CA91C142B-33IB datasheet, PDF - EEWORLD Datasheet

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CA91C142B-33IB: DescriptionVME Bus Controller, CMOS, CBGA361, 25 X 25 MM, CERAMIC, BGA-361; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，428 Pages; ManufacturerTundra Semiconductor Corp

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CA91C142B-33IB Overview

VME Bus Controller, CMOS, CBGA361, 25 X 25 MM, CERAMIC, BGA-361

CA91C142B-33IB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Tundra Semiconductor Corp
package instruction	25 X 25 MM, CERAMIC, BGA-361
Reach Compliance Code	unknown
Address bus width	64
Bus compatibility	PCI
maximum clock frequency	33 MHz
Maximum data transfer rate	70 MBps
External data bus width	64
JESD-30 code	S-CBGA-B361
Number of terminals	361
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal location	BOTTOM
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, VME

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TitlePage - 80A3010_MA001_03

Universe II

™

VME-to-PCI Bus Bridge Manual

User Manual

Document Number: 80A3010_MA001_03

Document Status: Final

Release Date: November 2002

This document discusses the features, capabilities, and

configuration requirements of the Universe II. It is intended for

hardware and software engineers who are designing system

interconnect applications with the Universe II.

Tundra Semiconductor Corporation

CA91C142B-33IB Related Products

	CA91C142B-33IB	CA91C142B-33IE	CA91C142D-25EE	CA91C142B-25EE	CA91C142D-33IE	CA91C142D-33CE	CA91C142B-33CE	CA91C142B-33CB	CA91C142B-25EB
Description	VME Bus Controller, CMOS, CBGA361, 25 X 25 MM, CERAMIC, BGA-361	VME Bus Controller, CMOS, PBGA313, 35 X 35 MM, PLASTIC, BGA-313	VME Bus Controller, CMOS, PBGA313, 35 X 35 MM, PLASTIC, BGA-313	VME Bus Controller, CMOS, PBGA313, 35 X 35 MM, PLASTIC, BGA-313	VME Bus Controller, CMOS, PBGA313, 35 X 35 MM, PLASTIC, BGA-313	VME Bus Controller, CMOS, PBGA313, 35 X 35 MM, PLASTIC, BGA-313	VME Bus Controller, CMOS, PBGA313, 35 X 35 MM, PLASTIC, BGA-313	VME Bus Controller, CMOS, CBGA361, 25 X 25 MM, CERAMIC, BGA-361	VME Bus Controller, CMOS, CBGA361, 25 X 25 MM, CERAMIC, BGA-361
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Tundra Semiconductor Corp	Tundra Semiconductor Corp	Tundra Semiconductor Corp	Tundra Semiconductor Corp	Tundra Semiconductor Corp	Tundra Semiconductor Corp	Tundra Semiconductor Corp	Tundra Semiconductor Corp	Tundra Semiconductor Corp
package instruction	25 X 25 MM, CERAMIC, BGA-361	35 X 35 MM, PLASTIC, BGA-313	35 X 35 MM, PLASTIC, BGA-313	35 X 35 MM, PLASTIC, BGA-313	35 X 35 MM, PLASTIC, BGA-313	35 X 35 MM, PLASTIC, BGA-313	35 X 35 MM, PLASTIC, BGA-313	25 X 25 MM, CERAMIC, BGA-361	25 X 25 MM, CERAMIC, BGA-361
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
Address bus width	64	64	64	64	64	64	64	64	64
Bus compatibility	PCI	PCI	PCI	PCI	PCI	PCI	PCI	PCI	PCI
maximum clock frequency	33 MHz	33 MHz	25 MHz	25 MHz	33 MHz	33 MHz	33 MHz	33 MHz	25 MHz
Maximum data transfer rate	70 MBps	70 MBps	70 MBps	70 MBps	70 MBps	70 MBps	70 MBps	70 MBps	70 MBps
External data bus width	64	64	64	64	64	64	64	64	64
JESD-30 code	S-CBGA-B361	S-PBGA-B313	S-PBGA-B313	S-PBGA-B313	S-PBGA-B313	S-PBGA-B313	S-PBGA-B313	S-CBGA-B361	S-CBGA-B361
Number of terminals	361	313	313	313	313	313	313	361	361
Maximum operating temperature	85 °C	85 °C	125 °C	125 °C	85 °C	70 °C	70 °C	70 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-55 °C	-55 °C	-40 °C	-	-	-	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	BGA	IBGA	IBGA	IBGA	IBGA	IBGA	IBGA	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY, INTERSTITIAL PITCH	GRID ARRAY, INTERSTITIAL PITCH	GRID ARRAY, INTERSTITIAL PITCH	GRID ARRAY, INTERSTITIAL PITCH	GRID ARRAY, INTERSTITIAL PITCH	GRID ARRAY, INTERSTITIAL PITCH	GRID ARRAY	GRID ARRAY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, VME	BUS CONTROLLER, VME	BUS CONTROLLER, VME	BUS CONTROLLER, VME	BUS CONTROLLER, VME	BUS CONTROLLER, VME	BUS CONTROLLER, VME	BUS CONTROLLER, VME	BUS CONTROLLER, VME
length	-	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm	-	-
Maximum seat height	-	3.5 mm	3.5 mm	3.5 mm	3.5 mm	3.5 mm	3.5 mm	-	-
Terminal pitch	-	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	-	-
width	-	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm	-	-

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