PC28F256M29EWLD datasheet, PDF

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PC28F256M29EWLD: DescriptionFlash, 16MX16, 100ns, PBGA64, 11 X 13 MM, 1 MM PITCH, GREEN, BGA-64; Categorystorage storage; File Size911KB，75 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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PC28F256M29EWLD Overview

Flash, 16MX16, 100ns, PBGA64, 11 X 13 MM, 1 MM PITCH, GREEN, BGA-64

PC28F256M29EWLD Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Micron Technology
Parts packaging code	BGA
package instruction	11 X 13 MM, 1 MM PITCH, GREEN, BGA-64
Contacts	64
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	100 ns
Spare memory width	8
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B64
JESD-609 code	e1
length	13 mm
memory density	268435456 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	256
Number of terminals	64
word count	16777216 words
character code	16000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	16MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA64,8X8,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
page size	16/32 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.4 mm
Department size	128K
Maximum standby current	0.00021 A
Maximum slew rate	0.031 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
switch bit	YES
type	NOR TYPE
width	11 mm

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256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash

Features

Parallel NOR Flash Embedded Memory

JS28F256M29EWxx, PC28F256M29EWxx, RC28F256M29EWxx

JS28F512M29EWxx, PC28F512M29EWxx, RC28F512M29EWxx

JS28F00AM29EWxx, PC28F00AM29EWxx, RC28F00AM29EWxx

PC28F00BM29EWxx, RC28F00BM29EWxx

Features

• 2Gb = stacked device (two 1Gb die)

• Supply voltage

– V

= 2.7–3.6V (program, erase, read)

– V

CCQ

= 1.65–3.6V (I/O buffers)

• Asynchronous random/page read

– Page size: 16 words or 32 bytes

– Page access: 25ns

– Random access: 100ns (Fortified BGA);

110ns (TSOP)

• Buffer program: 512-word program buffer

• Program time

– 0.88µs per byte (1.14 MB/s) TYP when using full

512-word buffer size in buffer program

• Memory organization

– Uniform blocks: 128-Kbytes or 64-Kwords each

• Program/erase controller

– Embedded byte/word program algorithms

• Program/erase suspend and resume capability

– Read from any block during a PROGRAM SUS-

PEND operation

– Read or program another block during an ERASE

SUSPEND operation

• BLANK CHECK operation to verify an erased block

• Unlock bypass, block erase, chip erase, and write to

buffer capability

– Fast buffered/batch programming

– Fast block/chip erase

• V

/WP# pin protection

– Protects first or last block regardless of block

protection settings

• Software protection

– Volatile protection

– Nonvolatile protection

– Password protection

– Password access

• Extended memory block

– 128-word (256-byte) block for permanent, secure

identification

– Programmed or locked at the factory or by the

customer

• Low power consumption: Standby mode

• JESD47H-compliant

– 100,000 minimum ERASE cycles per block

– Data retention: 20 years (TYP)

• 65nm multilevel cell (MLC) process technology

• Fortified BGA and TSOP packages

• Green packages available

– RoHS-compliant

– Halogen-free

• Operating temperature

– Ambient: –40°C to +85°C

PDF: 09005aef849b4b09

m29ew_256mb_2gb.pdf - Rev. B 8/12 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash

Features

Contents

General Description ......................................................................................................................................... 8

Device Configurability .................................................................................................................................. 9

Signal Assignments ......................................................................................................................................... 10

Signal Descriptions ......................................................................................................................................... 12

Memory Organization .................................................................................................................................... 13

Memory Configuration ............................................................................................................................... 13

Memory Map – 256Mb–2Gb Density ........................................................................................................... 13

Bus Operations ............................................................................................................................................... 14

Read .......................................................................................................................................................... 14

Write .......................................................................................................................................................... 14

Standby ..................................................................................................................................................... 14

Output Disable ........................................................................................................................................... 15

Reset .......................................................................................................................................................... 15

Registers ........................................................................................................................................................ 16

Status Register ............................................................................................................................................ 16

Lock Register .............................................................................................................................................. 21

Standard Command Definitions – Address-Data Cycles .................................................................................... 24

READ and AUTO SELECT Operations .............................................................................................................. 26

READ/RESET Command ............................................................................................................................ 26

READ CFI Command .................................................................................................................................. 26

AUTO SELECT Command ........................................................................................................................... 26

Bypass Operations .......................................................................................................................................... 28

UNLOCK BYPASS Command ...................................................................................................................... 28

UNLOCK BYPASS RESET Command ............................................................................................................ 28

Program Operations ....................................................................................................................................... 29

