Fast Page DRAM Module, 4MX8, 80ns, CMOS, SIMM-30
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Micron Technology |
| Parts packaging code | SIMM |
| package instruction | SIMM-30 |
| Contacts | 30 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| access mode | FAST PAGE |
| Maximum access time | 80 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| I/O type | COMMON |
| JESD-30 code | R-XSMA-T30 |
| JESD-609 code | e0 |
| memory density | 33554432 bit |
| Memory IC Type | FAST PAGE DRAM MODULE |
| memory width | 8 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 30 |
| word count | 4194304 words |
| character code | 4000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 4MX8 |
| Output characteristics | 3-STATE |
| Package body material | UNSPECIFIED |
| Encapsulate equivalent code | SIP30 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| refresh cycle | 2048 |
| Maximum seat height | 16.383 mm |
| Maximum standby current | 0.002 A |
| Maximum slew rate | 0.18 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal location | SINGLE |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| MT2D48N-8 | MT2D48N-6 | MT2D48M-8 | MT2D48N-7 | |
|---|---|---|---|---|
| Description | Fast Page DRAM Module, 4MX8, 80ns, CMOS, SIMM-30 | Fast Page DRAM Module, 4MX8, 60ns, CMOS, SIMM-30 | Fast Page DRAM Module, 4MX8, 80ns, CMOS, SIMM-30 | Fast Page DRAM Module, 4MX8, 70ns, CMOS, SIMM-30 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Parts packaging code | SIMM | SIMM | SIMM | SIMM |
| package instruction | SIMM-30 | SIMM-30 | SIMM-30 | SIMM-30 |
| Contacts | 30 | 30 | 30 | 30 |
| Reach Compliance Code | not_compliant | unknown | unknown | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| Maximum access time | 80 ns | 60 ns | 80 ns | 70 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| I/O type | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-XSMA-T30 | R-XSMA-T30 | R-XSMA-N30 | R-XSMA-T30 |
| memory density | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit |
| Memory IC Type | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 |
| Number of terminals | 30 | 30 | 30 | 30 |
| word count | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| character code | 4000000 | 4000000 | 4000000 | 4000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 4MX8 | 4MX8 | 4MX8 | 4MX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| Encapsulate equivalent code | SIP30 | SIP30 | SIM30 | SIP30 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | 225 | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 2048 | 2048 | 2048 | 2048 |
| Maximum seat height | 16.383 mm | 16.383 mm | 15.494 mm | 16.383 mm |
| Maximum standby current | 0.002 A | 0.002 A | 0.002 A | 0.002 A |
| Maximum slew rate | 0.18 mA | 0.24 mA | 0.18 mA | 0.2 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| Terminal location | SINGLE | SINGLE | SINGLE | SINGLE |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| JESD-609 code | e0 | e0 | - | e0 |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
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