or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
1
DS1020_23.3
Lattice Semiconductor
Table 2. ispMACH 4000Z Family Selection Guide
ispMACH 4032ZC
Macrocells
I/O + Dedicated Inputs
t
PD
(ns)
t
S
(ns)
t
CO
(ns)
f
MAX
(MHz)
Supply Voltage (V)
Max. Standby Icc (µA)
Pins/Package
32
32+4/32+4
3.5
2.2
3.0
267
1.8
20
48 TQFP
56 csBGA
ispMACH 4000V/B/C/Z Family Data Sheet
ispMACH 4064ZC
64
32+4/32+12/
64+10/64+10
3.7
2.5
3.2
250
1.8
25
48 TQFP
56 csBGA
100 TQFP
132 csBGA
ispMACH 4128ZC
128
64+10/96+4
4.2
2.7
3.5
220
1.8
35
ispMACH 4256ZC
256
64+10/96+6/
128+4
4.5
2.9
3.8
200
1.8
55
100 TQFP
132csBGA
100 TQFP
132 csBGA
176 TQFP
ispMACH 4000 Introduction
The high performance ispMACH 4000 family from Lattice offers a SuperFAST CPLD solution. The family is a blend
of Lattice’s two most popular architectures: the ispLSI
®
2000 and ispMACH 4A. Retaining the best of both families,
the ispMACH 4000 architecture focuses on significant innovations to combine the highest performance with low
power in a flexible CPLD family.
The ispMACH 4000 combines high speed and low power with the flexibility needed for ease of design. With its
robust Global Routing Pool and Output Routing Pool, this family delivers excellent First-Time-Fit, timing predictabil-
ity, routing, pin-out retention and density migration.
The ispMACH 4000 family offers densities ranging from 32 to 512 macrocells. There are multiple density-I/O com-
binations in Thin Quad Flat Pack (TQFP), Chip Scale BGA (csBGA) and Fine Pitch Thin BGA (ftBGA) packages
ranging from 44 to 256 pins/balls. Table 1 shows the macrocell, package and I/O options, along with other key
parameters.
The ispMACH 4000 family has enhanced system integration capabilities. It supports 3.3V (4000V), 2.5V (4000B)
and 1.8V (4000C/Z) supply voltages and 3.3V, 2.5V and 1.8V interface voltages. Additionally, inputs can be safely
driven up to 5.5V when an I/O bank is configured for 3.3V operation, making this family 5V tolerant. The ispMACH
4000 also offers enhanced I/O features such as slew rate control, PCI compatibility, bus-keeper latches, pull-up
resistors, pull-down resistors, open drain outputs and hot socketing. The ispMACH 4000 family members are 3.3V/
2.5V/1.8V in-system programmable through the IEEE Standard 1532 interface. IEEE Standard 1149.1 boundary
scan testing capability also allows product testing on automated test equipment. The 1532 interface signals TCK,
TMS, TDI and TDO are referenced to V
CC
(logic core).
Overview
The ispMACH 4000 devices consist of multiple 36-input, 16-macrocell Generic Logic Blocks (GLBs) interconnected
by a Global Routing Pool (GRP). Output Routing Pools (ORPs) connect the GLBs to the I/O Blocks (IOBs), which
contain multiple I/O cells. This architecture is shown in Figure 1.
2
Lattice Semiconductor
Figure 1. Functional Block Diagram
CLK0/I
CLK1/I
CLK2/I
CLK3/I
V
CCO0
GND
ispMACH 4000V/B/C/Z Family Data Sheet
I/O
Block
ORP
I/O Bank 0
16
Global Routing Pool
Generic
Logic
Block
16
36
16
36
Generic
16
Logic
Block
I/O
Block
ORP
I/O Bank 1
I/O
Block
ORP
16
Generic
Logic
Block
16
36
16
36
Generic
16
Logic
Block
I/O
Block
ORP
The I/Os in the ispMACH 4000 are split into two banks. Each bank has a separate I/O power supply. Inputs can
support a variety of standards independent of the chip or bank power supply. Outputs support the standards com-
patible with the power supply provided to the bank. Support for a variety of standards helps designers implement
designs in mixed voltage environments. In addition, 5V tolerant inputs are specified within an I/O bank that is con-
nected to V
CCO
of 3.0V to 3.6V for LVCMOS 3.3, LVTTL and PCI interfaces.
ispMACH 4000 Architecture
There are a total of two GLBs in the ispMACH 4032, increasing to 32 GLBs in the ispMACH 4512. Each GLB has
36 inputs. All GLB inputs come from the GRP and all outputs from the GLB are brought back into the GRP to be
connected to the inputs of any other GLB on the device. Even if feedback signals return to the same GLB, they still
must go through the GRP. This mechanism ensures that GLBs communicate with each other with consistent and
predictable delays. The outputs from the GLB are also sent to the ORP. The ORP then sends them to the associ-
ated I/O cells in the I/O block.
Generic Logic Block
The ispMACH 4000 GLB consists of a programmable AND array, logic allocator, 16 macrocells and a GLB clock
generator. Macrocells are decoupled from the product terms through the logic allocator and the I/O pins are decou-
pled from macrocells through the ORP. Figure 2 illustrates the GLB.
