the 740.
Figure 1 shows a block diagram of the 750.
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PowerPC 740 and PowerPC 750 Datasheet
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