PROGRAM Command ................................................................................................................................ 29

UNLOCK BYPASS PROGRAM Command ..................................................................................................... 29

WRITE TO BUFFER PROGRAM Command .................................................................................................. 29

UNLOCK BYPASS WRITE TO BUFFER PROGRAM Command ....................................................................... 31

WRITE TO BUFFER PROGRAM CONFIRM Command .................................................................................. 32

BUFFERED PROGRAM ABORT AND RESET Command ................................................................................ 32

PROGRAM SUSPEND Command ................................................................................................................ 32

PROGRAM RESUME Command .................................................................................................................. 33

Erase Operations ............................................................................................................................................ 33

CHIP ERASE Command .............................................................................................................................. 33

UNLOCK BYPASS CHIP ERASE Command ................................................................................................... 33

BLOCK ERASE Command ........................................................................................................................... 34

UNLOCK BYPASS BLOCK ERASE Command ................................................................................................ 34

ERASE SUSPEND Command ....................................................................................................................... 35

ERASE RESUME Command ........................................................................................................................ 35

BLANK CHECK Operation .............................................................................................................................. 35

BLANK CHECK Commands ........................................................................................................................ 35

Block Protection Command Definitions – Address-Data Cycles ........................................................................ 37

Protection Operations .................................................................................................................................... 40

LOCK REGISTER Commands ...................................................................................................................... 40

PASSWORD PROTECTION Commands ....................................................................................................... 40

NONVOLATILE PROTECTION Commands .................................................................................................. 40

NONVOLATILE PROTECTION BIT LOCK BIT Commands ............................................................................ 43

VOLATILE PROTECTION Commands .......................................................................................................... 43

EXTENDED MEMORY BLOCK Commands .................................................................................................. 43

PDF: 09005aef849b4b09

m29ew_256mb_2gb.pdf - Rev. B 8/12 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash

Features

EXIT PROTECTION Command ....................................................................................................................

Device Protection ...........................................................................................................................................

Hardware Protection ..................................................................................................................................

Software Protection ....................................................................................................................................

Volatile Protection Mode .............................................................................................................................

Nonvolatile Protection Mode ......................................................................................................................

Password Protection Mode ..........................................................................................................................

Password Access .........................................................................................................................................

Common Flash Interface ................................................................................................................................

Power-Up and Reset Characteristics ................................................................................................................

Absolute Ratings and Operating Conditions .....................................................................................................

DC Characteristics ..........................................................................................................................................

Read AC Characteristics ..................................................................................................................................

Write AC Characteristics .................................................................................................................................

Accelerated Program, Data Polling/Toggle AC Characteristics ...........................................................................

Program/Erase Characteristics ........................................................................................................................

Package Dimensions .......................................................................................................................................

Additional Resources ......................................................................................................................................

Revision History .............................................................................................................................................

Rev. B – 08/12 .............................................................................................................................................

Rev. A – 04/12 .............................................................................................................................................

PDF: 09005aef849b4b09

m29ew_256mb_2gb.pdf - Rev. B 8/12 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

