Altilon LEDs are specifically designed and tested to meet and exceed
expectations for reliability, performance, and lifetime in automotive forward lighting
applications. With advanced technologies, LUXEON Altilon meets both SAE and
ECE color specifications and provides finer granularity than existing systems. PPAP
documentation is available upon request. LUXEON Altilon LEDs provide significant
flexibility and are superior LED products for:
Hg
•
High Beam/Low Beam
•
Daytime Running Lights (DRL)
•
Static Bending Lights
•
Position Lamps
•
AFS Functionality
Table of Contents
Product Information .....................................................................................................................................................3
Part Number Description .........................................................................................................................................3
Test Conditions for Optical Characteristics .......................................................................................................3
Typical Electrical Characteristics at Temperature Extremes .............................................................................8
Typical DC Forward Current vs. Forward Voltage ................................................................................................9
Absolute Maximum Ratings ......................................................................................................................................10
Reliability Expectations and Thermal Design Requirements .............................................................................11
Color Bin Definitions .................................................................................................................................................14
Flux Bin Definitions ....................................................................................................................................................16
Typical Color vs. Angle .............................................................................................................................................17
Color Shift vs. Case Temperature ............................................................................................................................18
Color Shift vs. DC Drive Current ...........................................................................................................................19
Packing Information ....................................................................................................................................................21
Product Labeling Information ...................................................................................................................................24
LUXEON Altilon Datasheet DS66 20130320
2
Product Information
Part Number Description
LUXEON Altilon LEDs are tested and binned at 1000 mA, with current pulse duration of 20ms.
LUXEON Altilon
L
A
F
L
-
C
Default
2
Number of Chips -
2 or 4
S
Solder or Spade
Lugs - S or L
-
X
X
X
X
Standard Prefix for LUXEON Altilon
Minimum Flux Bin
LUXEON Altilon Core
L
A
C
L
-
C
Default
2
Number of Chips -
2 or 4
S
Solder
Configuration
-
X
X
X
X
Standard Prefix for LUXEON Altilon Core
Minimum Flux Bin
Test Conditions for Optical Characteristics
Junction Temperature vs. Case Temperature
Philips Lumileds specifies performance at constant case temperature for LUXEON Altilon. This datasheet specifies performance at constant case
temperature of 25°C, except where noted. The data sheet that follows will specify performance at constant case temperature of 25°C.
Case temperature refers to the temperature of a thermocouple mounted under the head of one of the mounting screws, and is a value that can
be measured rather than calculated (see Figure 7). A junction-to-case thermal resistance of 2.1°C/W is assumed for the 1x2 configuration and
1.4°C/W for the 1x4 configuration. This approach will more accurately capture product performance capabilities compared to average junction
temperature alone.
Environmental Compliance
Philips Lumileds is committed to providing environmentally friendly products to the lighting industry. LUXEON Altilon is compliant to the
European Union directives on the restriction of hazardous substances in electronic equipment, namely, the RoHS, ELV, and REACH directives.
Philips Lumileds will not intentionally add the following restricted materials to the LUXEON Altilon product: lead, mercury, cadmium, hexvalent
chromium, polybrominated biphenyls (PBB), or polybrominated diphenyl ethers (PBDE).
LUXEON Altilon Datasheet DS66 20130320
3
Optical Characteristics
Measured and Typical Optical Performance by Part Number
Table 1.
Part Number
LAFL - C2* - 0350
LAFL - C2* - 0425
LAFL - C2* - 0500
LAFL - C4* - 0700
LAFL - C4* - 0850
LAFL - C4* - 0925
LAFL - C4* - 1000
LAFL - C4* - 1050
LACL - C2S - 0350
LACL - C2S - 0425
LACL - C2S - 0500
LACL - C4S - 0700
LACL - C4S - 0850
LACL - C4S - 0925
LACL - C4S - 1000
LACL - C4S - 1050
Form Factor
1x2
1x2
1x2
1x4
1x4
1x4
1x4
1x4
1x2
1x2
1x2
1x4
1x4
1x4
1x4
1x4
Measured Test Condition
I000 mA Pulsed Operation (20 msec)
Case Temperature T
c
= 25°C
Minimum Luminous Flux (lm)
[I,2]
350
425
500
700
850
925
1000
1050
350
425
500
700
850
925
1000
1050
LUXEON Altilon
LUXEON Altilon Core
Notes for Table 1:
1. Philips Lumileds tests flux values via a pulsed measurement at a case temperature of 25°C.
2. Minimum luminous flux guaranteed within published operating conditions. Philips Lumileds maintains a tolerance of ± 10% on flux
measurements.
