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IS64LV6416L-12TA3

Description
64KX16 STANDARD SRAM, 12ns, PDSO44, PLASTIC, TSOP2-44
Categorystorage    storage   
File Size85KB,14 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
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IS64LV6416L-12TA3 Overview

64KX16 STANDARD SRAM, 12ns, PDSO44, PLASTIC, TSOP2-44

IS64LV6416L-12TA3 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeTSOP2
package instructionPLASTIC, TSOP2-44
Contacts44
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Maximum access time12 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G44
JESD-609 codee0
length18.415 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals44
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize64KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Encapsulate equivalent codeTSOP44,.46,32
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply3.3 V
Certification statusNot Qualified
Filter levelAEC-Q100
Maximum seat height1.2 mm
Maximum standby current0.005 A
Minimum standby current2 V
Maximum slew rate0.115 mA
Maximum supply voltage (Vsup)3.63 V
Minimum supply voltage (Vsup)2.97 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperature10
width10.16 mm

IS64LV6416L-12TA3 Preview

IS64LV6416L
64K x 16 HIGH-SPEED CMOS STATIC
RAM WITH 3.3V SUPPLY
FEATURES
• High-speed access time: 10, 12 ns
• CMOS low power operation:
250 mW (typical) operating
250 µW (typical) standby
• TTL compatible interface levels
• Single 3.3V power supply
• Fully static operation: no clock or refresh
required
• Three state outputs
• Data control for upper and lower bytes
• Industrial temperature available
• Temperature offerings:
Option A1: –40
o
C to +85
o
C
Option A2: –40
o
C to +105
o
C
Option A3: –40
o
C to +125
o
C
ISSI
MAY 2003
®
DESCRIPTION
The
ISSI
IS64LV6416L is a high-speed, 1,048,576-bit
static RAM organized as 65,536 words by 16 bits. It is
fabricated using
ISSI
's high-performance CMOS
technology. This highly reliable process coupled with
innovative circuit design techniques, yields access times
as fast as 10 ns with low power consumption.
When
CE
is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be
reduced down with CMOS input levels.
Easy memory expansion is provided by using Chip
Enable and Output Enable inputs,
CE
and
OE.
The active
LOW Write Enable (WE) controls both writing and reading
of the memory. A data byte allows Upper Byte (UB) and
Lower Byte (LB) access.
The IS64LV6416L is packaged in the JEDEC standard
44-pin TSOP-II, and 48-pin mini BGA (6mm x 8mm).
FUNCTIONAL BLOCK DIAGRAM
A0-A15
DECODER
64K x 16
MEMORY ARRAY
V
DD
GND
I/O0-I/O7
Lower Byte
I/O8-I/O15
Upper Byte
I/O
DATA
CIRCUIT
COLUMN I/O
CE
OE
WE
UB
LB
CONTROL
CIRCUIT
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability
arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any
published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. C
05/02/03
1
IS64LV6416L
PIN CONFIGURATIONS
44-Pin TSOP-II (T)
ISSI
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A0
A1
A2
OE
UB
LB
I/O15
I/O14
I/O13
I/O12
GND
V
DD
I/O11
I/O10
I/O9
I/O8
NC
A3
A4
A5
A6
NC
®
A15
A14
A13
A12
A11
CE
I/O0
I/O1
I/O2
I/O3
V
DD
GND
I/O4
I/O5
I/O6
I/O7
WE
A10
A9
A8
A7
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
48-Pin mini BGA (6mm x 8mm) (B)
1
2
3
4
5
6
PIN DESCRIPTIONS
A0-A15
I/O0-I/O15
CE
OE
WE
Address Inputs
Data Inputs/Outputs
Chip Enable Input
Output Enable Input
Write Enable Input
Lower-byte Control (I/O0-I/O7)
Upper-byte Control (I/O8-I/O15)
No Connection
Power
Ground
A
B
C
D
E
F
G
H
LB
I/O
8
I/O
9
GND
V
DD
I/O
14
I/O
15
NC
OE
UB
I/O
10
I/O
11
I/O
12
I/O
13
NC
