L6116MM35L datasheet, PDF - EEWORLD Datasheet

L6116MM35L: DescriptionStandard SRAM, 2KX8, 35ns, CMOS, CDFP24, CERAMIC, FP-24; Categorystorage storage; File Size495KB，7 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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L6116MM35L Overview

Standard SRAM, 2KX8, 35ns, CMOS, CDFP24, CERAMIC, FP-24

Parameter Name	Attribute value
Maker	LOGIC Devices
Parts packaging code	DFP
package instruction	DFP,
Contacts	24
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	35 ns
JESD-30 code	R-CDFP-F24
length	16.002 mm
memory density	16384 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	24
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2KX8
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	2.286 mm
Minimum standby current	2 V
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
width	9.017 mm

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