HX84050EHT datasheet, PDF - EEWORLD Datasheet

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HX84050EHT: DescriptionSRAM Module, 128KX40, 30ns, CMOS, CQFP200, 2.100 X 2.100 INCH, CERAMIC, QFP-200; Categorystorage storage; File Size578KB，12 Pages; ManufacturerHoneywell; Websitehttp://www.ssec.honeywell.com/

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SRAM Module, 128KX40, 30ns, CMOS, CQFP200, 2.100 X 2.100 INCH, CERAMIC, QFP-200

HX84050EHT Parametric

Parameter Name	Attribute value
Maker	Honeywell
Parts packaging code	QFP
package instruction	GQFF,
Contacts	200
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	30 ns
JESD-30 code	S-CQFP-F200
length	53.34 mm
memory density	5242880 bit
Memory IC Type	SRAM MODULE
memory width	40
Number of functions	1
Number of ports	1
Number of terminals	200
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX40
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	GQFF
Package shape	SQUARE
Package form	FLATPACK, GUARD RING
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	0.9 mm
Terminal location	QUAD
width	53.34 mm

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Description	SRAM Module, 128KX40, 30ns, CMOS, CQFP200, 2.100 X 2.100 INCH, CERAMIC, QFP-200	SRAM Module, 128KX40, 30ns, CMOS, CQFP200, 2.100 X 2.100 INCH, CERAMIC, QFP-200	SRAM Module, 128KX40, 30ns, CMOS, CQFP200, 2.100 X 2.100 INCH, CERAMIC, QFP-200	SRAM Module, 128KX40, 30ns, CMOS, CQFP200, 2.100 X 2.100 INCH, CERAMIC, QFP-200	SRAM Module, 128KX40, 30ns, CMOS, CQFP200, 2.100 X 2.100 INCH, CERAMIC, QFP-200	SRAM Module, 128KX40, 30ns, CMOS, CQFP200, 2.100 X 2.100 INCH, CERAMIC, QFP-200	SRAM Module, 128KX40, 30ns, CMOS, CQFP200, 2.100 X 2.100 INCH, CERAMIC, QFP-200	SRAM Module, 128KX40, 30ns, CMOS, CQFP200, 2.100 X 2.100 INCH, CERAMIC, QFP-200	SRAM Module, 128KX40, 30ns, CMOS, CQFP200, 2.100 X 2.100 INCH, CERAMIC, QFP-200	SRAM Module, 128KX40, 30ns, CMOS, CQFP200, 2.100 X 2.100 INCH, CERAMIC, QFP-200
Parts packaging code	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	GQFF,	GQFF,	GQFF,	GQFF,	GQFF,	GQFF,	GQFF,	GQFF,	GQFF,	GQFF,
Contacts	200	200	200	200	200	200	200	200	200	200
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns
JESD-30 code	S-CQFP-F200	S-CQFP-F200	S-CQFP-F200	S-CQFP-F200	S-CQFP-F200	S-CQFP-F200	S-CQFP-F200	S-CQFP-F200	S-CQFP-F200	S-CQFP-F200
length	53.34 mm	53.34 mm	53.34 mm	53.34 mm	53.34 mm	53.34 mm	53.34 mm	53.34 mm	53.34 mm	53.34 mm
memory density	5242880 bit	5242880 bit	5242880 bit	5242880 bit	5242880 bit	5242880 bit	5242880 bit	5242880 bit	5242880 bit	5242880 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	40	40	40	40	40	40	40	40	40	40
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1	1
Number of terminals	200	200	200	200	200	200	200	200	200	200
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	128KX40	128KX40	128KX40	128KX40	128KX40	128KX40	128KX40	128KX40	128KX40	128KX40
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	GQFF	GQFF	GQFF	GQFF	GQFF	GQFF	GQFF	GQFF	GQFF	GQFF
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, GUARD RING	FLATPACK, GUARD RING	FLATPACK, GUARD RING	FLATPACK, GUARD RING	FLATPACK, GUARD RING	FLATPACK, GUARD RING	FLATPACK, GUARD RING	FLATPACK, GUARD RING	FLATPACK, GUARD RING	FLATPACK, GUARD RING
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT
Terminal pitch	0.9 mm	0.9 mm	0.9 mm	0.9 mm	0.9 mm	0.9 mm	0.9 mm	0.9 mm	0.9 mm	0.9 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
width	53.34 mm	53.34 mm	53.34 mm	53.34 mm	53.34 mm	53.34 mm	53.34 mm	53.34 mm	53.34 mm	53.34 mm
Maker	Honeywell	Honeywell	Honeywell	-	-	-	-	Honeywell	Honeywell	Honeywell
Base Number Matches	-	1	1	1	1	1	1	-	-	-

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