PC28F256M29EWLD Related Products

	PC28F256M29EWLD	JS28F256M29EWLB	JS28F256M29EWLD	PC28F512M29EWHB	PC28F512M29EWHE	PC28F512M29EWHG	PC28F256M29EWHD	PC28F512M29EWLB	PC28F256M29EWLB	PC28F256M29EWHB
Description	Flash, 16MX16, 100ns, PBGA64, 11 X 13 MM, 1 MM PITCH, GREEN, BGA-64	Flash, 16MX16, 110ns, PDSO56, 14 X 20 MM, GREEN, TSOP-56	Flash, 16MX16, 110ns, PDSO56, 14 X 20 MM, GREEN, TSOP-56	Flash, 32MX16, 100ns, PBGA64, 11 X 13 MM, 1 MM PITCH, GREEN, BGA-64	Flash, 32MX16, 100ns, PBGA64, 11 X 13 MM, 1 MM PITCH, GREEN, BGA-64	Flash, 32MX16, 100ns, PBGA64, 11 X 13 MM, 1 MM PITCH, GREEN, BGA-64	Flash, 16MX16, 100ns, PBGA64, 11 X 13 MM, 1 MM PITCH, GREEN, BGA-64	Flash, 32MX16, 100ns, PBGA64, 11 X 13 MM, 1 MM PITCH, GREEN, BGA-64	Flash, 16MX16, 100ns, PBGA64, 11 X 13 MM, 1 MM PITCH, GREEN, BGA-64	Flash, 16MX16, 100ns, PBGA64, 11 X 13 MM, 1 MM PITCH, GREEN, BGA-64
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
package instruction	11 X 13 MM, 1 MM PITCH, GREEN, BGA-64	TSSOP, TSSOP56,.8,20	14 X 20 MM, GREEN, TSOP-56	LBGA, BGA64,8X8,40	11 X 13 MM, 1 MM PITCH, GREEN, BGA-64	11 X 13 MM, 1 MM PITCH, GREEN, BGA-64	11 X 13 MM, 1 MM PITCH, GREEN, BGA-64	LBGA, BGA64,8X8,40	11 X 13 MM, 1 MM PITCH, GREEN, BGA-64	LBGA, BGA64,8X8,40
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
Maximum access time	100 ns	110 ns	110 ns	100 ns	100 ns	100 ns	100 ns	100 ns	100 ns	100 ns
Spare memory width	8	8	8	8	8	8	8	8	8	8
JESD-30 code	R-PBGA-B64	R-PDSO-G56	R-PDSO-G56	R-PBGA-B64	R-PBGA-B64	R-PBGA-B64	R-PBGA-B64	R-PBGA-B64	R-PBGA-B64	R-PBGA-B64
JESD-609 code	e1	e4	e3	e1	e1	e1	e1	e1	e1	e1
length	13 mm	18.4 mm	18.4 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm
memory density	268435456 bit	268435456 bit	268435456 bit	536870912 bit	536870912 bit	536870912 bit	268435456 bit	536870912 bit	268435456 bit	268435456 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	16	16	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	64	56	56	64	64	64	64	64	64	64
word count	16777216 words	16777216 words	16777216 words	33554432 words	33554432 words	33554432 words	16777216 words	33554432 words	16777216 words	16777216 words
character code	16000000	16000000	16000000	32000000	32000000	32000000	16000000	32000000	16000000	16000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	16MX16	16MX16	16MX16	32MX16	32MX16	32MX16	16MX16	32MX16	16MX16	16MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	TSSOP	TSSOP	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED	260	NOT SPECIFIED	260	260	260	260	260	NOT SPECIFIED
Programming voltage	3 V	3 V	3 V	3 V	2.7 V	3 V	3 V	2.7 V	3 V	3 V
Maximum seat height	1.4 mm	1.2 mm	1.2 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN SILVER COPPER	Nickel/Palladium/Gold (Ni/Pd/Au)	MATTE TIN	Tin/Silver/Copper (Sn/Ag/Cu)	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	GULL WING	GULL WING	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	0.5 mm	0.5 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	DUAL	DUAL	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	30	NOT SPECIFIED	30	NOT SPECIFIED	30	30	30	30	30	NOT SPECIFIED
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	11 mm	14 mm	14 mm	11 mm	11 mm	11 mm	11 mm	11 mm	11 mm	11 mm
Parts packaging code	BGA	TSOP	TSOP	BGA	-	BGA	BGA	-	BGA	BGA
Contacts	64	56	56	64	-	64	64	-	64	64
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	-	3A991.B.1.A	3A991.B.1.A	-	3A991.B.1.A	3A991.B.1.A
command user interface	YES	YES	-	YES	YES	-	YES	YES	YES	YES
Universal Flash Interface	YES	YES	-	YES	YES	-	YES	YES	YES	YES
Data polling	YES	YES	-	YES	YES	-	YES	YES	YES	YES
Number of departments/size	256	256	-	512	512	-	256	512	256	256
Encapsulate equivalent code	BGA64,8X8,40	TSSOP56,.8,20	-	BGA64,8X8,40	BGA64,8X8,40	-	BGA64,8X8,40	BGA64,8X8,40	BGA64,8X8,40	BGA64,8X8,40
page size	16/32 words	16/32 words	-	16/32 words	16/32 words	-	16/32 words	16/32 words	16/32 words	16/32 words
power supply	3/3.3 V	3/3.3 V	-	3/3.3 V	3/3.3 V	-	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ready/busy	YES	YES	-	YES	YES	-	YES	YES	YES	YES
Department size	128K	128K	-	128K	128K	-	128K	128K	128K	128K
Maximum standby current	0.00021 A	0.00021 A	-	0.000225 A	0.000225 A	-	0.00021 A	0.000225 A	0.00021 A	0.00021 A
Maximum slew rate	0.031 mA	0.031 mA	-	0.031 mA	0.031 mA	-	0.031 mA	0.031 mA	0.031 mA	0.031 mA
switch bit	YES	YES	-	YES	YES	-	YES	YES	YES	YES
Base Number Matches	-	1	1	1	1	1	1	1	-	-

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