3. ‘*’ Indicates the inclusion or exclusion of the spade lug connector, indicated with an ‘L’ for spade lug, and an ‘S’ for those parts without.
See Part Number Description below for more details.
LUXEON Altilon Datasheet DS66 20130320
4
Typical Luminance Performance
Typical luminance is calculated based on the total lumens emitted from the smallest rectangle covering the optical source. This method accounts for
variations in chip and phosphor placement as well as spacing between discrete chips. Figure 1 below indicates the orientation used to determine the
source area used for luminance calculations.
D
imension
Y
X D
imension
Figure 1. Area surrounding optical source for luminance measurements.
For the 1x4 configuration, the typical X and Y dimensions are 4.51 and 1.06 mm, respectively.
For the 1x2 configuration, the typical X and Y dimensions are 2.21 and 1.06 mm, respectively.
Typical Use Condition Matrix—Relative Flux
Normalized to T
c
= 25°C, 1000 mA, 20 msec pulses
The graphs on the next page predict the relative flux under various use conditions normalized to the test conditions of 1000 mA pulsed operation
(20 msec pulse) at case temperature of 25°C. These graphs can be used to determine the effects of case temperature and forward current on the
values of minimum and typical flux to define performance at the expected use condition. For example:
Given a flux at T
c
= 25°C and 1000 mA (20 msec pulse) of 700 lm for 1x4 configuration, the flux value under different conditions can be predicted.
If expected use condition is 700 mA at T
c
= 100°C, the relative percentage of flux would be approximately 70% of the reference value.
The interface obtains this data a[40] and displays it in real time on the interface. Now I use a timer to update it at regular intervals. Does anyone have a better way to update the data?...
Looking for driver development experts to cooperate, mainly in Windows and embedded Linux. The main content is development guidance, consulting and training. Details will be given later. If you are in...
Hello everyone, thank you for reading this post! I am a fresh graduate from a local university, and my major is electronic information engineering. In late May 2006, I decided to go out to work sudden...
I only wrote a program to set the 11th pin of GPIOB, and did not touch other pins. The voltage is always 0. Why is that? The pin clock and other settings are all correct. It is set to output mode. I a...
Reflow soldering is a critical process in electronics assembly production, and the cleanliness of the reflow oven has a direct impact on product quality. Dust and residue accumulation within the ov...[Details]
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
The structure of an LCD TV primarily consists of the LCD display module, power module, driver module (primarily including the main driver board and tuner board), and keypad module. LCD display modu...[Details]
For healthcare professionals, accurate diagnosis and treatment are crucial for a clear picture of a person's health. However, healthcare professionals often rely on tests at medical facilities, cli...[Details]
Amidst the wave of intelligent automotive transformation, advanced driver assistance is gradually emerging from cutting-edge technology into the mainstream, becoming a new frontier of industry comp...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
Gross profit margin jumped from 13.6% in the first half of last year to 25.9%, almost doubling year-on-year.
On August 21, RoboSense released its interim performance report, in which the...[Details]
On August 22, South Korean media Nate reported on the 20th local time that Samsung Electronics is introducing Hyper Cell technology into its most advanced 2nm process technology, striving to improv...[Details]
Smartphones have become essential digital devices, and the growing number of smartphone-centric applications is enriching people's lives. As users, they desire a better app experience and a wider r...[Details]
Charging is a familiar process for new energy vehicles, and as a source of battery energy, charging piles are crucial. New energy vehicle charging can be divided into fast charging and slow chargin...[Details]
PowiGaN achieves 95% efficiency at both light and full loads, meeting critical operational and safety requirements.
DARWIN, Australia and SAN JOSE, Calif.,
August 22, 2025 – Powe...[Details]
1. Fault phenomenon and cause analysis
1. During the operation of the equipment, the expansion sleeve is subjected to a large torque, and the mating surfaces of the shaft and the sleeve move...[Details]
During daily operation of an R-type power transformer, the voltage used varies as the equipment being used adjusts. This raises the question: can the transformer change voltage at this point? The a...[Details]
In the field of communications power supplies, AC/DC rectifier power supplies are called primary power supplies or basic power supplies, while DC/DC converters are called secondary power supplies. ...[Details]
Common methods for troubleshooting roller press bearing wear include repair welding, thermal spraying, brush plating, and scrapping and replacement. However, these methods are often subject to asse...[Details]