5962-01-333-2525 datasheet, PDF

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5962-01-333-2525: DescriptionIC,SIMPLE-PLD,PAL-TYPE,CMOS,DIP,20PIN,CERAMIC; CategoryProgrammable logic devices Programmable logic; File Size478KB，7 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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5962-01-333-2525 Overview

IC,SIMPLE-PLD,PAL-TYPE,CMOS,DIP,20PIN,CERAMIC

5962-01-333-2525 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
package instruction	DIP, DIP20,.3
Reach Compliance Code	not_compliant
ECCN code	3A001.A.2.C
Architecture	PAL-TYPE
JESD-30 code	R-XDIP-T20
Number of entries	16
Output times	8
Number of product terms	64
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output function	COMBINATORIAL
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Programmable logic type	OT PLD
propagation delay	125 ns
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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5962-01-333-2525 Related Products

	5962-01-333-2525	HPL7-16LC8-5	HPL1-16LC8-2	HPL3-16LC8-5
Description	IC,SIMPLE-PLD,PAL-TYPE,CMOS,DIP,20PIN,CERAMIC	HPL7-16LC8-5	HPL1-16LC8-2	HPL3-16LC8-5
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant
Architecture	PAL-TYPE	PAL-TYPE	PAL-TYPE	PAL-TYPE
JESD-30 code	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20	R-PDIP-T20
Number of entries	16	16	16	16
Output times	8	8	8	8
Number of product terms	64	64	64	64
Number of terminals	20	20	20	20
Maximum operating temperature	125 °C	70 °C	125 °C	70 °C
Output function	COMBINATORIAL	COMBINATORIAL	COMBINATORIAL	COMBINATORIAL
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V
Programmable logic type	OT PLD	OT PLD	OT PLD	OT PLD
propagation delay	125 ns	125 ns	125 ns	125 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
JESD-609 code	-	e0	e0	e0
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)

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