WS512K32-85H2QE datasheet, PDF

WS512K32-85H2QE: DescriptionSRAM Module, 2MX8, 85ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66; Categorystorage storage; File Size325KB，12 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

Download Datasheet Parametric View All

WS512K32-85H2QE Overview

SRAM Module, 2MX8, 85ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

Parameter Name	Attribute value
Maker	White Electronic Designs Corporation
package instruction	1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Code	unknown
Maximum access time	85 ns
Other features	CONFIGURABLE AS 512K X 32 OR 1024K X 16
JESD-30 code	S-CPGA-P66
length	35.2 mm
memory density	16777216 bit
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of terminals	66
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2MX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.7 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
width	35.2 mm

Design of protection circuit for ESD diode inside MAX2140: When hot-swapping (applying power or disconnecting power) the MAX2140 SDARS receiver, its internal electrostatic discharge (ESD) protection diode may fail. Hot-swapping is not a standard operation for...; 黑衣人 Energy Infrastructure?

Brothers, please help Xiaodi.: Can the active crystal oscillator be divided? The crystal oscillator of the clock chip DS1302 needs to be connected to 32768HZ! There are none for sale!! I have to divide the frequency!...; hezhiwen MCU

Hardware Development Process and Specifications---Chapter 1 Overview: Chapter 1 Overview Section 1 Introduction to the Hardware Development Process § 1.1.1 Basic process of hardware development The basic process of hardware development: 1. Clarify the overall hardware r...; chenky Embedded System

Choose VHDL or Verilog HDL?: Choose VHDL or Verilog HDL? Before you choose, it is necessary to briefly introduce their general names: Hardware Description Language HDL (Hardware Describe Language) HDL Overview With the developmen...; eeleader FPGA/CPLD

MSP43-F149 ADC12 high frequency sampling problem: The manual says that the sampling frequency of 430F149 can be up to 200K. Is it configured by setting SHTO and SHT1? In addition, the pulse sampling mode is triggered by TIMEA-OUT1? I want to achieve ...; 天空一 stm32/stm8

PRU controller for c2000: The PRU includes two independent real-time RISC cores (only about 40 instructions, for logic, arithmetic and flow control, etc.), which can be software-programmed to implement peripherals, access GPIO...; Jacktang Microcontroller MCU

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components