A8
A0
A3
A5
NC
NC
A14
A12
A9
A1
A4
A6
A7
NC
A15
A13
A10
A2
CE
I/O
1
I/O
3
I/O
4
I/O
5
WE
A11
NC
I/O
0
I/O
2
V
DD
GND
I/O
6
I/O
7
NC
LB
UB
NC
V
DD
GND
2
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. C
05/02/03
IS64LV6416L
TRUTH TABLE
Mode
Not Selected
Output Disabled
Read
WE
X
H
X
H
H
H
L
L
L
CE
H
L
L
L
L
L
L
L
L
OE
X
H
X
L
L
L
X
X
X
LB
X
X
H
L
H
L
L
H
L
UB
X
X
H
H
L
L
H
L
L
I/O PIN
I/O0-I/O7
I/O8-I/O15
High-Z
High-Z
High-Z
D
OUT
High-Z
D
OUT
D
IN
High-Z
D
IN
High-Z
High-Z
High-Z
High-Z
D
OUT
D
OUT
High-Z
D
IN
D
IN
ISSI
V
DD
Current
I
SB
1
, I
SB
2
I
CC
I
CC
®
1
2
3
4
Write
I
CC
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
V
TERM
T
STG
P
T
I
OUT
Parameter
Terminal Voltage with Respect to GND
Storage Temperature
Power Dissipation
DC Output Current (LOW)
Value
–0.5 to V
DD
+0.5
–65 to +150
1.5
20
Unit
V
°C
W
mA
5
6
7
8
9
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
OPERATING RANGE
Options
A1
A2
A3
Ambient Temperature
–40°C to +85°C
–40°C to +105°C
–40°C to +125°C
V
DD
3.3V ± 10%
3.3V ± 10%
3.3V ± 10%
DC ELECTRICAL CHARACTERISTICS
(Over Operating Range)
Symbol
V
OH
V
OL
V
IH
V
IL
I
LI
I
LO
Parameter
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
(1)
Input Leakage
Output Leakage
GND
V
IN
V
DD
GND
V
OUT
V
DD
, Outputs Disabled
Test Conditions
V
DD
= Min., I
OH
= –4.0 mA
V
DD
= Min., I
OL
= 8.0 mA
A1, A2
A3
Options
Min.
2.4
2
–0.3
–2
–2
Max.
0.4
0.5
V
DD
+ 0.3
0.8
2
2
Unit
V
V
V
V
V
µA
µA
10
11
12
Notes:
1. V
IL
(min.) = –2.0V for pulse width less than 10 ns.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. C
05/02/03
3
IS64LV6416L
POWER SUPPLY CHARACTERISTICS
(1)
(Over Operating Range)
Symbol Parameter
I
CC
V
DD
Dynamic Operating
Supply Current
TTL Standby Current
(TTL Inputs)
CMOS Standby
Current (CMOS Inputs)
Test Conditions
V
DD
= Max.,
I
OUT
= 0 mA, f = f
MAX
V
DD
= Max.,
V
IN
= V
IH
or V
IL
CE
V
IH
, f = 0
V
DD
= Max.,
CE
V
DD
– 0.2V,
V
IN
V
DD
– 0.2V, or
V
IN
0.2V, f = 0
A1
A2
A3
A1
A2
A3
A1
A2
A3
typ
(2)
-10 ns
Min. Max.
95
15
2
0.5
-12 ns
Min. Max.
105
115
18
20
3
5
0.5
ISSI
Unit
mA
®
I
SB
1
mA
I
SB
2
mA
Note:
1. At f = f
MAX
, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
2. Typical values are measured at V
DD
= 3.3V, T
A
= 25
o
C and not 100% tested.
CAPACITANCE
(1)
Symbol
C
IN
C
OUT
Parameter
Input Capacitance
Input/Output Capacitance
Conditions
V
IN
= 0V
V
OUT
= 0V
Max.
6
8
Unit
pF
pF
Note:
1. Tested initially and after any design or process changes that may affect these parameters.
4
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. C
05/02/03
IS64LV6416L
AC TEST CONDITIONS
Parameter
Input Pulse Level
Input Rise and Fall Times
Input and Output Timing
and Reference Level
Output Load
Unit
0V to 3.0V
3 ns
1.5V
See Figures 1a and 1b
ISSI
®
1
2
3
AC TEST LOADS
319
3.3V
3.3V
319
4
353
OUTPUT
30 pF
Including
jig and
scope
353
OUTPUT
5 pF
Including
jig and
scope
5
6
7
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Figure 1a.
Figure 1b.
READ CYCLE SWITCHING CHARACTERISTICS
(Over Operating Range)
Symbol
Parameter
Read Cycle Time
Address Access Time
Output Hold Time
CE
Access Time
OE
Access Time
OE
to High-Z Output
OE
to Low-Z Output
CE
to High-Z Output
CE
to Low-Z Output
LB, UB
Access Time
LB, UB
to High-Z Output
LB, UB
to Low-Z Output
-10 ns
Min. Max.
10
3
0
0
3
0
0
10
10
5
5
5
6
5
-12 ns
Min. Max.
12
3
0
0
3
0
0
12
12
6
6
6
6
6
(1)
t
RC
t
AA
t
OHA
t
ACE
t
DOE
t
HZOE
(2)
t
LZOE
(2)
t
HZCE
(2
t
LZCE
(2)
t
BA
t
HZB
t
LZB
8
9
10
11
12
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and
output loading specified in Figure 1a.
2. Tested with the load in Figure 1b. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. C
05/02/03
5

