CY7C1388-25PC datasheet, PDF - EEWORLD Datasheet

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CY7C1388-25PC: DescriptionCache SRAM, 32KX9, 25ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32; Categorystorage storage; File Size196KB，6 Pages; ManufacturerCypress Semiconductor

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CY7C1388-25PC Overview

Cache SRAM, 32KX9, 25ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32

CY7C1388-25PC Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Parts packaging code	DIP
package instruction	0.300 INCH, PLASTIC, DIP-32
Contacts	32
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	25 ns
Other features	AUTOMATIC POWER-DOWN
I/O type	COMMON
JESD-30 code	R-PDIP-T32
JESD-609 code	e0
memory density	294912 bit
Memory IC Type	CACHE SRAM
memory width	9
Number of functions	1
Number of ports	1
Number of terminals	32
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX9
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP32,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum standby current	0.00005 A
Minimum standby current	2 V
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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CY7C1388-25PC Related Products

	CY7C1388-25PC	CY7C1388-35PC	CY7C1388-20PC	CY7C1388-35VC	CY7C1388-20VC	CY7C1388-25VC
Description	Cache SRAM, 32KX9, 25ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32	Cache SRAM, 32KX9, 35ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32	Cache SRAM, 32KX9, 20ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32	Cache SRAM, 32KX9, 35ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32	Cache SRAM, 32KX9, 20ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32	Cache SRAM, 32KX9, 25ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
Parts packaging code	DIP	DIP	DIP	SOJ	SOJ	SOJ
package instruction	0.300 INCH, PLASTIC, DIP-32	0.300 INCH, PLASTIC, DIP-32	0.300 INCH, PLASTIC, DIP-32	0.300 INCH, PLASTIC, SOJ-32	0.300 INCH, PLASTIC, SOJ-32	0.300 INCH, PLASTIC, SOJ-32
Contacts	32	32	32	32	32	32
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	3A991.B.2.B	EAR99	3A991.B.2.B	EAR99
Maximum access time	25 ns	35 ns	20 ns	35 ns	20 ns	25 ns
Other features	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDSO-J32	R-PDSO-J32	R-PDSO-J32
JESD-609 code	e0	e0	e0	e0	e0	e0
memory density	294912 bit	294912 bit	294912 bit	294912 bit	294912 bit	294912 bit
Memory IC Type	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM
memory width	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32
word count	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	32KX9	32KX9	32KX9	32KX9	32KX9	32KX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	SOJ	SOJ	SOJ
Encapsulate equivalent code	DIP32,.3	DIP32,.3	DIP32,.3	SOJ32,.34	SOJ32,.34	SOJ32,.34
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A
Minimum standby current	2 V	2 V	2 V	2 V	2 V	2 V
Maximum slew rate	0.06 mA	0.055 mA	0.065 mA	0.055 mA	0.065 mA	0.06 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	J BEND
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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