3
V
CCO1
GND
GOE0
GOE1
V
CC
GND
TCK
TMS
TDI
TDO
Lattice Semiconductor
Figure 2. Generic Logic Block
CLK0
CLK1
CLK2
CLK3
ispMACH 4000V/B/C/Z Family Data Sheet
To GRP
Clock
Generator
1+OE
16 MC Feedback Signals
1+OE
1+OE
1+OE
1+OE
1+OE
1+OE
1+OE
To ORP
To
Product Term
Output Enable
Sharing
Logic Allocator
36 Inputs
from GRP
AND Array
The programmable AND Array consists of 36 inputs and 83 output product terms. The 36 inputs from the GRP are
used to form 72 lines in the AND Array (true and complement of the inputs). Each line in the array can be con-
nected to any of the 83 output product terms via a wired-AND. Each of the 80 logic product terms feed the logic
allocator with the remaining three control product terms feeding the Shared PT Clock, Shared PT Initialization and
Shared PT OE. The Shared PT Clock and Shared PT Initialization signals can optionally be inverted before being
fed to the macrocells.
Every set of five product terms from the 80 logic product terms forms a product term cluster starting with PT0.
There is one product term cluster for every macrocell in the GLB. Figure 3 is a graphical representation of the AND
Array.
AND Array
36 Inputs,
83 Product Terms
4
16 Macrocells
Lattice Semiconductor
Figure 3. AND Array
In[0]
In[34]
In[35]
ispMACH 4000V/B/C/Z Family Data Sheet
PT0
PT1
PT2
PT3
PT4
Cluster 0
PT75
PT76
PT77
Cluster 15
PT78
PT79
PT80 Shared PT Clock
PT81 Shared PT Initialization
PT82 Shared PTOE
Note:
Indicates programmable fuse.
Enhanced Logic Allocator
Within the logic allocator, product terms are allocated to macrocells in product term clusters. Each product term
cluster is associated with a macrocell. The cluster size for the ispMACH 4000 family is 4+1 (total 5) product terms.
The software automatically considers the availability and distribution of product term clusters as it fits the functions
within a GLB. The logic allocator is designed to provide three speed paths: 5-PT fast bypass path, 20-PT Speed
Locking path and an up to 80-PT path. The availability of these three paths lets designers trade timing variability for
increased performance.
The enhanced Logic Allocator of the ispMACH 4000 family consists of the following blocks:
• Product Term Allocator
• Cluster Allocator
• Wide Steering Logic
Figure 4 shows a macrocell slice of the Logic Allocator. There are 16 such slices in the GLB.
As China's No. 1 professional manager, Tang Jun said that his life has no adventures and he has never taken any shortcuts. "If I can succeed, why can't you?" When I joined Microsoft, I was just an ord...
A few days ago, my wife scolded me, "Look at your broken electric abacus, it's so dirty, clean it." Since the queen has ordered us to change it, so I went straight to Xiubo Ma Street (SuperMaket) and ...
[i=s] This post was last edited by 5之丹公英 on 2016-5-7 21:51 [/i] I saw the classification of op amps on the ADI official website,I am going to make an output conditioning for a capacitive sensor recent...
First of all, my WINCE system supports WinSock2, so I can use the functions of the WinSock2 library. In my program, I want to create a multicast socket creation function: SOCKET WSASocket( int af, int...
Reprint Reprint Reprint Reprint Reprint ReprintDecompression password: a123654 (Don’t download it, you won’t be able to read it even if you download it)00 - C Language"C Programming Language (Second E...
In recent years, with the increasing demand for manufacturing and automated production management, industrial barcode scanners have gradually become an indispensable part of the industrial manufact...[Details]
We are entering a new era where people are increasingly affordably equipped with more electronic gadgets. Electronics have become essential to our lives. For example, the average consumer now owns ...[Details]
Today's security industry has entered the era of massive networking. Many enterprises, especially financial institutions, have established multi-level video surveillance networking platforms. Lever...[Details]
White light LEDs are voltage-sensitive devices. In actual operation, their upper limit is 20mA. However, the current often increases due to various reasons during use. If no protective measures are...[Details]
The Automotive Testing and Quality Assurance Expo (ATE 2025) will open on August 27th. At the expo, Rohde & Schwarz (R&S) will showcase six automotive testing solutions, themed "Intelligently Drivi...[Details]
Recently, South Korean robotics giant WIRobotics launched its first general-purpose humanoid robot, ALLEX, at the Robotics Innovation Center (RIH) at the Korea University of Science and Technology....[Details]
The automotive industry in 2025 is undergoing a thorough intelligent reshuffle.
Geely wants to make changes in the field of AI cockpits: in the future, there will be no traditional smart...[Details]
In June 2014, the Ministry of Industry and Information Technology issued 4G FD-LTE licenses to China Unicom and China Telecom. Together with the 4G TD-LTE licenses issued to China Mobile, China Uni...[Details]
One of the most core components of electric vehicles is the motor. The power supply provides electrical energy to the motor, which converts this electrical energy into mechanical energy, which in t...[Details]
1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
China, August 21, 2025 – STMicroelectronics (NYSE: STM), a world-leading semiconductor company serving a wide range of electronics applications, has published its IFRS 2025 semi-annual financial re...[Details]
For today's new energy vehicles, they have different configurations from fuel vehicles, and some configurations have also become a selling point for manufacturers. Compared with traditional vehicle...[Details]
Analog Devices held a third-quarter fiscal 2025 earnings conference call. Vincent T. Roche, CEO and Chairman of the Board, and Richard C. Puccio, Executive Vice President and Chief Financial Office...[Details]
introduction
The rapid adoption of computers has led to a growing number of tasks being performed on them. People from all walks of life, especially programmers and writers, are spending incre...[Details]
Definitions of VR
, AR, and MR:
What is Virtual Reality?
Virtual Reality (VR), also known as "spiritual realm" or "illusion," is a high-tech technology that has emerged in recent ye...[Details]
Talking about work
京公网安备 11010802033920号
EEWORLD