IS64LV6416L-12TA3 Related Products

IS64LV6416L-12TA3 IS64LV6416L-10TA1 IS64LV6416L-12TA2
Description 64KX16 STANDARD SRAM, 12ns, PDSO44, PLASTIC, TSOP2-44 64KX16 STANDARD SRAM, 10ns, PDSO44, PLASTIC, TSOP2-44 64KX16 STANDARD SRAM, 12ns, PDSO44, PLASTIC, TSOP2-44
Is it lead-free? Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible
Maker Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Parts packaging code TSOP2 TSOP2 TSOP2
package instruction PLASTIC, TSOP2-44 PLASTIC, TSOP2-44 PLASTIC, TSOP2-44
Contacts 44 44 44
Reach Compliance Code compliant compliant compliant
ECCN code 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B
Maximum access time 12 ns 10 ns 12 ns
I/O type COMMON COMMON COMMON
JESD-30 code R-PDSO-G44 R-PDSO-G44 R-PDSO-G44
JESD-609 code e0 e0 e0
length 18.415 mm 18.415 mm 18.415 mm
memory density 1048576 bit 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 16 16 16
Number of functions 1 1 1
Number of terminals 44 44 44
word count 65536 words 65536 words 65536 words
character code 64000 64000 64000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 85 °C 105 °C
Minimum operating temperature -40 °C -40 °C -40 °C
organize 64KX16 64KX16 64KX16
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 TSOP2 TSOP2
Encapsulate equivalent code TSOP44,.46,32 TSOP44,.46,32 TSOP44,.46,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified
Filter level AEC-Q100 AEC-Q100 AEC-Q100
Maximum seat height 1.2 mm 1.2 mm 1.2 mm
Maximum standby current 0.005 A 0.002 A 0.003 A
Minimum standby current 2 V 2 V 2 V
Maximum slew rate 0.115 mA 0.095 mA 0.105 mA
Maximum supply voltage (Vsup) 3.63 V 3.63 V 3.63 V
Minimum supply voltage (Vsup) 2.97 V 2.97 V 2.97 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level AUTOMOTIVE INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING
Terminal pitch 0.8 mm 0.8 mm 0.8 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature 10 NOT SPECIFIED NOT SPECIFIED
width 10.16 mm 10.16 mm 10.16 mm
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