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Am29LV800BT70RWBEB

Description
512K X 16 FLASH 3V PROM, 120 ns, PDSO48
Categorystorage   
File Size294KB,42 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric View All

Am29LV800BT70RWBEB Overview

512K X 16 FLASH 3V PROM, 120 ns, PDSO48

Am29LV800BT70RWBEB Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals48
Maximum operating temperature70 Cel
Minimum operating temperature0.0 Cel
Maximum supply/operating voltage3.6 V
Minimum supply/operating voltage2.7 V
Rated supply voltage3 V
maximum access time120 ns
Processing package descriptionMO-142DD, TSOP-48
stateTRANSFERRED
CraftsmanshipCMOS
packaging shapeRECTANGULAR
Package SizeSMALL OUTLINE, THIN PROFILE
surface mountYes
Terminal formGULL WING
Terminal spacing0.5000 mm
Terminal locationDUAL
Packaging MaterialsPLASTIC/EPOXY
Temperature levelCOMMERCIAL
memory width16
organize512K X 16
storage density1.68E7 deg
operating modeASYNCHRONOUS
Number of digits1.05E6 words
Number of digits512K
Spare memory width8
Memory IC typeFLASH 3V PROM
serial parallelPARALLEL
PRELIMINARY
Am29LV800B
8 Megabit (1 M x 8-Bit/512 K x 16-Bit)
CMOS 3.0 Volt-only Boot Sector Flash Memory
DISTINCTIVE CHARACTERISTICS
s
Single power supply operation
— Full voltage range: 2.7 to 3.6 volt read and write
operations for battery-powered applications
— Regulated voltage range: 3.0 to 3.6 volt read
and write operations and for compatibility with
high performance 3.3 volt microprocessors
s
Manufactured on 0.35 µm process technology
— Compatible with 0.5 µm Am29LV800 device
s
High performance
— Full voltage range: access times as fast as 80 ns
— Regulated voltage range: access times as fast
as 70 ns
s
Ultra low power consumption (typical values at
5 MHz)
— 200 nA Automatic Sleep mode current
— 200 nA standby mode current
— 7 mA read current
— 15 mA program/erase current
s
Flexible sector architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
fifteen 64 Kbyte sectors (byte mode)
— One 8 Kword, two 4 Kword, one 16 Kword, and
fifteen 32 Kword sectors (word mode)
— Supports full chip erase
— Sector Protection features:
A hardware method of locking a sector to
prevent any program or erase operations within
that sector
Sectors can be locked in-system or via
programming equipment
Temporary Sector Unprotect feature allows code
changes in previously locked sectors
s
Unlock Bypass Program Command
— Reduces overall programming time when
issuing multiple program command sequences
s
Top or bottom boot block configurations
available
s
Embedded Algorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies data at specified addresses
s
Minimum 1,000,000 write cycle guarantee per
sector
s
Package option
— 48-ball FBGA
— 48-pin TSOP
— 44-pin SO
s
Compatibility with JEDEC standards
— Pinout and software compatible with single-
power supply Flash
— Superior inadvertent write protection
s
Data# Polling and toggle bits
— Provides a software method of detecting
program or erase operation completion
s
Ready/Busy# pin (RY/BY#)
— Provides a hardware method of detecting
program or erase cycle completion
s
Erase Suspend/Erase Resume
— Suspends an erase operation to read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation
s
Hardware reset pin (RESET#)
— Hardware method to reset the device to reading
array data
This document contains information on a product under development at Advanced Micro Devices. The information
is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed
product without notice.
Publication#
21490
Rev:
E
Amendment/+1
Issue Date:
March 1998
Refer to AMD’s Website (www.amd.com) for the latest information.

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